TVS Diode Arrays (SPA®® Diodes) General Purpose Protection - SP1013 Series SP1013 Series 30pF 30kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP1013 includes back-to-back Zener diodes which provides protection for electronic equipment that may experience destructive electrostatic discharges (ESD). It measures 0.52 x 0.27mm permitting use of the standard 0201 footprints, but offering a 30% reduction in occupied board space. The SP1013 can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation, and the back-to-back configuration provides symmetrical standoff voltage which makes the component appropriate for use when AC signals are present on the data or signal line. Pinout Features 0201 Flipchip 1 2 Pin1 Pin2 • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Low capacitance of 30pF (@ VR=0V) • EFT, IEC61000-4-4, 40A (5/50ns) • Low leakage current of 5nA at 1.5V • Lightning, IEC61000-4-5, 8A (tP=8/20μs) Note: Drawing not to scale Functional Block Diagram 1 Applications 2 • Mobile Phones • Digital Cameras • Smart Phones • MP3/PMP • Tablets • Wearable Technology • Portable Navigation Devices • Portable Medical • Point of Sale Terminals Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/01/15 SP1013 Series 1 547 TVS Diode Arrays (SPA®® Diodes) General Purpose Protection - SP1013 Series Absolute Maximum Ratings Symbol Parameter Value 8.0 Units IPP Peak Current (tp=8/20μs) TOP Operating Temperature -40 to 125 °C A TSTOR Storage Temperature -55 to 150 °C 1 Notes: 1. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Reverse Breakdown Voltage Symbol Test Conditions VRWM Min IR≤1μA with 1 pin to GND VBR IT=1mA with 1 pin at GND Typ ILEAK 5 nA VR=3.3V with 1 pin at GND 10 nA VR=5V with 1 pin at GND 100 nA 1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD 2 Diode Capacitance IPP=1A, tp=8/20µs, Fwd 9 V IPP=2A, tp=8/20µs, Fwd 9.5 V TLP tp=100ns, 1 Pin to GND 0.2 Ω IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV CD 1 V V 1 Clamp Voltage1 Units 5.0 7.0 VR=1.5V with 1 pin at GND1 Leakage Current Max Reverse Bias=0V, f=1MHz 30 35 pF Note: 1Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: star t1=70ns to end t2=80ns Pulse Waveform Capacitance vs. Reverse Bias (1 Pin to GND) 40.0 110% 100% 35.0 90% 30.0 70% Capacitance (pF) Percent of IPP 80% 60% 50% 40% 30% 20% 10% 0% 25.0 20.0 15.0 10.0 5.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0.0 Time (μs) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Bias Voltage (V) ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/01/15 SP1013 Series 548 2 TVS Diode Arrays (SPA®® Diodes) General Purpose Protection - SP1013 Series Clamping Voltage vs. Peak Pulse Currennt (1 Pin to GND) Transmission Line Pulsing(TLP) Plot(1 Pin to GND) 25 14.0 20 10.0 TLP Current (A) Clamp Voltage (VC ) 12.0 8.0 6.0 4.0 15 10 5 2.0 0.0 1 2 3 4 5 6 7 0 8 0 5 10 Peak Pulse Current - I PP (A) 15 20 25 30 TLP Volts (V) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tP TP Temperature Reflow Condition TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Part Marking System Critical Zone TL to TP Ramp-up time to peak temperature Time Part Numbering System SP 1013 – 01 W T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Number of Channels Package W: Flipchip Ordering Information ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/01/15 Part Number Package Marking Min. Order Qty. SP1013-01WTG Flipchip • 15000 SP1013 Series 3 549 TVS Diode Arrays (SPA®® Diodes)D General Purpose Protection - SP1013 Series A2 A A1 Package Dimensions — Flipchip TOP VIEW BOTTOM VIEW 0.01 0.20 0.16 F 0.41 E 0.25 G 0.20 0.14 D Stencil opening (0.20x0.16) A2 A Recommended Solder Pad Footprint and Stencil opening Thickness of Stencil opening is 0.08mm A1 *Sizes in mm 0.20 Flipchip 0.01 Symbol Solder Pad (0.20x0.14) Millimeters Inches Typ Max Min Typ Max A 0.183 0.211 0.239 0.0072 0.0083 0.0094 A1 0.008 0.011 0.25 0.014 0.0003 0.0004 0.0006 A2 0.175 0.41 0.16 Min 0.200 0.2250.20 0.0069 0.0079 0.0089 D 0.280 0.290 0.300 0.0110 0.0114 0.0118 E 0.530 0.540 0.550 0.0209 0.0213 0.0217 F - Stencil opening 0.100 - 0.0039 - G - 0.200 0.0079 - (0.20x0.16) - 0.14 Solder Pad (0.20x0.14) - Recommended Solder Pad Footprint and Stencil opening Thickness of Stencil opening is 0.08mm *Sizes in mm Embossed Carrier Tape & Reel Specification — Flipchip 7 ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/01/15 Symbol Millimeters A0 0.34+/-0.03 B0 0.60+/-0.03 K0 0.25 + 0.03 F 3.50 +/- 0.05 P1 2.00+/-0.10 W 8.00+/-0.10 SP1013 Series 550 4