SMLJ45CA~170CA

MATERIAL DECLARATION SHEET
Material Number
SMLJ45CA~170CA
Product Line
Semiconductors
Compliance Date
RoHS Compliant
No.
Construction
Element(subpart)
2011/01/01
Yes
MSL
Homogeneous
Material
Material
weight [mg]
1
Dice
Silicon
7.358
2
Die attach
(Solder)
Solder paste
13.250
3
Lead frame /
Leads / Disc
N/A
110.667
4
Molding
Compound
(Plastic Package
Only)
Epoxy material
111.333
5
Plating
Matte-Tin
1.275
Total weight
This Document was updated on:
1
Homogeneous
Material\
Substances
Silicon
Phosphorus
Boron
Nickel
Lead-containing glass
Silicon dioxide
Aluminum oxide
Tin
Lead
Silver
Copper
Iron
Phosphorus
Silica
Epoxy resin
Phenolic resin-A,-B
Hydroxide metal
Carbon black
Tin
CASRN
if applicable
Materials
Mass %
7440-21-3
7723-14-0
7440-42-8
7440-02-0
7439-92-1
7631-86-9
1344-28-1
7440-31-5
7439-92-1
7440-22-4
7440-50-8
7439-89-6
7723-14-0
14808-60-7
25928-94-3
9003-35-4
21645-51-2
1333-86-4
7440-31-5
60.18
0.01
0.01
14.80
12.50
10.00
2.50
5.00
92.50
2.50
99.80
0.15
0.05
76.00
9.00
8.00
6.00
1.00
100.00
Material
Mass % of
total unit wt
1.8157
0.0003
0.0003
0.4465
0.3771
0.3017
0.0754
0.272
5.025
0.136
45.286
0.068
0.023
34.694
4.1085
3.652
2.739
0.4565
0.523
Subpart
mass of total
wt. (%)
3.017
5.433
45.377
45.650
0.523
243.883
2015/02/09
(EU) RoHS Directive 2011/65/EU Application of lead which are exempted from the requirements:
7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead);
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound.
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