Fully Accurate, 12-/14-/16-Bit VOUT nanoDAC, Quad, SPI Interface, 4.5 V to 5.5 V in TSSOP AD5024/AD5044/AD5064 FEATURES GENERAL DESCRIPTION Low power quad 12-/14-/16-bit DAC, ±1 LSB INL Individual and common voltage reference pin options Rail-to-rail operation 4.5 V to 5.5 V power supply Power-on reset to zero-scale or midscale 3 power-down functions Per-channel power-down Low glitch on power-up Hardware LDAC with LDAC override function CLR function to programmable code 16-lead TSSOP Internal reference buffer and internal output amplifier The AD5024/AD5044/AD5064 are low power, quad 12-/14-/ 16-bit buffered voltage output nanoDAC® DACs that offer relative accuracy specifications of 1 LSB INL with individual reference pins and can operate from a single 4.5 V to 5.5 V supply. The AD5024/AD5044/AD5064 parts also offer a differential accuracy specification of ±1 LSB. The parts use a versatile 3-wire, low power Schmitt trigger serial interface that operates at clock rates up to 50 MHz and is compatible with standard SPI, QSPI™, MICROWIRE™, and DSP interface standards. A reference buffer is also provided on-chip. The AD5024/AD5044/AD5064 incorporate a power-on reset circuit that ensures the DAC output powers up to zero scale or midscale and remains there until a valid write takes place to the device. The AD5024/AD5044/ AD5064 contain a power-down feature that reduces the current consumption of the device to typically 400 nA at 5 V and provides software selectable output loads while in power-down mode. Total unadjusted error for the parts is <2 mV. APPLICATIONS Process control Data acquisition systems Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators PRODUCT HIGHLIGHTS 1. 2. 3. 4. 5. Table 1. Related Devices Part No. AD5666 AD5063/AD5062 AD5061 AD5060/AD5040 Description Quad,16-bit buffered DAC,16 LSB INL, TSSOP 16-bit nanoDAC, 1 LSB INL 16-/14-bit nanoDAC, 4 LSB INL, SOT-23 16-/14-bit nanoDAC, 1 LSB INL, SOT-23 Quad channel available in 16-lead TSSOP package. 16-bit accurate, 1 LSB INL. Low glitch on power-up. High speed serial interface with clock speeds up to 50 MHz. Reset to known output voltage (zero scale or midscale). FUNCTIONAL BLOCK DIAGRAM VREF A VREF B VDD LDAC INPUT REGISTER DAC REGISTER DAC A INPUT REGISTER DAC REGISTER DAC B INPUT REGISTER DAC REGISTER DAC C INPUT REGISTER DAC REGISTER DAC D SCLK SYNC INTERFACE LOGIC DIN VOUTA BUFFER VOUTB BUFFER VOUTC BUFFER VOUTD POWER-DOWN LOGIC POWER-ON RESET LDAC CLR BUFFER POR VREF C VREF D GND 06803-001 AD5024/ AD5044/ AD5064 Figure 1. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved. AD5024/AD5044/AD5064 TABLE OF CONTENTS Features .............................................................................................. 1 Output Amplifier........................................................................ 18 Applications ....................................................................................... 1 Serial Interface ............................................................................ 18 General Description ......................................................................... 1 Standalone Mode ........................................................................ 18 Product Highlights ........................................................................... 1 Input Shift Register .................................................................... 19 Functional Block Diagram .............................................................. 1 SYNC Interrupt .......................................................................... 19 Revision History ............................................................................... 2 Power-On Reset .......................................................................... 20 Specifications..................................................................................... 3 Power-Down Modes .................................................................. 20 AC Characteristics........................................................................ 5 Clear Code Register ................................................................... 21 Timing Characteristics ................................................................ 6 LDAC Function .......................................................................... 21 Absolute Maximum Ratings............................................................ 7 Power Supply Bypassing and Grounding ................................ 21 ESD Caution .................................................................................. 7 Microprocessor Interfacing ....................................................... 23 Pin Configuration and Function Descriptions ............................. 8 Applications..................................................................................... 24 Typical Performance Characteristics ............................................. 9 Using a Reference as a Power Supply ....................................... 24 Terminology .................................................................................... 16 Bipolar Operation....................................................................... 24 Theory of Operation ...................................................................... 18 DAC Section ................................................................................ 18 Using the AD5024/AD5044/AD5064 with a Galvanically Isolated Interface ................................................. 24 DAC Architecture ....................................................................... 