Plastic Packages for Integrated Circuits Dual Flat No-Lead Plastic Package (DFN) 2X L8.3x3C 0.15 C A A 8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE D 2X MILLIMETERS 0.15 C B E SYMBOL MIN 0.80 0.90 1.00 - - - 0.05 - 0.38 5,8 2.40 7,8 1.60 7,8 0.20 REF 0.23 D D2 B SIDE VIEW A3 D2 (DATUM B) 6 INDEX AREA 0.08 C 7 - 1.50 - 0.65 BSC - k 0.20 - - - L 0.20 0.30 0.40 8 N 8 Nd 4 2 3 Rev. 0 6/04 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2 2. N is the number of terminals. NX k 3. Nd refers to the number of terminals on D. 4. All dimensions are in millimeters. Angles are in degrees. (DATUM A) E2 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. E2/2 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX L N N-1 NX b e 8 5 (Nd-1)Xe REF. 0.10 M C A B BOTTOM VIEW CL NX (b) 2.30 8 D2/2 1 - 3.00 BSC 1.35 e A C SEATING PLANE 0.10 C E2 0.30 3.00 BSC 2.15 E // NOTES A b TOP VIEW MAX A1 A3 6 INDEX AREA NOMINAL (A1) L 5 SECTION "C-C" C C e TERMINAL TIP FOR EVEN TERMINAL/SIDE 1 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389.