SL3S1214 UCODE 7m Rev. 3.1 — 27 July 2015 307431 Product data sheet COMPANY PUBLIC 1. General description UCODE 7m is a derivative of the UCODE 7 and offers on top of the UCODE 7 features a 32-bit User Memory. NXP’s UCODE 7m IC is the leading-edge EPC Gen2 RFID chip that offers best-in-class performance and features for use in the most demanding RFID tagging applications. Particularly well suited for inventory management application, like e.g Retail and Fashion, with its leading edge RF performance for any given form factor, UCODE 7m enables long read distance and fast inventory of dense RFID tag population. With its broadband design, it offers the possibility to manufacture true global RFID label with best-in-class performance over worldwide regulations. The device also provides an automatic self pre-serialization feature for 96-bit EPC, following the industry aligned Multi Vendor Chip-based serialization scheme, and a Parallel encoding feature. For applications where the same 58-bit Stock Keeping Unit (SKU) needs to be encoded on multiple tags, at the same time, a combination of both features improves and simplifies the tag initialization process. On top UCODE 7m offers a Tag Power Indicator for RFID tag initialization optimization and a Product Status Flag for Electronic Article Surveillance (EAS) application. 2. Features and benefits 2.1 Key features Read sensitivity 21 dBm Write sensitivity 16 dBm Parallel encoding mode: 100 items in 60ms Encoding speed: 16 bits per millisecond Innovative functionalities Tag Power Indicator Automatic self pre-serialization for 96-bit EPC Integrated Product Status Flag (PSF) Compatible with single-slit antenna Up to 128-bit EPC 96-bit Unique Tag Identifier (TID) factory locked, including 48-bit unique serial number 32-bit User Memory EPC Gen2 v2.0 ready SL3S1214 NXP Semiconductors UCODE 7m 2.1.1 Memory 32-bit User Memory Up to 128-bit of EPC memory Supports self pre-serialization for 96-bit EPC 96-bit Tag IDentifier (TID) factory locked 48-bit unique serial number factory-encoded into TID 32-bit access password Wide operating temperature range: 40 C up to +85 C Minimum 100.000 write cycle endurance 2.2 Key benefits 2.2.1 End user benefit Long READ and WRITE ranges due to leading edge chip sensitivity Very fast bulk encoding Product identification through unalterable extended TID range, including a 48-bit serial number Reliable operation in dense reader and noisy environments through high interference rejection 2.2.2 Antenna design benefits High sensitivity enables smaller and cost efficient antenna designs for the same retail category Tag Power Indicator features enables very high density of inlay on rolls without crosstalk issues during writing/encoding The different input capacitance for the single slit antenna solution enables a finer tuning of the impedance for the antenna design 2.2.3 Label manufacturer benefit Large RF pad-to-pad distance to ease antenna design Symmetric RF inputs are less sensitive to process variation Single slit antenna for a more mechanically stable antenna connection Automatic self pre-serialization of the 96-bit EPC anytime its EPC serial number is erased Extremely fast encoding of the EPC content 2.3 Supported features All mandatory commands of EPC global specification V.1.2.0 are implemented including: (Perma)LOCK The following optional commands are implemented in conformance with the EPC specification: Access BlockWrite (2 words, 32-bit) SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 31 SL3S1214 NXP Semiconductors UCODE 7m Product Status Flag bit: enables the UHF RFID tag to be used as EAS (Electronic Article Surveillance) tag without the need for a back-end data base. Tag Power Indicator: enables the reader to select only ICs/tags that have enough power to be written to. Parallel encoding: allows for the ability to bring (multiple) tag(s) quickly to the OPEN state and hence allowing single tags to be identified simply, without timing restrictions, or multiple tags to be e.g. written to at the same time, considerably reducing the encoding process All supported features of UCODE 7m can be activated using standard EPCglobal READ / WRITE / ACCESS / SELECT commands. No custom commands are needed to take advantage of all the features in case of unlocked EPC memory. The parallel encoding feature may however require a firmware upgrade of the reader to use its full potential. 3. Applications 3.1 Markets Retail/Fashion (apparel, footwear, jewelry, cosmetics) Fast Moving Consumer Goods 3.2 Applications Retail Inventory management Supply chain management Loss prevention Asset management Outside the applications mentioned above, please contact NXP Semiconductors for support. 