Plastic Packages for Integrated Circuits Package Outline Drawing L40.6x6C 40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETTABLE FLANK) Rev 1, 1/14 2X A 0.10 C A 6.00 0.10 M C A B 4.5 2X 5.75 N PIN#1 ID R0.20 4x 0.42 ± 0.18 N 0.10 C B 0.45 5 0.60 DIA. 1 2 3 1 2 3 4x 0.42 ± 0.18 5.75 4.5 6.00 CC 0.10 M C A B (0.35) 0.40 ± 0.10 0.15 ± 0.10 (0.35) 0.10 C B 2X B 0.10 C A 2X TOP VIEW 0.25 ± 0.05 0.10 M C A B 0.05 M C 0.50 BOTTOM VIEW 6 0.10 C 0.85 ± 0.05 0.05 C 0.15 ± 0.05 0.01 ± 0.04 0.25 ± 0.05 0.65 ± 0.05 4 0.25 ± 0.05 0.20 0.01 ± 0.04 0.01 ± 0.04 0.10 ± 0.05 SECTION “C-C” DETAIL “A” SCALE: NONE SCALE: NONE SEE DETAIL "A" NOTES: θ12° MAX C SEATING PLANE SIDE VIEW 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the plated terminal and is measured 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 6. Reference document: JEDEC MO220 between 0.15mm and 0.30mm from the terminal tip. 36x (0.50) either a mold or mark feature. (5.80) SQ (4.50) SQ 40x (0.25) 40x (0.60) TYPICAL RECOMMENDED LAND PATTERN 1