Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.2x2
8 Lead Ultra Thin Dual Flat No-Lead COL Plastic Package (UTDFN COL)
Rev 4, 05/15
2X 1.5
2.00
A
6
PIN 1
INDEX AREA
PIN #1 INDEX AREA
6
B
6X 0.50
1
4
7X 0.4 ± 0.1
1X 0.5 ±0.1
2.00
(4X)
0.15
8
5
0.10 M C A B
TOP VIEW
4 0.25 +0.05 / -0.07
BOTTOM VIEW
( 8X 0 . 25 )
SEE DETAIL "X"
( 1X 0 .70 )
0 . 55 MAX
0.10 C
C
BASE PLANE
SEATING PLANE
0.08 C
(1.8 )
SIDE VIEW
C
( 7X 0 . 60 )
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 6X 0 . 5 )
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
1
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.