18 Outline Dimensions ....................................................................... 25 Reference Buffer ......................................................................... 18 Ordering Guide .......................................................................... 25 REVISION HISTORY 8/08—Revision 0: Initial Version Rev. 0 | Page 2 of 28 AD5024/AD5044/AD5064 SPECIFICATIONS VDD = 4.5 V to 5.5 V, RL = 5 kΩ to GND, CL = 200 pF to GND, 2.5 V ≤ VREFIN ≤ VDD, unless otherwise specified. All specifications TMIN to TMAX, unless otherwise noted. Table 2. Parameter STATIC PERFORMANCE 3 Resolution B Grade 1 Min Typ Max A Grade1, 2 Min Typ Max Unit Conditions/Comments 16 14 12 16 Bits AD5064 AD5044 AD5024 AD5064; TA = −40°C to +105°C AD5064; TA = −40°C to +125°C AD5044; TA = −40°C to +105°C AD5044; TA = −40°C to +125°C AD5024; TA = −40°C to +105°C AD5024; TA = −40°C to +125°C Relative Accuracy Differential Nonlinearity Offset Error ±0.5 +0.5 ±0.25 ±0.25 ±0.12 ±0.12 ±0.2 ±0.2 Offset Error Drift 4 Full-Scale Error Gain Error Gain Temperature Coefficient4 DC Crosstalk ±2 ±0.01 ±0.005 ±1 40 ±1 ±2 ±0.5 ±1 ±0.25 ±0.5 ±1 ±1.8 ±0.5 ±0.5 0 LSB ±0.2 ±0.2 ±2 ±0.01 ±0.005 ±1 40 ±0.07 ±0.05 Power-Up Time DC PSRR REFERENCE INPUTS Reference Input Range Reference Current Reference Input Impedance LOGIC INPUTS Input Current 5 Input Low Voltage, VINL Input High Voltage, VINH Pin Capacitance4 ±1 ±1.8 ±0.07 ±0.05 40 40 VDD LSB LSB 40 0.5 OUTPUT CHARACTERISTICS4 Output Voltage Range Capacitive Load Stability DC Output Impedance Normal Mode Power-Down Mode Output Connected to 100 kΩ Network Output Connected to 1 kΩ Network Short-Circuit Current ±4 ±4 All 1s loaded to DAC register. VREF < VDD μV/mA μV Of FSR/°C Due to single channel full-scale output change, RL = 5 kΩ to GND or VDD Due to load current change Due to powering down (per channel) RL = 5 kΩ, RL =100 kΩ, and RL = ∞ 1 V nF 0.5 0.5 Ω 100 100 kΩ Output impedance tolerance ± 400 Ω 1 1 kΩ Output impedance tolerance ± 20 Ω 60 45 4.5 60 45 4.5 mA mA μs −92 −92 dB DAC = full scale, output shorted to GND DAC = zero-scale, output shorted to VDD Time to exit power-down mode to normal mode of AD5024/AD5044/AD5064, 32nd clock edge to 90% of DAC midscale value, output unloaded VDD ± 10%, DAC = full scale. VREF < VDD VDD 50 V μA kΩ Per DAC channel Individual reference option ±1 0.8 μA V V pF 35 120 VDD 50 VDD μV/°C % FSR % FSR ppm μV Code 512 (AD5064), Code 128 (AD5044), Code 32 (AD5024) loaded to DAC register 1 2.5 0 LSB mV 2.5 35 120 ±1 0.8 2.2 2.2 4 4 Rev. 0 | Page 3 of 28 AD5024/AD5044/AD5064 Parameter POWER REQUIREMENTS VDD IDD 6 Normal Mode All Power-Down Modes 7 B Grade 1 Min Typ Max A Grade1, 2 Min Typ Max Unit Conditions/Comments 4.5 4.5 5.5 V DAC active, excludes load current VIH = VDD and VIL = GND 6 2 30 mA μA μA 5.5 3 0.4 6 2 30 3 0.4 1 TA = −40°C to +105°C TA = −40°C to +125°C Temperature range is −40°C to +125°C, typical at 25°C. A grade offered in AD5064 only. Linearity calculated using a reduced code range—AD5064: Code 512 to Code 65,024; AD5044: Code 128 to Code 16,256; AD5024: Code 32 to Code 4064. Output unloaded. 4 Guaranteed by design and characterization; not production tested. 5 Current flowing into individual digital pins. 6 Interface inactive. All DACs active. DAC outputs unloaded. 7 All four DACs powered down. 2 3 Rev. 0 | Page 4 of 28 AD5024/AD5044/AD5064 AC CHARACTERISTICS VDD = 4.5 V to 5.5 V, RL = 5 kΩ to GND, CL = 200 pF to GND, 2.5 V ≤ VREFIN ≤ VDD. All specifications TMIN to TMAX, unless otherwise noted. Table 3. Parameter 1, 2 Output Voltage Settling Time Slew Rate Digital-to-Analog Glitch Impulse Reference Feedthrough Digital Feedthrough Digital Crosstalk Analog Crosstalk DAC-to-DAC Crosstalk AC Crosstalk Multiplying Bandwidth Total Harmonic Distortion Output Noise Spectral Density Output Noise Min Typ 5.8 Max 8 Unit μs 10.7 13 μs 1.5 3 −90 0.1 1.9 2 3.5 6 340 −80 64 60 6 V/μs nV-s dB nV-s nV-s nV-s nV-s nV-s kHz dB nV/√Hz nV/√Hz μV p-p Conditions/Comments 3 ¼ to ¾ scale and ¾ to ¼ scale settling to ±1 LSB, RL = 5 kΩ, single channel update including DAC calibration sequence ¼ to ¾ scale and ¾ to ¼ scale settling to ±1 LSB, RL = 5 kΩ, all channel update including DAC calibration sequence 1 LSB change around major carry VREF = 3 V ± 0.86 V p-p, frequency = 100 Hz to 100 kHz VREF = 3 V ± 0.86 V p-p VREF = 3 V ± 0.2 V p-p, frequency = 10 kHz DAC code = 0x8400, 1 kHz DAC code = 0x8400, 10 kHz 0.1 Hz to 10 Hz 1 Guaranteed by design and characterization; not production tested. See the Terminology section. 3 Temperature range is −40°C to +125°C, typical at 25°C. 2 Rev. 0 | Page 5 of 28 AD5024/AD5044/AD5064 TIMING CHARACTERISTICS All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See Figure 2. VDD = 4.5 V to 5.5 V. All specifications TMIN to TMAX, unless otherwise noted. Table 4. Limit at TMIN, TMAX; VDD = 4.5 V to 5.5 V 20 10 10 16.5 5 5 0 1.9 10.5 17 20 20 10 10 10.6 Parameter 1 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 Conditions/Comments SCLK cycle time SCLK high time SCLK low time SYNC to SCLK falling edge setup time Data setup time Data hold time SCLK falling edge to SYNC rising edge Minimum SYNC high time (single channel update) Minimum SYNC high time (all channel update) SYNC rising edge to SCLK fall ignore LDAC pulse width low SCLK falling edge to LDAC rising edge CLR pulse width low SCLK falling edge to LDAC falling edge CLR pulse activation time Guaranteed by design and characterization; not production tested. t1 t9 SCLK t8 t3 t4 t2 t7 SYNC t5 DIN t6 DB23 DB0 t13 t10 LDAC1 t11 LDAC2 CLR VOUT t12 