Plastic Packages for Integrated Circuits Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN) A A E 6 B 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 4 MILLIMETERS D PIN 1 REFERENCE 2X 0.15 C 1 2X L6.1.6x1.6A 3 MIN NOMINAL MAX NOTES A 0.45 0.50 0.55 - A1 - - 0.05 - 0.127 REF A3 0.15 C A1 TOP VIEW e 1.00 REF 4 6 L CO.2 D2 SYMBOL b 0.15 0.20 0.25 - D 1.55 1.60 1.65 4 D2 0.40 0.45 0.50 - E 1.55 1.60 1.65 4 E2 0.95 1.00 1.05 - 0.50 BSC e DAP SIZE 1.30 x 0.76 L 3 1 b 6X 0.10 M C A B E2 - 0.25 0.30 0.35 Rev. 1 6/06 NOTES: 1. Dimensions are in mm. Angles in degrees. BOTTOM VIEW 2. Coplanarity applies to the exposed pad as well as the terminals. Coplanarity shall not exceed 0.08mm. DETAIL A 6X 0.10 C 3. Warpage shall not exceed 0.10mm. 0.08 C 4. Package length/package width are considered as special characteristics. 5. JEDEC Reference MO-229. A3 SIDE VIEW C SEATING PLANE 0.127±0.008 0.127 +0.058 -0.008 TERMINAL THICKNESS A1 DETAIL A 0.25 0.50 1.00 0.45 1.00 2.00 0.30 1.25 LAND PATTERN 1 6 6. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389.