Plastic Packages for Integrated Circuits Package Outline Drawing L48.7x7Y 48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH-QFN) Rev 0 10/12) MILLIMETERS aaa C A A D D1 aaa C B MIN NOM MAX MIN NOM MAX A - - 0.90 - - 0.035 A1 0.00 0.01 0.05 A2 - 0.65 0.70 A3 b 0.18 E E1 1.22 bbb C A 0.007 0.009 0.011 0.276 BSC 4.10 0.266 BSC 4.20 0.157 0.161 0.165 0.276 BSC 6.75 BSC 0.266 BSC E2 4.00 4.10 4.20 0.157 0.161 0.165 L 0.30 0.40 0.50 0.012 0.016 0.020 e B 0.28 7.00 BSC E1 1.23 0.23 0.026 0.028 0.008 REF. 6.75 BSC 4.00 E bbb C B - 7.00 BSC D1 D2 0.00 0.0004 0.002 0.20 REF. D 0.50 DIA. INCH SYMBOL 0.50 BSC 0.020 BSC θ 0° - 12° 0° - 12° R 0.075 - - 0.003 - - TOLERANCES OF FORM AND POSITION TOP VIEW D2 aaa 0.10 0.004 bbb 0.10 0.004 ccc 0.05 0.002 *Controlling Dimension: mm 0.42±0.18 0.45 NOTES: 0.42±0.18 PIN1 ID 0.20 R 2. Die Thickness allowable is 0.305mm maximum (0.012 inches maximum). E2 R 1. All Dimensions are in Millimeters. 3. Dimensioning and Tolerances conform to ASME Y14.5M-1994. 4. Dimension applies to plated terminal and is measured between 0.20 and 0.25mm from terminal tip. 0. 20 5. The pin #1 identifier must be placed on the top surface of the package by using indentation mark or other feature of package body. b 6. Exact shape and size of this feature is optional. L L e 0. 15 0.10 7. Package warpage Max 0.08mm. C A B 8. Applied for exposed pad and terminals exclude embedding part of exposed pad from measuring. BOTTOM VIEW 9. Applied only to terminals. 10. Package corners unless otherwise specified are R0.175±0.025mm. 1 A A2 C 1 ccc C A3 A1 SEATING PLANE SIDE VIEW