4. Ordering information Table 1. Ordering information Type number Package Name IC type Description Version SL3S1214FUD/BG Wafer UCODE 7m bumped die on sawn 8” 120 m wafer 7m Polyimide spacer not applicable SL3S1214FTB0 XSON6 UCODE 7m plastic extremely thin small outline package; no leads; 6 SOT886F1 terminals; body 1 1.45 0.5 mm 5. Marking Table 2. SL3S1214 Product data sheet COMPANY PUBLIC Marking codes Type number Marking code Comment Version SL3S1214FTB0 YN UCODE 7m SOT886 All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 31 SL3S1214 NXP Semiconductors UCODE 7m 6. Block diagram The SL3S1214 IC consists of three major blocks: - Analog Interface - Digital Control - EEPROM The analog part provides stable supply voltage and demodulates data received from the reader which is then processed by the digital part. Further, the modulation transistor of the analog part transmits data back to the reader. The digital section includes the state machines, processes the protocol and handles communication with the EEPROM, which contains the EPC and the user data. ANALOG RF INTERFACE DIGITAL CONTROL VREG VDD DEMOD data in RF1 RECT EEPROM ANTICOLLISION READWRITE CONTROL MEMORY ACCESS CONTROL antenna MOD data out RF2 R/W EEPROM INTERFACE CONTROL RF INTERFACE CONTROL SEQUENCER CHARGE PUMP aaa-005856 Fig 1. SL3S1214 Product data sheet COMPANY PUBLIC Block diagram of UCODE 7m IC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 31 SL3S1214 NXP Semiconductors UCODE 7m 7. Pinning information TP1 SL3S1214 trademark RF2 SL3S12x4FTB0 TP2 RF1 RF2 1 6 RF1 n.c. 2 5 n.c. n.c. 3 4 n.c. aaa-018831 Transparent top view aaa-013423 Fig 2. Pinning bare die Fig 3. Pin configuration for SOT886 7.1 Pin description Table 3. Symbol Description TP1 test pad 1 RF1 antenna connector 1 TP2 test pad 2 RF2 antenna connector 2 Table 4. SL3S1214 Product data sheet COMPANY PUBLIC Pin description bare die Pin description SOT886 Pin Symbol Description 1 RF2 antenna connector 2 n.c. not connected 3 n.c. not connected 4 n.c. not connected 5 n.c. not connected 6 RF1 antenna connector All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 31 SL3S1214 NXP Semiconductors UCODE 7m 8. Wafer layout 8.1 Wafer layout (1) TP1 RF2 (5) Y (6) (4) X (7) TP2 RF1 (8) (2) (3) not to scale! aaa-005606 (1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m) (2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m) (3) Chip step, x-length: 460 m (4) Chip step, y-length: 505 m (5) Bump to bump distance X (TP1 - RF2): 358 m (6) Bump to bump distance Y (RF1 - RF2): 403 m (7) Distance bump to metal sealring X: 40,3m (outer edge - top metal) (8) Distance bump to metal sealring Y: 40,3 m Bump size X x Y: 60 m x 60 m Remark: TP1 and TP2 are physically disconnected Fig 4. SL3S1214 Product data sheet COMPANY PUBLIC UCODE 7m wafer layout All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 31 SL3S1214 NXP Semiconductors UCODE 7m 9. Mechanical specification The UCODE 7m wafer is available in 120 m thickness with 7m Polyimide spacer. 9.1 Wafer specification See Ref. 21 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**”. 9.1.1 Wafer Table 5. Specifications Wafer Designation each wafer is scribed with batch number and wafer number Diameter 200 mm (8”) unsawn - 205 mm typical sawn on foil Thickness 120 m 15 m SL3S1214FUD/BG Number of pads 4 Pad location non diagonal / placed in chip corners Distance pad to pad RF1-RF2 403.0 m Distance pad to pad TP1-RF2 358.0 m Process CMOS 0.14 m Batch size 25 wafers Potential good dies per wafer 126.524 Wafer backside Material Si Treatment ground and stress release Roughness Ra max. 0.5 m, Rt max. 5 m Chip dimensions Die size excluding scribe 0.490 mm 0.445 mm = 0.218 mm2 Scribe line width: x-dimension = 15 m y-dimension = 15 m Passivation on front Type Sandwich structure Material PE-Nitride (on top) Thickness 1.75 m total thickness of passivation Polyimide spacer 7 m 1 m (SL3S1214FUD/BG only) Au bump Bump material > 99.9 % pure Au Bump hardness 35 – 80 HV 0.005 Bump shear strength > 70 MPa Bump height 25 m[1] SL3S1214FUD/BG SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 31 SL3S1214 NXP Semiconductors UCODE 7m Table 5. Specifications Bump height uniformity within a die 2 m – within a wafer 3 m – wafer to wafer 4 m Bump flatness 1.5 m Bump size – RF1, RF2 60 60 m – TP1, TP2 60 60 m Bump size variation 5 m [1] Because of the 7m spacer, the bump will measure 18m relative height protruding the spacer. 9.1.2 Fail die identification No ink dots are applied to the wafer. Electronic wafer mapping (SECS II format) covers the electrical test results and additionally the results of mechanical/visual inspection. See Ref. 21 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**” 9.1.3 Map file distribution See Ref. 21 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**” 10. Functional description 10.1 Air interface standards The UCODE 7m fully supports all parts of the “Specification for RFID Air Interface EPCglobal, EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0". 