DATASHEET

DATASHEET
40V, Low Quiescent Current, 150mA Linear Regulator
for Automotive Applications
ISL78301
Features
The ISL78301 is a high voltage, low quiescent current linear
regulator ideally suited for “always-on” and “keep alive”
automotive applications. The ISL78301 operates from an input
voltage of +6V to +40V under normal operating conditions and
operates down to +3V under a cold crank. It consumes only 18µA
of quiescent current at no load on the adjustable version.
• Optimized for “always-on” automotive applications
The ISL78301 is available in a fixed 3.3V, 5V and adjustable
output voltage (2.5V to 12V) options. It features an EN pin that
can be used to put the device into a low-quiescent current
shutdown mode where it draws only 2µA of supply current. The
device features over-temperature shutdown and current limit
protection.
• 2µA of typical shutdown current
The ISL78301 is AEC-Q100 qualified. It is rated over the -40°C to
+125°C automotive temperature range and is available in a
14 Ld HTSSOP with an exposed pad package.
• 18µA typical quiescent current
• Guaranteed 150mA output current
• Operates through cold crank down to 3V
• 40V tolerant logic level (TTL/CMOS) enable input
• Low dropout voltage of 295mV at 150mA
• Fixed +3.3V, +5.0V and adjustable output voltage options
• Stable operation with 10µF output capacitor
• Thermal shutdown and current limit protection
• -40°C to +125°C operating temperature range
• Thermally enhanced 14 Ld exposed pad HTSSOP package
• AEC-Q100 qualified
Applications
• 5kV ESD HBM rated
• Automotive
• Pb-free (RoHS compliant)
• Industrial
• Telecommunications
VIN = 14V
CIN
0.1µF
R1
EN
(ISL78301)
VIN = 14V
VOUT = 12V
OUT
IN
COUT
10µF
OUT
IN
VOUT = 5V
COUT
10µF
CIN
0.1µF
ADJ
EN
(ISL78301)
R2
GND
GND
FIGURE 2. TYPICAL APPLICATION - FIXED VERSION
FIGURE 1. TYPICAL APPLICATION - ADJ VERSION
QUIESCENT CURRENT (µA)
25
20
15
10
5
0
-50
0
50
TEMPERATURE (°C)
100
150
FIGURE 3. QUIESCENT CURRENT vs LOAD CURRENT (ADJ VERSION AT UNITY GAIN) VIN = 14V
April 7, 2015
FN6705.2
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2011, 2013, 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
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ISL78301
Block Diagram
VIN
EN
CONTROL
LOGIC
+
THERMAL
SENSOR
EA
FET DRIVER
WITH CURRENT
LIMIT
REFERENCE
+
SOFT-START
VOUT
ADJ
GND
Pin Configuration
ISL78301
(14 LD HTSSOP)
TOP VIEW
NC 1
14 OUT
IN 2
13 NC
NC 3
NC 4
12 ADJ/NC
THERMAL
PAD
11 NC
NC 5
10 NC
NC 6
9 NC
EN 7
8 GND
Pin Descriptions
PIN NUMBER
PIN NAME
1, 3, 4, 5, 6, 9, 10,
11, 13
NC
DESCRIPTION
Pins have internal termination and can be left unconnected. Connection to ground is optional.
2
IN
Input voltage pin. A minimum 0.1µF ceramic capacitor is required for proper operation.
7
EN
Enable pin. High on this pin enables the device.
8
GND
12
ADJ/NC
14
OUT
Ground pin.
In the adjustable output voltage option, this pin is connected to the external feedback resistor divider which sets
the LDO output voltage. In the 3.3V and 5V options, this pin is not used and can be connected to ground.
Regulated output voltage. A 10µF ceramic capacitor is required for stability.
EPAD
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It is recommended to solder the EPAD to the ground plane.
2
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ISL78301
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
ENABLE
PIN
OUTPUT VOLTAGE
(V)
PACKAGE
(Pb-Free)
PKG.
DWG. #
3.3
14 Ld HTSSOP
M14.173B
ISL78301FVEAZ
78301 FVEAZ
-40 to +125
Yes
ISL78301FVEBZ
78301 FVEBZ
-40 to +125
Yes
5.0
14 Ld HTSSOP
M14.173B
ISL78301FVECZ
78301 FVECZ
-40 to +125
Yes
ADJ
14 Ld HTSSOP
M14.173B
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see product information page for ISL78301. For more information on MSL please see techbrief TB363.
