Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
A
A
E
6
B
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
4
MILLIMETERS
D
PIN 1
REFERENCE
2X
0.15 C
1
2X
L6.1.6x1.6A
3
MIN
NOMINAL
MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
0.127 REF
A3
0.15 C
A1
TOP VIEW
e
1.00 REF
4
6
L
CO.2
D2
SYMBOL
b
0.15
0.20
0.25
-
D
1.55
1.60
1.65
4
D2
0.40
0.45
0.50
-
E
1.55
1.60
1.65
4
E2
0.95
1.00
1.05
-
0.50 BSC
e
DAP SIZE 1.30 x 0.76
L
3
1
b 6X
0.10 M C A B
E2
-
0.25
0.30
0.35
Rev. 1 6/06
NOTES:
1. Dimensions are in mm. Angles in degrees.
BOTTOM VIEW
2. Coplanarity applies to the exposed pad as well as the terminals.
Coplanarity shall not exceed 0.08mm.
DETAIL A
6X
0.10 C
3. Warpage shall not exceed 0.10mm.
0.08 C
4. Package length/package width are considered as special
characteristics.
5. JEDEC Reference MO-229.
A3
SIDE VIEW
C
SEATING
PLANE
0.127±0.008
0.127 +0.058
-0.008
TERMINAL THICKNESS
A1
DETAIL A
0.25
0.50
1.00
0.45
1.00
2.00
0.30
1.25
LAND PATTERN
1
6
6. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.