t14 06803-003 1 Unit ns min ns min ns min ns min ns min ns min ns min μs min μs min ns min ns min ns min ns min ns min μs min 1ASYNCHRONOUS LDAC UPDATE MODE. 2SYNCHRONOUS LDAC UPDATE MODE. Figure 2. Serial Write Operation Rev. 0 | Page 6 of 28 AD5024/AD5044/AD5064 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 5. Parameter VDD to GND Digital Input Voltage to GND VOUT to GND VREF to GND Operating Temperature Range Industrial Storage Temperature Range Junction Temperature (TJ MAX) TSSOP Package Power Dissipation θJA Thermal Impedance Reflow Soldering Peak Temperature Pb Free Rating −0.3 V to +7 V −0.3 V to VDD + 0.3 V −0.3 V to VDD + 0.3 V −0.3 V to VDD + 0.3 V −40°C to +125°C −65°C to +150°C 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION (TJ MAX − TA)/θJA 113°C/W 260°C Rev. 0 | Page 7 of 28 AD5024/AD5044/AD5064 LDAC 1 16 SCLK SYNC 2 15 DIN VDD 3 14 GND VREF B 4 13 VOUTB VREF A 5 VOUTA 6 VOUTC POR AD5024/ AD5044/ AD5064 12 VOUTD 11 VREF D 7 10 CLR 8 9 TOP VIEW (Not to Scale) VREF C 06803-005 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 3. 16-Lead TSSOP (RU-16) Pin Configuration Table 6. Pin Function Descriptions Pin No. 1 Mnemonic LDAC 2 SYNC 3 VDD 4 5 6 7 8 VREFB VREFA VOUTA VOUTC POR 9 10 VREFC CLR 11 12 13 14 15 VREFD VOUTD VOUTB GND DIN 16 SCLK Description Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data. This allows all DAC outputs to simultaneously update. Alternatively, this pin can be tied permanently low. Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is transferred in on the falling edges of the next 32 clocks. If SYNC is taken high before the 32nd falling edge, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the device. Power Supply Input. These parts can be operated from 4.5 V to 5.5 V, and the supply should be decoupled with a 10 μF capacitor in parallel with a 0.1 μF capacitor to GND. DAC B Reference Input. This is the reference voltage input pin for DAC B. DAC A Reference Input. This is the reference voltage input pin for DAC A. Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation. Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation. Power-On Reset. Tying this pin to GND powers up the part to 0 V. Tying this pin to VDD powers up the part to midscale. DAC C Reference Input .This is the reference voltage input pin for DAC C. Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all LDAC pulses are ignored. When CLR is activated, the input register and the DAC register are updated with the data contained in the CLR code register—zero, midscale, or full scale. Default setting clears the output to 0 V. DAC D Reference Input .This is the reference voltage input pin for DAC D. Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation. Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation. Ground Reference Point for All Circuitry on the Part. Serial Data Input. This device has a 32-bit shift register. Data is clocked into the register on the falling edge of the serial clock input. Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be transferred at rates of up to 50 MHz. Rev. 0 | Page 8 of 28 AD5024/AD5044/AD5064 1.0 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0 –0.2 0 –0.2 –0.4 –0.4 –0.6 –0.6 –0.8 –1.0 512 16,640 32,768 48,896 06803-022 DNL (LSB) 1.0 06803-019 INL (LSB) TYPICAL PERFORMANCE CHARACTERISTICS –0.8 –1.0 512 65,024 16,640 DAC CODE 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0 –0.2 –0.4 –0.6 –0.8 1536 2048 2560 16,384 12,288 16,384 –0.2 –0.4 1024 12,288 0 –0.6 512 65,024 3072 3584 06803-023 DNL (LSB) 1.0 0.8 06803-020 INL (LSB) 1.0 0 48,896 Figure 7. AD5064 DNL Figure 4. AD5064 INL –1.0 32,768 DAC CODE –0.8 –1.0 4096 0 4096 8192 DAC CODE DAC CODE Figure 8. AD5044 DNL Figure 5. AD5044 INL 1.0 1.00 0.8 0.75 0.6 0.50 0.25 DNL (LSB) 0.2 0 –0.2 0 –0.25 –0.4 –0.50 –0.6 0 512 1024 1536 2048 2560 3072 3584 –1.00 4096 06803-024 –0.8 –1.0 –0.75 06803-021 INL (LSB) 0.4 0 4096 8192 DAC CODE DAC CODE Figure 9. AD5024 DNL Figure 6. AD5024 INL Rev. 0 | Page 9 of 28 AD5024/AD5044/AD5064 0.20 1.2 1.0 0.15 TA = 25°C 0.8 0.10 TUE (mV) 0.05 0 –0.05 0.4 0 –0.4 –0.15 –0.8 06803-025 –0.6 16,640 32,768 48,896 MIN TUE ERROR @ VDD = 5.5V –0.2 –0.10 –0.20 512 MAX TUE ERROR @ VDD = 5.5V 0.2 06803-028 TUE ERROR (mV) 0.6 –1.0 –1.2 2.0 65,024 2.5 3.0 DAC CODE Figure 10. Total Unadjusted Error (TUE) 1.6 1.4 4.0 4.5 5.0 5.5 Figure 13. TUE vs. Reference Input Voltage 0.015 TA = 25°C 1.2 1.0 0.010 DAC A 0.6 GAIN ERROR (%FSR) 0.8 INL ERROR (LSB) 3.5 REFERENCE VOLTAGE (V) MAX INL ERROR @ VDD = 5.5V 0.4 0.2 0 –0.2 MIN INL ERROR @ VDD = 5.5V –0.4 –0.6 0.005 0 DAC B DAC D DAC C –0.005 –0.8 –1.0 06803-026 –1.4 –1.6 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD = 5.5V VREF = 4.096V –0.015 –60 –40 –20 5.5 06803-029 –0.010 –1.2 0 20 40 60 100 80 120 140 TEMPERATURE (°C) REFERENCE VOLTAGE (V) Figure 11. INL vs. Reference Input Voltage Figure 14. Gain Error vs. Temperature 1.6 0.6 1.4 TA = 25°C VDD = 5.5V VREF = 4.096V 0.5 1.2 1.0 DAC C 0.4 OFFSET ERROR (mV) 0.6 0.4 MAX DNL ERROR @ VDD = 5.5V 0.2 0 –0.2 MIN DNL ERROR @ VDD = 5.5V –0.4 –0.6 –0.8 0.2 0.1 DAC D 0 –0.1 DAC A –1.4 2.5 3.0 3.5 4.0 4.5 5.0 5.5 DAC B 06803-030 –1.2 –1.6 2.0 0.3 –0.2 –1.0 06803-027 DNL ERROR (LSB) 0.8 –0.3 –0.4 –60 –40 –20 0 20 40 60 80 100 TEMPERATURE (ºC) REFERENCE VOLTAGE (V) Figure 12. DNL vs. Reference Input Voltage Figure 15. Offset Error vs. Temperature Rev. 0 | Page 10 of 28 120 140 AD5024/AD5044/AD5064 0.010 0.2 0.009 0.008 0.007 IDD (mA) ERROR (%FSR) 0.1 GAIN ERROR 0 0.006 0.005 0.004 FULL-SCALE ERROR 0.003 –0.1 0.001 06803-031 –0.2 4.50 4.75 5.00 5.25 06803-034 