Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L40.6x6C
40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETTABLE FLANK)
Rev 1, 1/14
2X
A
0.10 C A
6.00
0.10 M C A B
4.5
2X
5.75
N
PIN#1 ID
R0.20
4x 0.42 ± 0.18
N
0.10 C B
0.45
5
0.60 DIA.
1
2
3
1
2
3
4x 0.42 ± 0.18
5.75
4.5
6.00
CC
0.10 M C A B
(0.35)
0.40 ± 0.10
0.15 ± 0.10
(0.35)
0.10 C B
2X
B
0.10 C A
2X
TOP VIEW
0.25 ± 0.05
0.10 M C A B
0.05 M C
0.50
BOTTOM VIEW
6
0.10 C
0.85 ± 0.05
0.05 C
0.15 ± 0.05
0.01 ± 0.04
0.25 ± 0.05
0.65 ± 0.05
4
0.25 ± 0.05
0.20
0.01 ± 0.04
0.01 ± 0.04
0.10 ± 0.05
SECTION “C-C”
DETAIL “A”
SCALE: NONE
SCALE: NONE
SEE
DETAIL "A"
NOTES:
θ12° MAX
C
SEATING
PLANE
SIDE VIEW
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the plated terminal and is measured
5.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
6.
Reference document: JEDEC MO220
between 0.15mm and 0.30mm from the terminal tip.
36x (0.50)
either a mold or mark feature.
(5.80) SQ
(4.50) SQ
40x (0.25)
40x (0.60)
TYPICAL RECOMMENDED LAND PATTERN
1