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ISL78301
Absolute Maximum Ratings
Thermal Information
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +45V
IN Pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to VCC
OUT Pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . .. . .GND - 0.3V to 16V
ADJ Pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .GND - 0.3V to 3V
EN Pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to VCC
Output Short-circuit Duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating
Human Body Model (Tested per JESD22-A114E) . . . . . . . . . . . . . . . . 5kV
Machine Model (Tested per JESD-A115-A) . . . . . . . . . . . . . . . . . . . 200V
Charge Device Model (Tested per AEC-Q100-011) . . . . . . . . . . . . . 2.2kV
Latch-up (Tested per JESD78B; Class II, Level A) . . . . . . . . . . . . . . . 100mA
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
14 Ld HTSSOP Package (Notes 4, 5) . . . . .
37
5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +175°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
IN Pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+3V to +40V
OUT Pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+2.5V to +12V
EN Pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to +40V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Recommended Operating Conditions, unless otherwise noted. VIN = 14V, IOUT = 1mA, CIN = 0.1μF,
COUT = 10μF, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical specifications are at TA = +25°C. Boldface limits apply across the operating
temperature range, -40°C to +125°C.
PARAMETER
SYMBOL
Input Voltage Range
TEST CONDITIONS
VIN
Cold Crank condition
Guaranteed Output
Current
IOUT
VIN = VOUT + VDO
Output Voltage
VOUT
EN = High
VIN = 14V
IOUT = 0.1mA to 150mA
Line Regulation
VOUT/VIN
Load Regulation
VOUT/IOUT VIN = VOUT +VDO
IOUT = 100µA to 150mA
Dropout Voltage
(Note 6)
VDO
EN = High
VIN = 14V
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4
V
40
V
mA
3.333
V
5V Version
4.950
5
5.050
V
ADJ pin voltage
1.211
1.223
1.235
V
0.04
0.15
%
0.3
0.6
%
7
33
mV
380
525
mV
7
33
mV
295
460
mV
2
3.64
µA
IOUT = 0mA, ADJ Version, VOUT = VADJ
18
24
µA
IOUT = 1mA, ADJ Version, VOUT = VADJ
22
42
µA
IOUT = 10mA, ADJ Version, VOUT = VADJ
34
60
µA
IOUT =150mA, ADJ Version, VOUT = VADJ
90
125
µA
IOUT = 0, 3.3V and 5.0V Versions
22
28
µA
IOUT = 1mA, 3.3V and 5.0V Versions
27
45
µA
IOUT = 10mA, 3.3V and 5.0V Versions
39
65
µA
IOUT = 150mA, 3.3V and 5.0V Versions
96
142
µA
IOUT = 150mA, VOUT = 5V
IQ
40
3
3.3
IOUT = 1mA, VOUT = 5V
Quiescent Current
6
3.267
IOUT = 150mA, VOUT = 3.3V
EN = LOW
MAX
(Note 8) UNIT
3.3V Version
IOUT = 1mA, VOUT = 3.3V
ISHDN
TYP
150
3V  VIN  40V
IOUT = 1mA
Shutdown Current
MIN
(Note 8)
FN6705.2
April 7, 2015
ISL78301
Electrical Specifications
Recommended Operating Conditions, unless otherwise noted. VIN = 14V, IOUT = 1mA, CIN = 0.1μF,
COUT = 10μF, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical specifications are at TA = +25°C. Boldface limits apply across the operating
temperature range, -40°C to +125°C. (Continued)
PARAMETER
SYMBOL
Power Supply
Rejection Ratio
PSRR
TEST CONDITIONS
MIN
(Note 8)
TYP
f = 100Hz; VIN_RIPPLE = 500mVP-P; Load = 150mA, 3.3V and 5V Versions
55
f = 100Hz; VIN_RIPPLE = 500mVP-P; Load = 150mA, ADJ Version, VOUT = VADJ
66
MAX
(Note 8) UNIT
dB
EN FUNCTION
EN Threshold Voltage
VEN_H
VOUT = Off to On
VEN_L
VOUT = On to Off
EN Pin Current
IEN
EN to Regulation Time
(Note 7)
tEN
1.485
0.975
VOUT = 0V
V
V
0.026
1.65
µA
1.93
ms
PROTECTION FEATURES
Output Current Limit
ILIMIT
VOUT = 0V
Thermal Shutdown
TSHDN
Junction Temperature Rising
Thermal Shutdown
Hysteresis
THYST
175
410
mA
+165
°C
+20
°C
NOTES:
6. Dropout voltage is defined as (VIN - VOUT) when VOUT is 2% below the value of VOUT when VIN = VOUT + 3V.
7. Enable to Regulation is the time the output takes to reach 95% of its final value with VIN = 14V and EN is taken from VIL to VIH in 5ns. For the
adjustable versions, the output voltage is set at 5V.
8. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
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ISL78301
Typical Performance Curves
VIN = 14V, IOUT = 1mA, VOUT = 5V, TJ = +25°C unless otherwise specified.
120
30
100
+125°C
QUIESCENT CURRENT (µA)
QUIESCENT CURRENT (µA)
+125°C
80
60
-40°C
40
+25°C
20
20
+25°C
0
50
100
LOAD CURRENT (mA)
150
-40°C
15
10
5
0
0
0
10
20
INPUT VOLTAGE (V)
30
40
FIGURE 5. QUIESCENT CURRENT vs INPUT VOLTAGE (NO LOAD)
FIGURE 4. QUIESCENT CURRENT vs LOAD CURRENT
3.0
0.010
OUTPUT VOLTAGE VARIATION (%)
SHUTDOWN CURRENT (µA)
25
2.5
VIN = 40V
2.0
1.5
VIN = 14V
1.0
0.5
0
-50
0
50
TEMPERATURE (°C)
100
150
FIGURE 6. SHUTDOWN CURRENT vs TEMPERATURE (EN = 0)
0.005
5V OPTION
0
-0.005
-0.010
-50
3.3V OPTION
0
50
TEMPERATURE (°C)
100
150
FIGURE 7. OUTPUT VOLTAGE vs TEMPERATURE (LOAD = 50mA)
5.20
500mV/DIV
OUTPUT VOLTAGE (V)
5.15
EN
5.10
+125°C
5.05
1V/DIV
+25°C
5.00
VOUT
4.95
TIME = 500µs/DIV
-40°C
4.90
4.85
4.80
0
50
100
LOAD CURRENT (mA)
FIGURE 8. OUTPUT VOLTAGE vs LOAD CURRENT
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6
150
FIGURE 9. START-UP WAVEFORM
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ISL78301
Typical Performance Curves
VIN = 14V, IOUT = 1mA, VOUT = 5V, TJ = +25°C unless otherwise specified. (Continued)
70
60
TIME = 5ms/DIV
VOUT = 3.3V
PSRR (dB)
50
40
VOUT
100mV/DIV
VOUT = 5V
30
50mA
20
IOUT 0mA
10
0
100
1k
10k
FREQUENCY (Hz)
100k
1M
FIGURE 10. POWER SUPPLY REJECTION RATIO (LOAD = 150mA)
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FIGURE 11. LOAD TRANSIENT RESPONSE
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ISL78301
Functional Description
OUT
IN
Functional Overview
The ISL78301 is a high performance, high voltage, low-dropout
regulator (LDO) with 150mA sourcing capability. The part is
qualified to operate over the -40°C to +125°C automotive
temperature range. Featuring ultra-low quiescent current, it
makes an ideal choice for “always-on” automotive applications. It
works well under a “load-dump condition” where the input
voltage could rise up to 40V. The LDO continues to operate down
to 3V under a “cold-crank” condition. The device also features
current limit and thermal shutdown protection.
CIN
0.1µF
R1
EN
(ISL78301)
R2
FIGURE 12. ADJUSTABLE VERSION
The output voltage is calculated using Equation 1:
Enable Control
The ISL78301 has an enable pin which turns the device on when
pulled high. When EN is low, the IC goes into shutdown mode and
draws less than 2µA.
Power Dissipation
Thermal Fault Protection
In the event that the die temperature exceeds a typical value of
+165°C, the output of the LDO will shut down until the die
temperature cools down to a typical +145°C. The level of power
dissipated, combined with the ambient temperature and the
thermal impedance of the package, determines if the junction
temperature exceeds the thermal shutdown temperature. See
“Power Dissipation” for more details.