0.002 0 512 5.50 16,640 48,896 65,024 Figure 19. Supply Current vs. Code Figure 16. Gain Error and Full-Scale Error vs. Supply Voltage 0.12 10.0 0.09 7.5 IDD (mA) 0.06 5.0 2.5 06803-032 0.03 0 4.50 4.75 5.00 5.25 06803-035 OFFSET ERROR (mV) 32,768 DAC CODE VDD (V) 0 –40 5.50 10 60 110 125 TEMPERATURE (°C) VDD (V) Figure 17. Offset Error Voltage vs. Supply Voltage Figure 20. Supply Current vs. Temperature 10.0 7 6 7.5 IDD (mA) 4 3 2 5.0 2.5 0 2.80 2.85 2.90 2.95 3.00 IDD (mA) 3.05 3.10 0 4.50 06803-036 1 06803-033 FREQUENCY 5 4.75 5.00 5.25 VDD (V) Figure 21. Supply Current vs. Supply Voltage Figure 18. IDD Histogram, VDD = 5.0 V Rev. 0 | Page 11 of 28 5.50 AD5024/AD5044/AD5064 10.0 1 2.5 3 0 06803-040 5.0 06803-037 IDD (mA) 7.5 1 0 3 2 4 DIGITAL INPUT VOLTAGE (V) CH1 2V 5 Figure 22. Supply Current vs. Digital Input Voltage CH3 2V M2ms T 20.4% A CH1 2.52V Figure 25. Power-On Reset to Midscale 5.0 CH1 = SCLK 4.5 OUTPUT VOLTAGE (V) 4.0 1 3.5 VDD = 5V, VREF = 4.096V TA = 25ºC 1/4 SCALE TO 3/4 SCALE 3/4 SCALE TO 1/4 SCALE OUTPUT LOADED WITH 5kΩ AND 200pF TO GND 3.0 2.5 2.0 CH2 = VOUT 1.5 VDD = 5V POWER-UP TO MIDSCALE 2 06803-038 0.5 0 06803-041 1.0 0 2 4 6 8 10 12 CH1 5V 14 CH2 500mV TIME (µs) M2µs T 55% A CH2 1.2V Figure 26. Exiting Power-Down to Midscale Figure 23. Settling Time 6 GLITCH AMPLITUDE (mV) 5 CH1 2V CH3 2V M2ms T 20.4% A CH1 2 1 0 –1 –2 06803-039 3 3 –3 2.52V 06803-042 1 4 0 2.5 5.0 7.5 TIME (μs) Figure 27. Digital-to-Analog Glitch Impulse Figure 24. Power-On Reset to 0 V Rev. 0 | Page 12 of 28 10.0 AD5024/AD5044/AD5064 7 0 VDD = 5V, VREF = 4.096V TA = 25ºC 6 –20 4 VOUT LEVEL (dB) –30 3 2 1 0 –40 –50 –60 –70 –1 –80 06803-043 –2 –3 0 2.5 5.0 7.5 06803-046 GLITCH AMPLITUDE (mV) 5 –4 VDD = 5V, TA = 25ºC DAC LOADED WITH MIDSCALE VREF = 3.0V ± 200mV p-p –10 –90 –100 10.0 5 20 10 TIME (μs) Figure 28. Analog Crosstalk 24 VDD = 5V, VREF = 4.096V TA = 25°C 9 10 20 4 18 SETTLING TIME (μs) 3 2 1 0 –1 16 14 12 10 8 06803-044 –2 –3 0 2.5 5.0 7.5 06803-047 GLITCH AMPLITUDE (mV) 55 VDD = 5V, VREF = 3.0V TA = 25°C 22 5 –4 50 Figure 31. Total Harmonic Distortion 7 6 30 40 FREQUENCY (kHz) 6 4 10.0 0 1 2 3 TIME (μs) 4 5 6 7 8 CAPACITANCE (nF) Figure 29. DAC-to-DAC Crosstalk Figure 32. Settling Time vs. Capacitive Load VDD = 5V, VREF = 4.096V TA = 25ºC DAC LOADED WITH MIDSCALE 1μV/DIV 1 06803-045 06803-048 2 4s/DIV CH1 5V Figure 30. 0.1 Hz to 10 Hz Output Noise Plot CH2 2V M2µs T 11% Figure 33. Hardware CLR Rev. 0 | Page 13 of 28 A CH1 2.5V AD5024/AD5044/AD5064 10 0.10 0.08 0 CODE = MIDSCALE VDD = 5V, VREF = 4.096V 0.06 0.04 ΔVOUT (V) –20 –30 0.02 0 –0.02 –0.04 –40 CH A CH B CH C CH D 3dB POINT –0.06 06803-049 –50 –60 10 100 1000 06803-052 ATTENUATION (dB) –10 –0.08 –0.10 –25 10000 –20 –15 –10 FREQUENCY (kHz) –5 0 5 10 15 20 25 30 IOUT (mA) Figure 37. Typical Current Limiting Plot Figure 34. Multiplying Bandwidth 5.0 4.5 CH1 295mV p-p OUTPUT VOLTAGE (V) 4.0 3.5 3.0 VDD = 5V, VREF = 4.096V TA = 25°C 1/4 SCALE TO 3/4 SCALE 3/4 SCALE TO 1/4 SCALE OUTPUT LOADED WITH 5kΩ AND 200pF TO GND 2.5 2.0 1.5 06803-050 0.5 0 06803-053 1.0 0 2 4 6 8 10 12 14 CH1 50mV CH2 5V TIME (µs) M4µs T 8.6% A CH2 1.2V Figure 38. Glitch on Entering Power-Down to Zero Scale, No Load Figure 35. Typical Output Slew Rate 0.0010 0.0008 CODE = MIDSCALE VDD = 5V, VREF = 4.096V CH1 200mV p-p 0.0006 0.0002 0 –0.0002 VDD = 5.5V –0.0006 –0.0008 –25 06803-054 –0.0004 06803-051 ΔVOLTAGE (V) 0.0004 –20 –15 –10 –5 0 5 10 15 20 25 CH1 50mV 30 CURRENT (mA) Figure 36. Typical Output Load Regulation CH2 5V M4µs T 8.6% A CH2 1.2V Figure 39. Glitch on Entering Power-Down to Zero Scale, 5 kΩ/200 pF Load Rev. 0 | Page 14 of 28 AD5024/AD5044/AD5064 CH1 170mV p-p CH1 20mV CH2 5V M4µs T 8.6% A CH2 06803-056 06803-055 CH1 129mV p-p 1.2V CH1 20mV Figure 40. Glitch on Exiting Power-Down from Zero Scale, No load CH2 5V M4µs T 8.6% A CH2 1.2V Figure 41. Glitch on Exiting Power-Down from Zero Scale, 5 kΩ/200 pF Load Rev. 0 | Page 15 of 28 AD5024/AD5044/AD5064 TERMINOLOGY Relative Accuracy For the DAC, relative accuracy, or integral nonlinearity (INL), is a measure of the maximum deviation in LSBs from a straight line passing through the endpoints of the DAC transfer function. Figure 4, Figure 5, and Figure 6 show plots of typical INL vs. code. Differential Nonlinearity (DNL) DNL is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed monotonic by design. Figure 7, Figure 8 and Figure 9 show plots of typical DNL vs. code. Offset Error Offset error is a measure of the difference between the actual VOUT and the ideal VOUT, expressed in millivolts in the linear region of the transfer function. Offset error is measured on the part with Code 512 (AD5064), Code 128 (AD5044), and Code 32 (AD5024) loaded into the DAC register. It can be negative or positive and is expressed in millivolts. Gain Error Gain error is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from the ideal, expressed as a percentage of the full-scale range. Offset Error Drift Offset error drift is a measure of the change in offset error with a change in temperature. It is expressed in microvolts per degree Celsius. Gain Temperature Coefficient Gain error drift is a measure of the change in gain error with changes in temperature. It is expressed in parts per million of full-scale range per degree Celsius. Full-Scale Error Full-scale error is a measure of the output error when full-scale code (0xFFFF) is loaded into the DAC register. Ideally, the output should be VREF − 1 LSB. Full-scale error is expressed as a percentage of the full-scale range. Measured with VREF < VDD. Digital-to-Analog Glitch