Plastic Packages for Integrated Circuits Package Outline Drawing Q64.10x10D 64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE Rev 2, 9/12 12.00 4 5 10.00 D 3 12.00 A 10.00 4 5 B 0.50 3 4X 0.20 C A-B D TOP VIEW 4X 0.20 H A-B D BOTTOM VIEW 11/13° 1.20 MAX 0.05 / / 0.10 C C SIDE VIEW 7 0.08 SEE DETAIL "A" 0° MIN. H 3 0.08 M C A-B D WITH LEAD FINISH 0.22 ±0.05 0.09/0.20 2 1.00 ±0.05 0.05/0.15 0.09/0.16 0.08 R. MIN. 0.20 MIN. 0.20 ±0.03 BASE METAL DETAIL "A" SCALE: NONE 0.25 0-7° GAUGE PLANE 0.60 ±0.15 (1.00) NOTES: 1. All dimensioning and tolerancing conform to ANSI Y14.5-1982. 2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and D to be determined at centerline between leads where leads exit plastic body at datum plane H. 4. Dimensions do not include mold protrusion. Allowable mold protrusion is 0.254mm. 5. These dimensions to be determined at datum plane H. 6. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 7. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total at maximum material condition. Dambar cannot be located on the lower radius or the foot. 8. Controlling dimension: millimeter. 9. This outline conforms to JEDEC publication 95 registration MS-026, variation ACD. 10. Dimensions in ( ) are for reference only. 1