Connector for Memory StickTM SCEC Series ESD (electro-static discharge) protection model whose robust structure achieves high reliability. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Features ● ● ● Combine Type For Compact Flash™ ● Applications Improved operability from long ejection stroke (10mm) and clear click feel. 4 solder lug terminals are provided in the plate for secure mounting onto the PC board. Allows setting of media locking mechanism. Reflow solderable. ● ● For compact audio equipment, personal digital assistants, desktop PCs and notebook PCs For home audio equipment (TVs, set top boxes and recorders) For digital camcorders, digital still cameras, and headphone players Typical Specifications Items For PC cards supporting CardBus For Express Card™ ● Specifications Applicable media Memory StickTM Mounting type Surface mounting type Mounting style Standard mount Media ejection structure Push-push type Operating temperature range −20℃ to ＋60℃ Voltage proof 500V AC 1minute Structure For CMOS Camera Module Performance Insulation resistance （Initial） 1,000MΩ min. Contact resistance （Initial） 40mΩ max. Insertion and removal cycle 12,000cycles Product Line 36 Media ejection structure Mounting system Features Stand-off （mm） Packing system Product No. Push-push type Standard mount With boss standard mouth 0 Tray SCEC1B0100 Connector for Memory Stick™ SCEC Series Dimensions Unit:mm PC board mounting hole dimensions （Viewed from the mounting face side） Style With boss standard mouth 27.4 Center of #1-Pad Guide bosses 2-0.9 3 Mounting datum plane (※Dimensions) no parts mounting area (※)17.25 min. (※)17.7 min. Mounting datum plane (※)37.2 max. (※)2.5 min. Card center Media outline (※)6.2 min. 17.5 32.6 22.5 (※)39.7 min. 2-ø 1.6 ho les 2.4 Pad 8.6 Pad 2.4 (53.85) 24 Media full length(50) 2-3.2 1.5 6.6 Full height 4.1 Locked position (※)10.7 min. 0. #1 #10 (1.2) Over stroke Media width for media insertion Opening groove taper Opening groove taper 21.65 0.8 1 C 1.95 Card center Media eject stroke (12.95) (11.975) (10) 2-3.2 40.9 17.5 15 Pad 10-0.9 6.6 24 9.3 Pitch 9-1.5 4 Frame terminals Pad 4 0.45 2-2.1 Pad 2.4 29.85 3.7 9-1.5 10-0.5 Media outline For SD Memory Card (11.675) Pad 4 2-0.9 10.2 (5.525) (※)18 min. For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 37 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.