Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L48.7x7Y
48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH-QFN)
Rev 0 10/12)
MILLIMETERS
aaa C A
A
D
D1
aaa C B
MIN
NOM
MAX
MIN
NOM
MAX
A
-
-
0.90
-
-
0.035
A1
0.00
0.01
0.05
A2
-
0.65
0.70
A3
b
0.18
E
E1
1.22
bbb C A
0.007
0.009 0.011
0.276 BSC
4.10
0.266 BSC
4.20
0.157
0.161
0.165
0.276 BSC
6.75 BSC
0.266 BSC
E2
4.00
4.10
4.20
0.157
0.161
0.165
L
0.30
0.40
0.50
0.012
0.016
0.020
e
B
0.28
7.00 BSC
E1
1.23
0.23
0.026 0.028
0.008 REF.
6.75 BSC
4.00
E
bbb C B
-
7.00 BSC
D1
D2
0.00 0.0004 0.002
0.20 REF.
D
0.50 DIA.
INCH
SYMBOL
0.50 BSC
0.020 BSC
θ
0°
-
12°
0°
-
12°
R
0.075
-
-
0.003
-
-
TOLERANCES OF FORM AND POSITION
TOP VIEW
D2
aaa
0.10
0.004
bbb
0.10
0.004
ccc
0.05
0.002
*Controlling Dimension: mm
0.42±0.18
0.45
NOTES:
0.42±0.18
PIN1 ID
0.20 R
2. Die Thickness allowable is 0.305mm maximum
(0.012 inches maximum).
E2
R
1. All Dimensions are in Millimeters.
3. Dimensioning and Tolerances conform to ASME
Y14.5M-1994.
4. Dimension applies to plated terminal and is measured
between 0.20 and 0.25mm from terminal tip.
0.
20
5. The pin #1 identifier must be placed on the top surface of the
package by using indentation mark or other feature of
package body.
b
6. Exact shape and size of this feature is optional.
L
L
e
0.
15
0.10
7. Package warpage Max 0.08mm.
C A B
8. Applied for exposed pad and terminals exclude embedding
part of exposed pad from measuring.
BOTTOM VIEW
9. Applied only to terminals.
10. Package corners unless otherwise specified are
R0.175±0.025mm.
1
A
A2
C
1
ccc C
A3
A1
SEATING
PLANE
SIDE VIEW