Plastic Packages for Integrated Circuits Package Outline Drawing W3x3.9E 3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 0, 8/14 X Y 1.410 ± 0.030 0.400 C 9 x 0.265 ± 0.035 1.410 ± 0.030 B 0.305 A (4X) 0.10 1 TOP VIEW 2 3 PIN 1 (A1 CORNER) 0.305 BOTTOM VIEW Z 0.05 SEATING PLANE Z 3 PACKAGE OUTLINE 0.240 0.400 0.265 ± 0.035 0.290 RECOMMENDED LAND PATTERN 0.200 ± 0.030 0.500 ± 0.050 SIDE VIEW NOTES: 1. All dimensions are in millimeters. 2. Dimensions and tolerance per ASMEY 14.5 - 1994, and JESD 95-1 SPP-010. 3. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1 0.10 Z X Y 0.05 Z