SMBJ5.0A~376A, SMBJ5.0CA~170CA

MATERIAL DECLARATION SHEET
Material Number
SMBJ5.0A~376A, SMBJ5.0CA~170CA
Product Line
Semiconductors
Compliance Date
2011/01/01
RoHS Compliant
No.
1
Yes
Construction
Element(subpart)
Dice
MSL
1
Homogeneous Material
Material
weight [mg]
Silicon
2.350
Homogeneous
Material\
Substances
Silicon
Phosphorus
Boron
Nickel
Lead-containing glass
2
High-melting point
Solder paste
solder paste
2.150
3
Lead frame / Leads /
Disc
N/A
33.50
4
5
Molding Compound
Epoxy material
(Plastic Package Only)
Plating
Matte-Tin
Total Weight
This Document was updated on: 2015/02/09
(EU) RoHS Directive 2011/65/EU
53.50
1.011
92.511
Silicon dioxide
Aluminum oxide
Tin
Lead
Silver
Copper
Iron
Phosphorus
Silica
Epoxy resin
Phenolic resin-A,-B
Hydroxide metal
Carbon black
Tin
applicable
Materials
Mass %
7440-21-3
7723-14-0
7440-42-8
7440-02-0
7439-92-1
7631-86-9
1344-28-1
7440-31-5
7439-92-1
7440-22-4
7440-50-8
7439-89-6
7723-14-0
14808-60-7
25928-94-3
9003-35-4
21645-51-2
1333-86-4
7440-31-5
60.18
0.01
0.01
14.80
12.50
10.00
2.50
5.00
92.50
2.50
99.80
0.15
0.05
76.00
9.00
8.00
6.00
1.00
100.00
CASRN if
Material Mass
% of total unit
wt.
1.5286
0.00025
0.00025
0.3759
0.3175
0.254
0.0635
0.116
2.150
0.058
36.140
0.054
0.018
43.952
5.205
4.626
3.470
0.578
1.093
Subpart mass
of total wt. (%)
2.540
2.324
36.212
57.831
1.093
Application of lead which are exempted from the requirements:
7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead)
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound.
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