l8.3x3c: 8 Lead Dual Flat No-lead Plastic Package

Plastic Packages for Integrated Circuits
Dual Flat No-Lead Plastic Package (DFN)
2X
L8.3x3C
0.15 C A
A
8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
D
2X
MILLIMETERS
0.15 C B
E
SYMBOL
MIN
0.80
0.90
1.00
-
-
-
0.05
-
0.38
5,8
2.40
7,8
1.60
7,8
0.20 REF
0.23
D
D2
B
SIDE VIEW
A3
D2
(DATUM B)
6
INDEX
AREA
0.08 C
7
-
1.50
-
0.65 BSC
-
k
0.20
-
-
-
L
0.20
0.30
0.40
8
N
8
Nd
4
2
3
Rev. 0 6/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2
2. N is the number of terminals.
NX k
3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
(DATUM A)
E2
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
E2/2
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
NX L
N
N-1
NX b
e
8
5
(Nd-1)Xe
REF.
0.10 M C A B
BOTTOM VIEW
CL
NX (b)
2.30
8
D2/2
1
-
3.00 BSC
1.35
e
A
C
SEATING
PLANE
0.10 C
E2
0.30
3.00 BSC
2.15
E
//
NOTES
A
b
TOP VIEW
MAX
A1
A3
6
INDEX
AREA
NOMINAL
(A1)
L
5
SECTION "C-C"
C C
e
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
1
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.