Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L24.4x5C
24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 10/07
4.00
PIN 1
A
2.65
24X0.40
PIN #1 INDEX AREA
CHAMFER 0.400
× X 45°
INDEX AREA
B
6
20
24
6
1
0.50
19
5.00
3.65
0.5x6=3.00 REF
7
13
12
0.10
8
0.23±0.05
4X
0.50
TOP VIEW
0.10 M C A B
0.5x4=2.00 REF
BOTTOM VIEW
SEE DETAIL X''
0.10 C
C
0.75
SEATING PLANE
0.08 C
(24x0.25)
SIDE VIEW
(4.80 TYP)
(3.65)
(20x0.50)
0 . 20 REF
5
C
(24x0.60)
(2.65)
(3.80 TYP)
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.18mm and 0.28mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1