MATERIAL DECLARATION SHEET Material Number SMLJ45CA~170CA Product Line Semiconductors Compliance Date RoHS Compliant No. Construction Element(subpart) 2011/01/01 Yes MSL Homogeneous Material Material weight [mg] 1 Dice Silicon 7.358 2 Die attach (Solder) Solder paste 13.250 3 Lead frame / Leads / Disc N/A 110.667 4 Molding Compound (Plastic Package Only) Epoxy material 111.333 5 Plating Matte-Tin 1.275 Total weight This Document was updated on: 1 Homogeneous Material\ Substances Silicon Phosphorus Boron Nickel Lead-containing glass Silicon dioxide Aluminum oxide Tin Lead Silver Copper Iron Phosphorus Silica Epoxy resin Phenolic resin-A,-B Hydroxide metal Carbon black Tin CASRN if applicable Materials Mass % 7440-21-3 7723-14-0 7440-42-8 7440-02-0 7439-92-1 7631-86-9 1344-28-1 7440-31-5 7439-92-1 7440-22-4 7440-50-8 7439-89-6 7723-14-0 14808-60-7 25928-94-3 9003-35-4 21645-51-2 1333-86-4 7440-31-5 60.18 0.01 0.01 14.80 12.50 10.00 2.50 5.00 92.50 2.50 99.80 0.15 0.05 76.00 9.00 8.00 6.00 1.00 100.00 Material Mass % of total unit wt 1.8157 0.0003 0.0003 0.4465 0.3771 0.3017 0.0754 0.272 5.025 0.136 45.286 0.068 0.023 34.694 4.1085 3.652 2.739 0.4565 0.523 Subpart mass of total wt. (%) 3.017 5.433 45.377 45.650 0.523 243.883 2015/02/09 (EU) RoHS Directive 2011/65/EU Application of lead which are exempted from the requirements: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead); 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1