10.2 Power transfer The interrogator provides an RF field that powers the tag, equipped with a UCODE 7m. The antenna transforms the impedance of free space to the chip input impedance in order to get the maximum possible power for the UCODE 7m on the tag. The RF field, which is oscillating on the operating frequency provided by the interrogator, is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC. The antenna that is attached to the chip may use a DC connection between the two antenna pads. Therefore the UCODE 7m also enables loop antenna design. SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 31 SL3S1214 NXP Semiconductors UCODE 7m 10.3 Data transfer 10.3.1 Interrogator to tag Link An interrogator transmits information to the UCODE 7m by modulating an UHF RF signal. The UCODE 7m receives both information and operating energy from this RF signal. Tags are passive, meaning that they receive all of their operating energy from the interrogator's RF waveform. An interrogator is using a fixed modulation and data rate for the duration of at least one inventory round. It communicates to the UCODE 7m by modulating an RF carrier. For further details refer to Ref. 1. Interrogator-to-tag (R=>T) communications. 10.3.2 Tag to interrogator Link Upon transmitting a valid command an interrogator receives information from a UCODE 7m tag by transmitting an unmodulated RF carrier and listening for a backscattered reply. The UCODE 7m backscatters by switching the reflection coefficient of its antenna between two states in accordance with the data being sent. For further details refer to Ref. 1, chapter 6.3.1.3. The UCODE 7m communicates information by backscatter-modulating the amplitude and/or phase of the RF carrier. Interrogators shall be capable of demodulating either demodulation type. The encoding format, selected in response to interrogator commands, is either FM0 baseband or Miller-modulated subcarrier. 10.4 Supported commands The UCODE 7m supports all mandatory EPCglobal V1.2.0 commands including • (perma) LOCK command In addition the UCODE 7m supports the following optional commands: • ACCESS • Block Write (32 bit) The Kill Password of the UCODE 7m is zero-valued and permanent read/write locked, which disallows the IC from being killed. SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 31 SL3S1214 NXP Semiconductors UCODE 7m 10.5 UCODE 7m memory The UCODE 7m memory is implemented according EPCglobal Class1Gen2 and organized in three sections: Table 6. UCODE 7m memory sections Name Size Bank Reserved memory (32-bit Kill password and 32-bit Access password) 64 bit 00b EPC (excluding 16 bit CRC-16 and 16 bit PC) 128 bit 01b UCODE 7m Configuration Word 16 bit 01b TID (including permalocked unique 48 bit serial number) 96 bit 10b User Memory 32 bit 11b The logical address of all memory banks begin at zero (00h). In addition to the four memory banks one configuration word to handle the UCODE 7m specific features is available at EPC bank 01 address bit-200h. The configuration word is described in detail in 9.6. The TID complies to the extended tag Identification scheme according GS1 EPC Tag Data Standard 1.6. The EPC content will follow a self pre-serialization scheme following the Multi Vendor Chip-based serialization scheme (Ref. 23) see Section 10.6.3 “Automatic self pre-serialization of the 96-bit EPC” for more details. SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 31 SL3S1214 NXP Semiconductors UCODE 7m 10.5.1 UCODE 7m overall memory map Table 7. UCODE 7m overall memory map Bank address Memory address Type Content Initial Remark Bank 00 00h to 1Fh reserved Kill password hard wired 00h permanent read/write locked 20h to 3Fh reserved Access password all 00h unlocked memory 00h to 0Fh EPC CRC-16: refer to Ref. 17 Bank 01 EPC Bank 01 Config Word Bank 10 TID memory mapped calculated CRC 10h to 14h EPC EPC length 00110b unlocked memory 15h EPC UMI 0b unlocked memory 16h EPC XPC indicator 0b hardwired to 0 17h to 1Fh EPC numbering system indicator 00h unlocked memory unlocked memory 20h to 9Fh EPC EPC [1] 200h EPC RFU 0b locked memory 201h EPC RFU 0b locked memory 202h EPC Parallel encoding 0b Action bit[4] 203h EPC RFU 0b locked memory 204h EPC Tag Power Indicator 0b Action bit[4] 205h EPC RFU 0b locked memory 206h EPC RFU 0b locked memory 207h EPC RFU 0b locked memory 208h EPC RFU 0b locked memory 209h EPC max. backscatter strength 1b permanent bit[5] 20Ah EPC RFU 0b locked memory 20Bh EPC RFU 0b locked memory 20Ch EPC RFU 0b locked memory 20Dh EPC RFU 0b locked memory 20Eh EPC RFU 0b locked memory 20Fh EPC PSF alarm flag 0b Permanent bit[5] 00h to 07h TID allocation class identifier 1110 0010b locked memory 08h to 13h TID tag mask designer identifier 1000 0000 0110b locked memory 14h TID config word indicator 1b[2] locked memory locked memory 14h to 1Fh TID tag model number TMNR[3] 20h to 2Fh TID XTID header 2000h locked memory 30h to 5Fh TID Serial Number SNR locked memory Bank 11 User 00h to 1Fh Memory UM User memory all 00h unlocked memory [1] HEX E280 6811 0000 00nn nnnn nnnn (0000 0000) [2] Indicates the existence of a Configuration Word at the end of the EPC number [3] See Figure 5 [4] Action bits: meant to trigger a feature upon a SELECT command on the related bit, seeSection 10.6.1 [5] Permanent bit: permanently stored bits in the memory; Read/Writeable according EPC bank lock status, see Section 10.6.1 where n are the bytes used for the pre-serialized EPC. see also Section 10.6.3 SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 31 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors SL3S1214 Product data sheet COMPANY PUBLIC 10.5.2 UCODE 7m TID memory details First 48 bit of TID memory Class ID Mask Designer ID E28068112000 E2h 806h UCODE 7m Addresses Model Number Config Word Indicator 1b 00h Sub Version Version Nr. (Silicon) Nr. 0000b 0010001b XTID Header 2000h 5Fh TID Rev. 3.1 — 27 July 2015 307431 All information provided in this document is subject to legal disclaimers. MS Byte MSBit Bit Address LS Byte LSBit 00h 07h 08h Class Identifier Bits 7 MSBit E2h 13h 14h Mask-Designer Identifier 0 11 (EAN.UCC) 0 806h Bits 811h 18h 1b 15 (UCODE 7m) 14h C. W. I. 0 XTID 0 3 47 0 000000000000h to FFFFFFFFFFFFh 1Fh 6 0 0010001b (UCODE 7m) Fig 5. Serial Number 0 Model Number 0 0000b 2000h (indication of 48bit unique SNR) 19h Sub Version Number 5Fh 2Fh 30h Model Number 11 (NXP; with XTID) Address 1Fh 20h LSBit aaa-013424 UCODE 7m TID memory structure SL3S1214 UCODE 7m © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 31 SL3S1214 NXP Semiconductors UCODE 7m 10.6 Supported features The UCODE 7m is equipped with a number of additional features, which are implemented in such a way that standard EPCglobal READ / WRITE / ACCESS / SELECT commands can be used to operate these features. The Configuration Word, as mentioned in the memory map, describes the additional features located at address 200h of the EPC memory. Bit 14h of the TID indicates the existence of a Configuration Word. This flag will enable the selection of configuration word enhanced transponders in mixed tag populations. Please refer to Ref. 22 for additional reference. 10.6.1 UCODE 7m features control mechanism The different features of the UCODE 7m can be activated / de-activated by addressing or changing the content of the corresponding bit in the configuration word located at address 200h in the EPC memory bank (see Table 8). The de-activation of the action bit features will only happen after chip reset. Table 8. Configuration word UCODE 7m Locked memory Action bit RFU RFU Parallel encoding RFU Tag Power Indicator RFU RFU RFU 0 1 2 3 4 5 6 7 Table 9. Locked memory Configuration word UCODE 7m ... continued Locked Permanent memory bit Locked memory Permanent bit RFU max. backscatter strength RFU RFU RFU RFU RFU PSF Alarm bit 8 9 10 11 12 13 14 15 The configuration word contains 2 different type of bits: • Action bits: meant to trigger a feature upon a SELECT command on the related bit: Parallel encoding Tag Power indicator • Permanent bits: permanently stored bits in the memory Max. Backscatter Strength PSF Alarm bit The activation or the de-activation of the feature behind the permanent bits happens only when attempting to write a “1” value to the related bit (value toggling) - writing “0” value will have no effect. If the feature is activated, the related bit will be read with a “1” value and, if de-activated, with a “0” value. The permanent bits can only be toggled using standard EPC WRITE if the EPC bank is unlocked or within the SECURED state if the EPC is locked. If the EPC is perma locked, they cannot be changed. SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 31 SL3S1214 NXP Semiconductors UCODE 7m Action bits will trigger a certain action only if the pointer of the SELECT command exactly matches the action-bit address (i.e. 202h or 204h), if the length=1 and if mask=1b (no multiple trigger of actions possible within one single SELECT command). After issuing a SELECT to any action bits an interrogator shall transmit CW for RTCal Ref. 9 + 80 s before sending the next command. If the truncate bit in the SELECT command is set to "1" the SELECT will be ignored. A SELECT on action bits will not change the digital state of the chip. The action bits can be triggered regardless if the EPC memory is unlocked, locked or perma locked. 10.6.2 Backscatter strength reduction The UCODE 7m features two levels of backscatter strengths. Per default maximum backscatter is enabled in order to enable maximum read rates. When clearing the flag the strength can be reduced if needed. 