Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
W3x3.9E
3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
Rev 0, 8/14
X
Y
1.410 ± 0.030
0.400
C
9 x 0.265 ± 0.035
1.410 ± 0.030
B
0.305
A
(4X)
0.10
1
TOP VIEW
2
3
PIN 1
(A1 CORNER)
0.305
BOTTOM VIEW
Z
0.05
SEATING PLANE
Z
3
PACKAGE OUTLINE
0.240
0.400
0.265 ± 0.035
0.290
RECOMMENDED LAND PATTERN
0.200 ± 0.030
0.500 ± 0.050
SIDE VIEW
NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerance per ASMEY 14.5 - 1994, and JESD 95-1 SPP-010.
3. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451.
1
0.10
Z X Y
0.05
Z