Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L20.4x4E
20 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 4/10
4X 2.00
4.00
16X 0.50
A
B
16
6
PIN 1
INDEX AREA
6
PIN #1
INDEX AREA
20
1
4.00
15
2 . 60
11
(4X)
5
0.15
6
10
TOP VIEW
0.10 M C A B
20X 0 . 40 ±0.10
4 0.23 +0.07/- 0.05
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0.75
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
(3.8 TYP) (
( 16X 0 . 50 )
2 . 60 )
C
( 20X 0 . 23 )
( 20 X 0 . 60 )
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
JEDEC reference drawing: MO-229.
either a mold or mark feature.
1