MATERIAL DECLARATION SHEET Material Number CD214L-T45CA~170CA Product Line Semiconductor Products Compliance Date RoHS Compliant No. Construction Element(subpart) 2011/01/01 Yes MSL Homogeneous Material Material weight [mg] 1 Dice Silicon 7.358 2 Die attach (Solder) solder paste 13.250 3 Lead frame / Leads / Disc N/A 110.667 4 Molding Compound (Plastic Package Only) Epoxy material 111.333 5 Plating Matte-Tin Total weight This Document was updated on: 1.275 243.883 1 Homogeneous Material\ Substances Silicon Phosphorus Boron Nickel Lead Silicon dioxide Aluminum oxide Tin Lead Silver Copper Iron Phosphorus Silica Epoxy resin Phenolic resin-A,-B Hydroxide metal Carbon black Tin CASRN if applicable Materials Mass % 7440-21-3 7723-14-0 7440-42-8 7440-02-0 7439-92-1 7631-86-9 1344-28-1 7440-31-5 7439-92-1 7440-22-4 7440-50-8 7439-89-6 7723-14-0 14808-60-7 25928-94-3 9003-35-4 N/A 1333-86-4 7440-31-5 60.1800% 0.0100% 0.0100% 14.8000% 12.5000% 10.0000% 2.5000% 5.000% 92.500% 2.500% 99.800% 0.150% 0.050% 76.000% 9.000% 8.000% 6.000% 1.000% 100.000% Material Mass % of total unit wt 1.816% 0.0003% 0.0003% 0.447% 0.377% 0.302% 0.0754% 0.272% 5.025% 0.136% 45.286% 0.068% 0.023% 34.694% 4.109% 3.652% 2.739% 0.457% 0.523% Subpart mass of total wt. (%) 3.017% 5.433% 45.377% 45.650% 0.523% 2015/02/09 (EU) RoHS Directive 2011/65/EU ANNEX Application of lead which are exempted from the requirements 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead) Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2