10.6.3 Automatic self pre-serialization of the 96-bit EPC UCODE 7 TID 96-bit TID+XTID header (48-bit) 48-bit Serial number E280 6811 2000 Upper 13-bit Serial number Lower 35-bit Serial number (NXP) 111 Lower 35-bit from TID SNR 58-bit SKU E280 6811 0000 00 00 (2-bit) Serial number (38-bit) UCODE 7 EPC 96-bit Fig 6. SL3S1214 Product data sheet COMPANY PUBLIC aaa-015564 Automatic self pre-serialization scheme for 96-bit EPC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 31 SL3S1214 NXP Semiconductors UCODE 7m TID E280 6811 2000 FFFF FFFF FFFF hex EPC word1 E280 word2 6811 word3 0000 word4 003F word5 FFFF word6 FFFF hex EXAMPLE 0000 0000 0011 1111 binary 1 Write EPC word6 FFF0h FFF0 EPC Self pre-serialization is gone word1 word2 word3 word4 word5 word6 E280 6811 0000 0000 0000 FFF0 0000 0000 0000 0000 hex binary 2 Write EPC word6 0000h 0000 EPC Self pre-serialization is effective again word1 word2 word3 word4 word5 word6 E280 6811 0000 003F FFFF FFFF 0000 0000 0011 1111 hex binary 3 Write EPC word4 FFEFh FFEF EPC Self pre-serialization is gone word1 word2 word3 word4 word5 word6 E280 6811 0000 FFEF 0000 0000 1111 1111 1110 1111 hex binary 4 Write EPC word4 FF3Fh FF3F EPC Self pre-serialization is effective again word1 word2 word3 word4 word5 word6 E280 6811 0000 FF3F FFFF FFFF 1111 1111 0011 1111 hex binary 5 Increase EPC length to 128-bit EPC Self pre-serialization is gone E280 6811 1111 0000 1111 FF00 0000 0000 0000 0000 0000 binary 0000 hex aaa-015565 Fig 7. SL3S1214 Product data sheet COMPANY PUBLIC Illustration of the handling of the EPC self-preserialization All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 15 of 31 SL3S1214 NXP Semiconductors UCODE 7m Description In case the EPC length is set to be 96-bit, the EPC is by default self pre-serialized following a 96-bit EPC serialization scheme according to the Multi Vendor Chip-based serialization guideline (see Ref. 23), meaning the lower 38-bit will always contain 3 bits for the manufacturer code (111 for NXP) and 35 bit serial number taken from the lower 35 bits of the TID serial number (see Figure 6). As long as the initial content of the lower 38-bit of the EPC is not changed, the EPC will appear serialized. As soon as any of those 38 bits are written, the EPC will show the written content. Once the pre-serialization of the EPC is overwritten and the EPC is not locked, the self pre-serialization can be re-activated by one of the following ways: • Setting the 38-bit Serial number of the EPC to “0” (see Figure 6), or • Erase sixth and fifth word of the EPC to “00 00h” and keep the content of the lower 6 bits of the fourth word of the EPC at its serialized content (see Figure 7). The self pre-serialization only applies to an EPC length of 96 bits, which is the initial EPC length settings of UCODE 7m. Use cases and benefits This automatic EPC serialization is meant to be able to guarantee a unique EPC number for each tagged items even if the same Stock Keeping Unit (SKU) is used. By being serialized by default, the encoding process of the tags with UCODE 7m gets simpler and faster as it only needs to encode the SKU (58-bit header of the EPC). 10.6.4 Parallel encoding Description This feature of the UCODE 7m can be activated by the “Parallel encoding bit” in the Configuration-Word located at (202h). Upon issuing a EPC SELECT command on the “Parallel encoding bit”, in a population of UCODE 7m tags, a subsequent QUERY brings all tags go the OPEN state with a specific handle (“AAAAh”). Once in the OPEN state, for example a WRITE command will apply to all tags in the OPEN state (see Figure 9). This parallel encoding is considerably lowering the encoding time compared to a standard implementation (see Figure 8). The amount of tags that can be encoded at the same time will depend on the strength of the reader signal. Since all tags will backscatter their ACKNOWLEDGE (ACK) response at the same time, the reader will observe collision in the signal from the tags. SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 16 of 31 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors SL3S1214 QUERY/Adjust/Rep READER WRITE Req_RN Req_RN ACK WRITE Req_RN (16-bit) handle RN16 handle TAG 1 handle RN16 TAG 2 handle PC + EPC Tags handle Rev. 3.1 — 27 July 2015 307431 All information provided in this document is subject to legal disclaimers. PC + EPC ACK Req_RN (16-bit) RN16 Product data sheet COMPANY PUBLIC QUERY/Adjust/Rep Only TAG 1 is being addressed Only TAG 2 is being addressed aaa-006843 Example of 16-bit Write command with standard EPC Gen 2 commands SL3S1214 UCODE 7m 17 of 31 © NXP Semiconductors N.V. 2015. All rights reserved. Fig 8. SL3S1214 NXP Semiconductors UCODE 7m SELECT on Parallel encoding bit QUERY (Q=0) WRITE READER AAAAh TAG 1 AAAAh Tags AAAAh AAAAh AAAAh AAAAh Req_RN (16-bit) TAG 2 AAAAh AAAAh AAAAh TAG n All UCODE 7 tags receive the Command aaa-006844 Fig 9. Illustration of Parallel encoding for 16-bit Write command Use cases and benefits Parallel encoding feature of UCODE 7m can enable ultra fast bulk encoding. Taking in addition advantage of the pre-serialization scheme of UCODE 7m, the same SKU can be encoded in multiple tags as the EPC will be delivered pre-serialized already. In the case of only one tag answering (like in printer encoding), this feature could be used to save some overhead in commands to do direct EPC encoding after the handle reply. Since this is a UCODE 7m specific feature the use of this features requires support on the reader side. 10.6.5 Tag Power Indicator Description Upon a SELECT command on the “Tag Power Indicator”, located in the config word 204h, an internal power check on the chip is performed