MATERIAL DECLARATION SHEET Material Number SMBJ5.0A~376A, SMBJ5.0CA~170CA Product Line Semiconductors Compliance Date 2011/01/01 RoHS Compliant No. 1 Yes Construction Element(subpart) Dice MSL 1 Homogeneous Material Material weight [mg] Silicon 2.350 Homogeneous Material\ Substances Silicon Phosphorus Boron Nickel Lead-containing glass 2 High-melting point Solder paste solder paste 2.150 3 Lead frame / Leads / Disc N/A 33.50 4 5 Molding Compound Epoxy material (Plastic Package Only) Plating Matte-Tin Total Weight This Document was updated on: 2015/02/09 (EU) RoHS Directive 2011/65/EU 53.50 1.011 92.511 Silicon dioxide Aluminum oxide Tin Lead Silver Copper Iron Phosphorus Silica Epoxy resin Phenolic resin-A,-B Hydroxide metal Carbon black Tin applicable Materials Mass % 7440-21-3 7723-14-0 7440-42-8 7440-02-0 7439-92-1 7631-86-9 1344-28-1 7440-31-5 7439-92-1 7440-22-4 7440-50-8 7439-89-6 7723-14-0 14808-60-7 25928-94-3 9003-35-4 21645-51-2 1333-86-4 7440-31-5 60.18 0.01 0.01 14.80 12.50 10.00 2.50 5.00 92.50 2.50 99.80 0.15 0.05 76.00 9.00 8.00 6.00 1.00 100.00 CASRN if Material Mass % of total unit wt. 1.5286 0.00025 0.00025 0.3759 0.3175 0.254 0.0635 0.116 2.150 0.058 36.140 0.054 0.018 43.952 5.205 4.626 3.470 0.578 1.093 Subpart mass of total wt. (%) 2.540 2.324 36.212 57.831 1.093 Application of lead which are exempted from the requirements: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead) 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1