Impulse Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nanovoltseconds and is measured when the digital input code is changed by 1 LSB at the major carry transition (0x7FFF to 0x8000). See Figure 27. DC Power Supply Rejection Ratio (PSRR) PSRR indicates how the output of the DAC is affected by changes in the supply voltage. PSRR is the ratio of the change in VOUT to a change in VDD for full-scale output of the DAC. It is measured in decibels. VREF is held at 2.5 V, and VDD is varied by ±10%. Measured with VREF < VDD. DC Crosstalk DC crosstalk is the dc change in the output level of one DAC in response to a change in the output of another DAC. It is measured with a full-scale output change on one DAC (or soft power-down and power-up) while monitoring another DAC kept at midscale. It is expressed in microvolts. DC crosstalk due to load current change is a measure of the impact that a change in load current on one DAC has to another DAC kept at midscale. It is expressed in microvolts per milliamp. Reference Feedthrough Reference feedthrough is the ratio of the amplitude of the signal at the DAC output to the reference input when the DAC output is not being updated (that is, LDAC is high). It is expressed in decibels. Digital Feedthrough Digital feedthrough is a measure of the impulse injected into the analog output of a DAC from the digital input pins of the device, but it is measured when the DAC is not being written to (SYNC held high). It is specified in nanovolt-seconds and measured with one simultaneous data and clock pulse loaded to the DAC. Digital Crosstalk Digital crosstalk is the glitch impulse transferred to the output of one DAC at midscale in response to a full-scale code change (all 0s to all 1s or vice versa) in the input register of another DAC. It is measured in standalone mode and is expressed in nanovolt-seconds. Analog Crosstalk Analog crosstalk is the glitch impulse transferred to the output of one DAC due to a change in the output of another DAC. It is measured by loading one of the input registers with a full-scale code change (all 0s to all 1s or vice versa) while keeping LDAC high, and then pulsing LDAC low and monitoring the output of the DAC whose digital code has not changed. The area of the glitch is expressed in nanovolt-seconds. Rev. 0 | Page 16 of 28 AD5024/AD5044/AD5064 DAC-to-DAC Crosstalk DAC-to-DAC crosstalk is the glitch impulse transferred to the output of one DAC due to a digital code change and subsequent output change of another DAC. This includes both digital and analog crosstalk. It is measured by loading one of the DACs with a full-scale code change (all 0s to all 1s or vice versa) with LDAC low and monitoring the output of another DAC. The energy of the glitch is expressed in nanovolt-seconds. Multiplying Bandwidth The amplifiers within the DAC have a finite bandwidth. The multiplying bandwidth is a measure of this. A sine wave on the reference (with full-scale code loaded to the DAC) appears on the output. The multiplying bandwidth is the frequency at which the output amplitude falls to 3 dB below the input. Total Harmonic Distortion (THD) Total harmonic distortion is the difference between an ideal sine wave and its attenuated version using the DAC. The sine wave is used as the reference for the DAC, and the THD is a measure of the harmonics present on the DAC output. It is measured in decibels. Rev. 0 | Page 17 of 28 AD5024/AD5044/AD5064 THEORY OF OPERATION DAC SECTION SERIAL INTERFACE The AD5024/AD5044/AD5064 are single 12-/14-/16-bit, serial input, voltage output DACs. The parts operate from supply voltages of 4.5 V to 5.5 V. Data is written to the AD5024/AD5044/AD5064 in a 32-bit word format via a 3-wire serial interface. The AD5024/ AD5044/AD5064 incorporate a power-on reset circuit that ensures that the DAC output powers up to a known output state. The devices also have a software power-down mode that reduces the typical current consumption to less than 2 μA. The AD5024/AD5044/AD5064 have a 3-wire serial interface (SYNC, SCLK, and DIN) that is compatible with SPI, QSPI, and MICROWIRE interface standards as well as most DSPs. See Figure 2 for a timing diagram of a typical write sequence. Because the input coding to the DAC is straight binary, the ideal output voltage when using an external reference is given by D VOUT = VREFIN × ⎛⎜ N ⎞⎟ ⎝2 ⎠ where: D is the decimal equivalent of the binary code that is loaded to the DAC register (0 to 65,535 for the 16-bit AD5064). N is the DAC resolution. DAC ARCHITECTURE The DAC architecture of the AD5064 consists of two matched DAC sections. A simplified circuit diagram is shown in Figure 42. The four MSBs of the 16-bit data word are decoded to drive 15 switches, E1 to E15. Each of these switches connects one of 15 matched resistors to either GND or the VREF buffer output. The remaining 12 bits of the data-word drive the S0 to S11 switches of a 12-bit voltage mode R-2R ladder network. VOUT 2R 2R 2R 2R 2R 2R 2R S0 S1 S11 E1 E2 E15 STANDALONE MODE The write sequence begins by bringing the SYNC line low. Data from the DIN line is clocked into the 32-bit shift register on the falling edge of SCLK. The serial clock frequency can be as high as 50 MHz, making the AD5024/AD5044/AD5064 compatible with high speed DSPs. On the 32nd falling clock edge, the last data bit is clocked in and the programmed function is executed, that is, a change in DAC register contents and/or a change in the mode of operation. At this stage, the SYNC line can be kept low or be brought high. In either case, it must be brought high for a