to see if the power level is sufficient to perform a WRITE command. The decision level is defined as nominal WRITE sensitivity minus 1dB. In the case there is enough power, the SELECT command is matching and non-matching if not enough power. The tag can then be singulated by the standard inventory procedure. SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 18 of 31 SL3S1214 NXP Semiconductors UCODE 7m Use cases and benefits This feature gives the possibility to select only the tag(s) that receive enough power to be written during e.g. printer encoding in a dense environment of tags even though the reader may read more than one tag (see Figure 10 for illustration). The power level still needs to be adjusted to transmit enough writing power to one tag only to do one tag singulation. Power level for READ/WRITE too low/too low OK/too low OK/too low OK/OK Only this tag will select itself OK/too low OK/too low too low/too low aaa-005662 Fig 10. Selection of tags with Tag Power Indicator feature SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 19 of 31 SL3S1214 NXP Semiconductors UCODE 7m 10.6.6 Product Status Flag (PSF) Description The PSF is a general purpose bit located in the Configuration word at address 20Fh with a value that can be freely changed. Use cases and benefits The PSF bit can be used as an EAS (Electronic Article Surveillance) flag, quality checked flag or similar. In order to detect the tag with the PSF activated, a EPC SELECT command selecting the PSF flag of the Configuration word can be used. In the following inventory round only PSF enabled chips will reply their EPC number. 10.6.7 Single-slit antenna solution Description In UCODE 7m the test pads TP1 and TP2 are electrically disconnected meaning they are not electrically active and can be safely short-circuited to the RF pads RF1 and RF2 (see Figure 11). Standard assembly Single-slit assembly Supporting pads aaa-005857 Fig 11. Standard antenna design versus single-slit antenna Uses cases and benefits Using single-slit antenna enables easier assembly and antenna design. Inlay manufacturer will only have to take care about one slit of the antenna instead of two in case all pads need to be disconnected from each other. Additionally single-slit antenna assembly and the related increased input capacitance (see Table 11) can be used advantageously over the standard antenna design as additional room for optimization to different antenna design. SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 20 of 31 SL3S1214 NXP Semiconductors UCODE 7m 11. Limiting values Table 10. Limiting values[1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to RFN Symbol Parameter Conditions Min Max Unit 55 +125 C 40 +85 C - ±2 kV - 100 mW Bare die limitations Tstg storage temperature Tamb ambient temperature VESD electrostatic discharge voltage Human body model [3] Pad limitations Pi SL3S1214 Product data sheet COMPANY PUBLIC input power maximum power dissipation, RFP pad [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. [2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. [3] For ESD measurement, the die chip has been mounted into a CDIP20 package. All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 21 of 31 SL3S1214 NXP Semiconductors UCODE 7m 12. Characteristics 12.1 UCODE 7m bare die characteristics Table 11. UCODE 7m RF interface characteristics (RF1, RF2) Symbol Parameter fi input frequency Conditions Min Typ Max Unit 840 - 960 MHz Pi(min) minimum input power READ sensitivity [1][3][8] - 21 - dBm Pi(min) minimum input power WRITE sensitivity [2] - 16 - dBm 16-bit [5] - 1 - ms 32-bit (block write) [5] - 1.8 - ms t 16bit encoding speed Ci chip input capacitance parallel [3][4] - 0.63 - pF Z chip impedance 866 MHz [3][4] - 14.5-j293 - 915 MHz [3][4] - 12.5-j277 - 953 MHz [3][4] - 12.5-j267 - 915MHz [6] - 18-j245 - [6][7] - 13.5-j195 - [2] - -15 - dBm [9] Z typical assembled impedance Z 915MHz typical assembled impedance [9] in case of single-slit antenna assembly Tag Power Indicator mode Pi(min) [1] minimum input power level to be able to select the tag Power to process a QUERY command [2] Tag sensitivity on a 2dBi gain antenna [3] Measured with a 50 source impedance directly on the chip [4] At minimum operating power [5] When the memory content is “0000...”. [6] The antenna shall be matched to this impedance [7] Depending on the specific assembly process, sensitivity losses of few tenths of dB might occur [8] Results in approximately -21,5dBm tag sensitivity with a 2dBi gain antenna [9] Assuming a 80fF additional input capacitance, 250fF in case of single slit antenna Table 12. Symbol UCODE 7m memory characteristics Parameter Conditions Min Typ Max Unit Tamb 55 C 20 - - year 100k - - cycle EEPROM characteristics SL3S1214 Product data sheet COMPANY PUBLIC tret retention time Nendu(W) write endurance All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 22 of 31 SL3S1214 NXP Semiconductors UCODE 7m 12.2 UCODE 7m SOT886 characteristics Table 13. Symbol SL3S1214 Product data sheet COMPANY PUBLIC UCODE 7m RF interface characteristics (RF1, RF1) Parameter Conditions Pi(min) minimum input power READ sensitivity [1][2] Z impedance 915 MHz [3] [1] Power to process a Query command. [2] Measured with a 50 source impedance. [3] At minimum operating power. All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 Min Typ Max Unit - 21 - dBm - 12.8 -j248 - © NXP Semiconductors N.V. 2015. All rights reserved. 