Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L36.6x6C
36 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 4/10
4X 4.0
6.00
36X 0.50
A
B
28
6
PIN 1
INDEX AREA
36
27
6
PIN #1
INDEX AREA
6.00
1
4 .10 ± 0.10
9
19
(4X)
0.15
18
10
TOP VIEW
36X 0.60 ± 0.10
36X 0.25 4
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
MAX 1.00
C
0.08 C
( 5. 60 TYP )
( 36 X 0 . 50 )
SIDE VIEW
(
4. 10 )
(36X 0.25 )
C
( 36X 0.80 )
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
JEDEC reference drawing: MO-220VJJD.
either a mold or mark feature.
1