minimum of 1.9 μs (single channel) before the next write sequence so that a falling edge of SYNC can initiate the next write sequence. Because the SYNC buffer draws more current when VIN = 2.2 V than it does when VIN = 0.8 V, SYNC should be idled low between write sequences for even lower power operation of the part. As mentioned previously, however, SYNC must be brought high again just before the next write sequence. Table 7. Command Definitions Command C3 C2 C1 0 0 0 0 0 0 0 0 1 C0 0 1 0 0 0 0 0 0 1 1 1 1 0 1 0 1 0 1 1 12-BIT R-2R LADDER 06803-006 VREF FOUR MSBs DECODED INTO 15 EQUAL SEGMENTS Figure 42. DAC Ladder Structure REFERENCE BUFFER The AD5024/AD5044/AD5064 operate with an external reference. Each DAC has a dedicated voltage reference pin. The reference input pin has an input range of 2.5 V to VDD. This input voltage is then used to provide a buffered reference for the DAC core. OUTPUT AMPLIFIER The output buffer amplifier can generate rail-to-rail voltages on its output, which gives an output range of 0 V to VDD. The amplifier is capable of driving a load of 5 kΩ in parallel with 200 pF to GND. The slew rate is 1.5 V/μs with a ¼ to ¾ scale settling time of 13 μs. 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 Description Write to Input Register n Update DAC Register n Write to Input Register n, update all (software LDAC) Write to and update DAC Channel n Power down/power up DAC Load clear code register Load LDAC register Reset (power-on reset) Reserved Reserved Reserved Table 8. Address Commands A3 0 0 0 0 1 Rev. 0 | Page 18 of 28 A2 0 0 0 0 1 Address (n) A1 0 0 1 1 1 A0 0 1 0 1 1 Selected DAC Channel DAC A DAC B DAC C DAC D All DACs AD5024/AD5044/AD5064 INPUT SHIFT REGISTER SYNC INTERRUPT The AD5024/AD5044/AD5064 input shift register is 32 bits wide. The first four bits are don’t cares. The next four bits are the command bits, C3 to C0 (see Table 7), followed by the 4-bit DAC address bits, A3 to A0 (see Table 8), and finally the bit data-word. The data-word comprises 12-, 14-, or 16-bit input code followed by 8, 6, or 4 don’t care bits for the AD5024/AD5044/AD5064 (see Figure 43, Figure 44, and Figure 45). These data bits are transferred to the DAC register on the 32nd falling edge of SCLK. In a normal write sequence, the SYNC line is kept low for at least 32 falling edges of SCLK, and the DAC is updated on the 32nd falling edge. However, if SYNC is brought high before the 32nd falling edge, this acts as an interrupt to the write sequence. The shift register is reset, and the write sequence is seen as invalid. Neither an update of the DAC register contents nor a change in the operating mode occurs (see Figure 46). DB31 (MSB) X X DB0 (LSB) X X C3 C2 C1 C0 A3 A2 A1 A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X X X X X COMMAND BITS 06803-009 DATA BITS ADDRESS BITS Figure 43. AD5024 Input Register Content DB31 (MSB) X X DB0 (LSB) X X C3 C2 C1 C0 A3 A2 A1 A0 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X X X COMMAND BITS 06803-008 DATA BITS ADDRESS BITS Figure 44. AD5044 Input Register Content DB31 (MSB) X X X C3 C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X COMMAND BITS 06803-007 DATA BITS ADDRESS BITS Figure 45. AD5064 Input Register Content SCLK SYNC DIN DB31 DB0 INVALID WRITE SEQUENCE: SYNC HIGH BEFORE 32ND FALLING EDGE DB31 DB0 VALID WRITE SEQUENCE, OUTPUT UPDATES ON THE 32ND FALLING EDGE Figure 46. SYNC Interrupt Facility Rev. 0 | Page 19 of 28 06803-010 X DB0 (LSB) AD5024/AD5044/AD5064 POWER-ON RESET The AD5024/AD5044/AD5064 contains a power-on reset circuit that controls the output voltage during power-up. By connecting the POR pin low, the AD5024/AD5044/AD5064 output powers up to zero scale. Note that this is outside the linear region of the DAC; by connecting the POR pin high, the AD5024/AD5044/AD5064 output powers up to midscale. The output remains powered up at this level until a valid write sequence is made to the DAC. This is useful in applications where it is important to know the state of the output of the DAC while it is in the process of powering up. There is also a software executable reset function that resets the DAC to the power-on reset code. Command 0111 is designated for this reset function (see Table 7). Any events on LDAC or CLR during power-on reset are ignored. POWER-DOWN MODES The AD5024/AD5044/AD5064 contain four separate modes of operation. Command 0100 is designated for the power-down function (see Table 7). These modes are software-programmable by setting two bits, Bit DB9 and Bit DB8, in the control register (Table 9). Table 9 shows how the state of the bits corresponds to the mode of operation of the device. Any or all DACs (DAC D to DAC A) can be powered down to the selected mode by setting the corresponding four bits (DB3, DB2, DB1, DB0) to 1. See Table 10 for the contents of the input shift register during power-down/power-up operation. When both Bit DB9 and Bit D8 in the control register are set to 0, the part works normally with its normal power consumption of 3 mA at 5 V. However, for the three power-down modes, the supply current falls to 0.4 μA at 5 V. Not only does the supply current fall, but the output stage is also internally switched from the output of the amplifier to a resistor network of known values. This has the advantage that the output impedance of the part is known while the part is in power-down mode. There are three different options. The output is connected internally to GND through either a 1 kΩ or a 100 kΩ resistor, or it is left opencircuited (three-state). The output stage is illustrated in Figure 47. The bias generator, output amplifier, resistor string, and other associated linear circuitry are shut down when the power-down mode is activated. However, the contents of the DAC register are unaffected when in power-down. The time to exit power-down is typically 4.5 μs for VDD = 5 V (see Figure 26). Table 9. Modes of Operation DB9 0 DB8 0 0 1 1 1 0 1 Operating Mode Normal operation Power-down modes: 1 kΩ to GND 100 kΩ to GND Three-state Table 10. 