23 of 31 SL3S1214 NXP Semiconductors UCODE 7m 13. Package outline SOT886 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm b 1 2 3 4x (2) L L1 e 6 5 e1 4 e1 6x A (2) A1 D E terminal 1 index area 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A(1) 0.5 A1 b D E 0.04 0.25 1.50 1.05 0.20 1.45 1.00 0.17 1.40 0.95 e 0.6 e1 0.5 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. Outline version sot886_po References IEC SOT886 JEDEC JEITA European projection Issue date 04-07-22 12-01-05 MO-252 Fig 12. Package outline SOT886 SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 24 of 31 SL3S1214 NXP Semiconductors UCODE 7m 14. Packing information 14.1 Wafer See Ref. 21 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**” 14.2 SOT886 See: www.nxp.com/packages/SOT886.html 15. Abbreviations Table 14. SL3S1214 Product data sheet COMPANY PUBLIC Abbreviations Acronym Description CRC Cyclic Redundancy Check CW Continuous Wave DSB-ASK Double Side Band-Amplitude Shift Keying DC Direct Current EAS Electronic Article Surveillance EEPROM Electrically Erasable Programmable Read Only Memory EPC Electronic Product Code (containing Header, Domain Manager, Object Class and Serial Number) FM0 Bi phase space modulation G2 Generation 2 IC Integrated Circuit PIE Pulse Interval Encoding PSF Product Status Flag RF Radio Frequency UHF Ultra High Frequency SECS Semi Equipment Communication Standard TID Tag IDentifier All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 25 of 31 SL3S1214 NXP Semiconductors UCODE 7m 16. References [1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.2.0 (October 23, 2008) [2] EPCglobal: EPC Tag Data Standards [3] EPCglobal (2004): FMCG RFID Physical Requirements Document (draft) [4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference (draft) [5] European Telecommunications Standards Institute (ETSI), EN 302 208: Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency identification equipment operating in the band 865 MHz to 868 MHz with power levels up to 2 W, Part 1 – Technical characteristics and test methods [6] European Telecommunications Standards Institute (ETSI), EN 302 208: Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency identification equipment operating in the band 865 MHz to 868 MHz with power levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive [7] [CEPT1]: CEPT REC 70-03 Annex 1 [8] [ETSI1]: ETSI EN 330 220-1, 2 [9] RTCal is the Interrogator-to-Tag calibration symbol length defined in the EPCglobal specification [10] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1: Technical characteristics and test methods. [11] [FCC1]: FCC 47 Part 15 Section 247 [12] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International Standards [13] ISO/IEC 3309: Information technology – Telecommunications and information exchange between systems – High-level data link control (HDLC) procedures – Frame structure [14] ISO/IEC 15961: Information technology, Automatic identification and data capture – Radio frequency identification (RFID) for item management – Data protocol: application interface [15] ISO/IEC 15962: Information technology, Automatic identification and data capture techniques – Radio frequency identification (RFID) for item management – Data protocol: data encoding rules and logical memory functions [16] ISO/IEC 15963: Information technology — Radio frequency identification for item management — Unique identification for RF tags [17] ISO/IEC 18000-1: Information technology — Radio frequency identification for item management — Part 1: Reference architecture and definition of parameters to be standardized [18] ISO/IEC 18000-6: Information technology automatic identification and data capture techniques — Radio frequency identification for item management air interface — Part 6: Parameters for air interface communications at 860–960 MHz SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 26 of 31 SL3S1214 NXP Semiconductors UCODE 7m [19] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary – Part 3: radio-frequency identification (RFID) [20] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15: Radio-frequency devices, U.S. Federal Communications Commission. [21] Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**1 [22] Application note - AN11274 – FAQ on UCODE 7 [23] Release Note - Formulas for Multi-Vendor Chip-Based Serialization (MCS) and FastEPC, BU-ID document number: 2498** 1. ** ... document version number SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 27 of 31 SL3S1214 NXP Semiconductors UCODE 7m 