Plastic Packages for Integrated Circuits Package Outline Drawing L38.5x7C 38 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 3/12 38x 0.40 ±0.05 5.00 3.50 A 6 EXP PAD B 6 PIN 1 INDEX AREA 7.00 PIN 1 INDEX AREA (2X) 5.50 5.50 EXP PAD 0.10 TOP VIEW 0.10 M C A B 38x 0.25 ±0.05 4 34x 0.50 BSC (38X 0.60) 3.00 (3.50) BOTTOM VIEW SEE DETAIL "X" MAX 0.80 0.10 C C SEATING PLANE 0.05 C (5.50) (38X 0.25) SIDE VIEW (6.80) 5 C (34x 0.50) (0.20) 0.00 - 0.05 DETAIL "X" (3.00) (4.80) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 Angular: ±2.50° 4. Dimension applies to the metallized terminal and is measured between 0.015mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. 1 JEDEC reference drawing: MO-220.