Plastic Packages for Integrated Circuits Package Outline Drawing L6.1.6x1.6 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD COL PLASTIC PACKAGE (UTDFN COL) Rev 3, 05/15 2X 1.00 1.60 A 6 PIN 1 INDEX AREA PIN #1 INDEX AREA 6 B 4X 0.50 1 3 5X 0 . 40 ± 0 . 1 1X 0.5 ±0.1 1.60 (4X) 0.15 4 6 0.10 M C A B TOP VIEW 4 0.25 +0.05 / -0.07 BOTTOM VIEW ( 6X 0 . 25 ) SEE DETAIL "X" ( 1X 0 .70 ) 0.5 ±0.05 0.10 C C BASE PLANE (1.4 ) SEATING PLANE 0.08 C SIDE VIEW ( 5X 0 . 60 ) C 5 0 . 2 REF 0 . 00 MIN. 0 . 05 MAX. DETAIL "X" ( 4X 0 . 5 ) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1