Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package (WLCSP) W3x3.9A 3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE (For ISL59116, ISL59117 Only) E SYMBOL MILLIMETERS NOTES A 0.62 +0.05 -0.08 - A1 0.24 ±0.025 - A2 0.38 REF. - b 0.32 ±0.03 - bb θ 0.30 REF. - D 1.45 ±0.05 - D1 1.00 BASIC - E 1.45 ±0.05 - E1 1.00 BASIC - PIN A1 ID AREA D TOP VIEW bb A2 A A1 b e 0.50 BASIC - SD 0.00 BASIC - N 9 3 Rev. 1 6/06 SIDE VIEW NOTES: 1. Dimensions are in Millimeters. E1 2. Dimensioning and tolerancing conform to ASME 14.5M-1994. 3. Symbol “N” is the actual number of solder balls. C 4. Reference JEDEC MO-211-C, variation DD. SD D1 B A 1 2 3 BOTTOM VIEW 1 b