32-Bit Input Shift Register Contents for Power-Up/Power-Down Function LSB DB27 DB26 DB25 DB24 0 1 0 0 Command bits (C2 to C0) DB23 DB22 DB21 DB20 X X X X Address bits (A3 to A0)— don’t cares DAC DB10 to DB19 X Don’t cares DB9 DB8 PD1 PD0 Powerdown mode AMPLIFIER POWER-DOWN CIRCUITRY VOUT RESISTOR NETWORK Figure 47. Output Stage During Power-Down Rev. 0 | Page 20 of 28 06803-011 MSB DB31 to DB28 X Don’t cares DB4 to DB7 X Don’t cares DB3 DB2 DB1 DB0 DAC D DAC C DAC B DAC A Power-down/power-up channel selection—set bit to 1 to select AD5024/AD5044/AD5064 CLEAR CODE REGISTER The AD5024/AD5044/AD5064 have a hardware CLR pin that is an asynchronous clear input. The CLR input is falling edge sensitive. Bringing the CLR line low clears the contents of the input register and the DAC registers to the data contained in the user-configurable CLR register and sets the analog outputs accordingly (see Table 11). This function can be used in system calibration to load zero scale, midscale, or full scale to all channels together. Note that zero scale and full scale are outside the linear region of the DAC. These clear code values are user-programmable by setting two bits, Bit DB1 and Bit DB0, in the control register (see Table 11). The default setting clears the outputs to 0 V. Command 0101 is designated for loading the clear code register (see Table 7). The part exits clear code mode on the 32nd falling edge of the next write to the part. If CLR is activated during a write sequence, the write is aborted. The CLR pulse activation time, which is the falling edge of CLR to when the output starts to change, is typically 10.6 μs. If outside the DAC linear region, it typically takes 10.6 μs after executing CLR for the output to start changing (see Figure 33). See Table 12 for contents of the input shift register during the loading clear code register operation. LDAC FUNCTION Hardware LDAC Pin The outputs of all DACs can be updated simultaneously using the hardware LDAC pin, as shown in Figure 2. Synchronous LDAC: After new data is read, the DAC registers are updated on the falling edge of the 32nd SCLK pulse. LDAC can be permanently low or pulsed. Asynchronous LDAC: The outputs are not updated at the same time that the input registers are written to. When LDAC goes low, the DAC registers are updated with the contents of the input register. Software LDAC Function Alternatively, the outputs of all DACs can be updated simultaneously using the software LDAC function by writing to Input Register n and updating all DAC registers. Command 0010 is reserved for this software LDAC function. The LDAC register gives the user extra flexibility and control over the hardware LDAC pin (see Table 14). Setting the LDAC bit register (DB0 to DB3) to 0 for a DAC channel means that this channel’s update is controlled by the hardware LDAC pin. If this bit is set to 1, this channel updates synchronously; that is, the DAC register is updated after new data is read, regardless of the state of the hardware LDAC pin. It effectively sees the hardware LDAC pin as being tied low. (See Table 13 for the LDAC register mode of operation.) This flexibility is useful in applications where the user wants to simultaneously update select channels while the rest of the channels are synchronously updating. Writing to the DAC using Command 0110 loads the 4-bit LDAC register (DB3 to DB0). The default for each channel is 0; that is, the LDAC pin works normally. Setting the bits to 1 means that the DAC channel is updated regardless of the state of the LDAC pin. POWER SUPPLY BYPASSING AND GROUNDING When accuracy is important in a circuit, it is helpful to carefully consider the power supply and ground return layout on the board. The printed circuit board containing the AD5024/AD5044/ AD5064 should have separate analog and digital sections. If the AD5024/AD5044/AD5064 is in a system where other devices require an AGND-to-DGND connection, the connection should be made at one point only. This ground point should be as close as possible to the AD5024/AD5044/AD5064. The power supply to the AD5024/AD5044/AD5064 should be bypassed with 10 μF and 0.1 μF capacitors. The capacitors should physically be as close as possible to the device, with the 0.1 μF capacitor ideally right up against the device. The 10 μF capacitors are the tantalum bead type. It is important that the 0.1 μF capacitor have low effective series resistance (ESR) and low effective series inductance (ESI), such as is typical of common ceramic types of capacitors. This 0.1 μF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching. The power supply line should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals, if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects through the board. The best board layout technique is the microstrip technique, where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, this is not always possible with a 2-layer board. Rev. 0 | Page 21 of 28 AD5024/AD5044/AD5064 Table 11. Clear Code Register DB1 CR1 0 0 1 1 Clear Code Register DB0 CR0 0 1 0 1 Clears to Code 0x0000 0x8000 0xFFFF No operation Table 12. 