Application Information
Input and Output Capacitors
A minimum 0.1µF ceramic capacitor is recommended at the
input for proper operation. For the output, a ceramic capacitor
with a capacitance of 10µF is recommended for the ISL78301 to
maintain stability. The ground connection of the output capacitor
should be routed directly to the GND pin of the device and also
placed close to the IC.
Output Voltage Setting
For the adjustable version of the ISL78301, the output voltage is
programmed using an external resistor divider as shown in
Figure 12.
(EQ. 1)
The junction temperature must not exceed the range specified in
“Recommended Operating Conditions” on page 4. The power
dissipation can be calculated using Equation 2:
P D =  V IN – V OUT   I OUT + V IN  I GND
(EQ. 2)
The maximum allowable junction temperature, TJ(MAX) and the
maximum expected ambient temperature, TA(MAX) will determine
the maximum allowable junction temperature rise (TJ), as shown
in Equation 3:
T J = T J  MAX  – T A  MAX 
(EQ. 3)
To calculate the maximum ambient operating temperature, use
the junction-to-ambient thermal resistance (JA) as shown in
Equation 4:
T J  MAX  = P D  MAX  x  JA + T A
(EQ. 4)
Board Layout Recommendations
A good PCB layout is important to achieve expected
performance. Consideration should be taken when placing the
components and routing the trace to minimize the ground
impedance and keep the parasitic inductance low. The input and
output capacitors should have a good ground connection and be
placed as close to the IC as possible. The feedback trace in the
adjustable version should be away from other noisy traces.
The 14 Ld HTSSOP package uses the copper area on the PCB as
a heatsink. The EPAD of this package must be soldered to the
copper plane (GND plane) for effective heat dissipation.
Figure 13 shows a curve for JA of the package for different
copper area sizes.
38
THETA-JA, C/W
The ISL78301 has internal current limiting functionality to
protect the regulator during fault conditions. During current limit,
the output sources a fixed amount of current largely independent
of the output voltage. If the short or overload is removed from
VOUT, the output returns to normal voltage regulation mode.
ADJ
GND
 R1

V OUT = 1.223V   ------- + 1
 R2

Current Limit Protection
COUT
10µF
36
34
32
30
28
26
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160
EPAD-MOUNT COPPER LAND AREA ON PCB, mm2
FIGURE 13. JA vs EPAD-MOUNT COPPER LAND AREA ON PCB
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ISL78301
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
April 7, 2015
FN6705.2
CHANGE
“Absolute Maximum Ratings” on page 4
Charged device Model(tested per JESD22-C101C)....2.2kV to
Charged device Model(tested per AEC-Q100-011).....2.2kV
December 7, 2013
FN6705.1
Page 9 - 2nd line of the disclaimer changed from:
"Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted"
to:
"Intersil Automotive Qualified products are manufactured, assembled and tested utilizing TS16949
quality systems as noted".
October 21, 2011
FN6705.0
Initial Release.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
For additional products, see www.intersil.com/en/products.html
Intersil Automotive Qualified products are manufactured, assembled and tested utilizing TS16949 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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ISL78301
Package Outline Drawing
M14.173B
14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 1, 1/10
A
1
3
3.10 ±0.10
5.00 ±0.10
8
14
SEE
DETAIL "X"
6.40
PIN #1
I.D. MARK
4.40 ±0.10
2
3.00 ±0.10
3
0.20 C B A
1
7
B
0.65
EXPOSED THERMAL PAD
0.15 +0.05/-0.06
BOTTOM VIEW
END VIEW
TOP VIEW
1.00 REF
H
0.05
C
1.20 MAX
SEATING
PLANE
0.25 +0.05/-0.06
0.10 C
0.10
0.90 +0.15/-0.10
GAUGE
PLANE
5
CBA
0°-8°
0.05 MIN
0.15 MAX
SIDE VIEW
0.25
0.60 ±0.15
DETAIL "X"
(3.10)
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
(5.65)
(3.00)
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion.
Allowable protrusion shall be 0.80mm total in excess of dimension at
maximum material condition.
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
Minimum space between protrusion and adjacent lead is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation ABT-1.
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