17. Revision history Table 15. Revision history Document ID Release date Data sheet status Change notice Supersedes SL3S1214 v. 3.1 20150727 Product data sheet - SL3S1214 v. 3.0 - - Modifications: SL3S1214 v. 3.0 SL3S1214 Product data sheet COMPANY PUBLIC • SOT886 package added 20141023 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 28 of 31 SL3S1214 NXP Semiconductors UCODE 7m 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SL3S1214 Product data sheet COMPANY PUBLIC Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 29 of 31 SL3S1214 NXP Semiconductors UCODE 7m Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Bare die — All die are tested on compliance with their related technical specifications as stated in this data sheet up to the point of wafer sawing and are handled in accordance with the NXP Semiconductors storage and transportation conditions. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post-packing tests performed on individual die or wafers. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. NXP Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, NXP Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. All die sales are conditioned upon and subject to the customer entering into a written die sale agreement with NXP Semiconductors through its legal department. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. UCODE — is a trademark of NXP Semiconductors N.V. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] SL3S1214 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 27 July 2015 307431 © NXP Semiconductors N.V. 2015. All rights reserved. 30 of 31 SL3S1214 NXP Semiconductors UCODE 7m 20. Contents 1 2 2.1 2.1.1 2.2 2.2.1 2.2.2 2.2.3 2.3 3 3.1 3.2 4 5 6 7 7.1 8 8.1 9 9.1 9.1.1 9.1.2 9.1.3 10 10.1 10.2 10.3 10.3.1 10.3.2 10.4 10.5 10.5.1 10.5.2 10.6 10.6.1 10.6.2 10.6.3 10.6.4 10.6.5 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2 Antenna design benefits . . . . . . . . . . . . . . . . . . 2 Label manufacturer benefit . . . . . . . . . . . . . . . . 2 Supported features . . . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Markets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Mechanical specification . . . . . . . . . . . . . . . . . 7 Wafer specification . . . . . . . . . . . . . . . . . . . . . . 7 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Fail die identification . . . . . . . . . . . . . . . . . . . . 8 Map file distribution. . . . . . . . . . . . . . . . . . . . . . 8 Functional description . . . . . . . . . . . . . . . . . . . 8 Air interface standards . . . . . . . . . . . . . . . . . . . 8 Power transfer . . . . . . . . . . . . . . . . . . . . . . . . . 8 Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Interrogator to tag Link . . . . . . . . . . . . . . . . . . . 9 Tag to interrogator Link . . . . . . . . . . . . . . . . . . . 9 Supported commands . . . . . . . . . . . . . . . . . . . 9 UCODE 7m memory. . . . . . . . . . . . . . . . . . . . 10 UCODE 7m overall memory map . . . . . . . . . . 11 UCODE 7m TID memory details. . . . . . . . . . . 12 Supported features . . . . . . . . . . . . . . . . . . . . . 13 UCODE 7m features control mechanism . . . . 13 Backscatter strength reduction . . . . . . . . . . . . 14 Automatic self pre-serialization of the 96-bit EPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Use cases and benefits . . . . . . . . . . . . . . . . . .16 Parallel encoding . . . . . . . . . . . . . . . . . . . . . . 16 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Use cases and benefits . . . . . . . . . . . . . . . . . .18 Tag Power Indicator . . . . . . . . . . . . . . . . . . . . 18 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 10.6.6 10.6.7 11 12 12.1 12.2 13 14 14.1 14.2 15 16 17 18 18.1 18.2 18.3 18.4 19 20 Use cases and benefits . . . . . . . . . . . . . . . . . . 19 Product Status Flag (PSF) . . . . . . . . . . . . . . 20 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Use cases and benefits . . . . . . . . . . . . . . . . . . 20 Single-slit antenna solution . . . . . . . . . . . . . . 20 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Uses cases and benefits . . . . . . . . . . . . . . . . . 20 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 21 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 22 UCODE 7m bare die characteristics . . . . . . . 22 UCODE 7m SOT886 characteristics . . . . . . . 23 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 24 Packing information . . . . . . . . . . . . . . . . . . . . 25 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 SOT886 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 25 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Revision history . . . . . . . . . . . . . . . . . . . . . . . 28 Legal information . . . . . . . . . . . . . . . . . . . . . . 29 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Contact information . . . . . . . . . . . . . . . . . . . . 30 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 July 2015 307431