32-Bit Input Shift Register Contents for Clear Code Function MSB DB31 to DB28 X Don’t cares DB27 DB26 DB25 DB24 0 1 0 1 Command bits (C3 to C0) DB23 X DB22 DB21 DB20 X X X Address bits (A3 to A0) DB2 to DB19 X Don’t cares LSB DB1 DB0 1/0 1/0 Clear code register (CR1 to CR0) Table 13. LDAC Overwrite Definition Load DAC Register LDAC Bits (DB3 to DB0) LDAC Pin LDAC Operation 0 1 Determined by the LDAC pin DAC channels update, overrides the LDAC pin. DAC channels see LDAC as 0. 1 or 0 X—don’t care Table 14. 32-Bit Input Shift Register Contents for LDAC Overwrite Function MSB DB31 to DB28 X Don’t cares LSB DB27 DB26 DB25 DB24 0 1 1 0 Command bits (C3 to C0) DB23 DB22 DB21 DB20 X X X X Address bits (A3 to A0)— don’t cares Rev. 0 | Page 22 of 28 DB4 to DB19 X Don’t cares DB3 DB2 DB1 DB0 DAC D DAC C DAC B DAC A Setting LDAC bits to 1 overrides LDAC pin AD5024/AD5044/AD5064 MICROPROCESSOR INTERFACING AD5024/AD5044/AD5064 to 80C51/80L51 Interface AD5024/AD5044/AD5064 to Blackfin ADSP-BF53x Interface Figure 50 shows a serial interface between the AD5024/AD5044/ AD5064 and the 80C51/80L51 microcontroller. The setup for the interface is as follows: TxD of the 80C51/80L51 drives SCLK of the AD5024/AD5044/AD5064, and RxD drives the serial data line of the part. The SYNC signal is again derived from a bit-programmable pin on the port. In this case, Port Line P3.3 is used. When data is to be transmitted to the AD5024/AD5044/ AD5064, P3.3 is taken low. The 80C51/80L51 transmit data in 8-bit bytes only; thus, only eight falling clock edges occur in the transmit cycle. To load data to the DAC, P3.3 is left low after the first eight bits are transmitted, and a second write cycle is initiated to transmit the second byte of data. P3.3 is taken high following the completion of this cycle. The 80C51/80L51 output the serial data in a format that has the LSB first. The AD5024/AD5044/ AD5064 must receive data with the MSB first. The 80C51/80L51 transmit routine should take this into account. DT0PRI TSCLK0 SYNC DIN SCLK *ADDITIONAL PINS OMITTED FOR CLARITY. 80C51/80L51* AD5024/ AD5044/ AD5064* P3.3 SYNC AD5024/AD5044/AD5064 to 68HC11/68L11 Interface TxD SCLK Figure 49 shows a serial interface between the AD5024/AD5044/ AD5064 and the 68HC11/68L11 microcontroller. SCK of the 68HC11/68L11 drives the SCLK of the AD5024/AD5044/AD5064, and the MOSI output drives the serial data line of the DAC. RxD DIN Figure 48. AD5024/AD5044/AD5064 to Blackfin ADSP-BF53x Interface AD5024/ AD5044/ AD5064* PC7 SYNC SCK SCLK MOSI DIN *ADDITIONAL PINS OMITTED FOR CLARITY. AD5024/AD5044/AD5064 to MICROWIRE Interface Figure 51 shows an interface between the AD5024/AD5044/ AD5064 and any MICROWIRE-compatible device. Serial data is shifted out on the falling edge of the serial clock and is clocked into the AD5024/AD5044/AD5064 on the rising edge of the SCLK. MICROWIRE* 06803-013 68HC11/68L11* *ADDITIONAL PINS OMITTED FOR CLARITY. Figure 50. AD5024/AD5044/AD5064 to 80C512/80L51 Interface AD5024/ AD5044/ AD5064* Figure 49. AD5024/AD5044/AD5064 to 68HC11/68L11 Interface CS SYNC The SYNC signal is derived from a port line (PC7). The setup conditions for correct operation of this interface are as follows: The 68HC11/68L11 is configured with its CPOL bit as 0, and its CPHA bit as 1. When data is being transmitted to the DAC, the SYNC line is taken low (PC7). When the 68HC11/68L11 is configured as described previously, data appearing on the MOSI output is valid on the falling edge of SCK. Serial data from the 68HC11/68L11 is transmitted in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. Data is transmitted MSB first. To load data to the AD5024/AD5044/ AD5064, PC7 is left low after the first eight bits are transferred, and a second serial write operation is performed to the DAC. PC7 is taken high at the end of this procedure. SK DIN SO SCLK Rev. 0 | Page 23 of 28 *ADDITIONAL PINS OMITTED FOR CLARITY. 06803-015 TFS0 AD5024/ AD5044/ AD5064* 06803-012 ADSP-BF53x* 06803-014 Figure 48 shows a serial interface between the AD5024/AD5044/ AD5064 and the Blackfin® ADSP-BF53x microprocessor. The ADSP-BF53x processor family incorporates two dual-channel synchronous serial ports, SPORT1 and SPORT0, for serial and multiprocessor communications. Using SPORT0 to connect to the AD5024/AD5044/AD5064, the setup for the interface is as follows: DT0PRI drives the DIN pin of the AD5024/AD5044/ AD5064, and TSCLK0 drives the SCLK of the parts. The SYNC pin is driven from TFS0. Figure 51. AD5024/AD5044/AD5064 to MICROWIRE Interface AD5024/AD5044/AD5064 APPLICATIONS Because the supply current required by the AD5024/AD5044/ AD5064 is extremely low, an alternative option is to use a voltage reference to supply the required voltage to the parts (see Figure 52). This is especially useful if the power supply is quite noisy or if the system supply voltages are at some value other than 5 V (for example, 15 V). The voltage reference outputs a steady supply voltage for the AD5024/AD5044/AD5064. If the low dropout REF195 is used, it must supply 3 mA of current to the AD5024/ AD5044/AD5064, with no load on the output of the DAC. When the DAC output is loaded, the REF195 also needs to supply the current to the load. The total current required (with a 5 kΩ load on the DAC output) is This is an output voltage range of ±5 V, with 0x0000 corresponding to a −5 V output, and 0xFFFF corresponding to a +5 V output. R2 = 10kΩ +5V +5V R1 = 10kΩ AD820/ OP295 VDD 10µF USING THE AD5024/AD5044/AD5064 WITH A GALVANICALLY ISOLATED INTERFACE 15V SCLK DIN 5V VDD AD5024/ AD5044/ AD5064 VOUT = 0V TO 5V 06803-016 3-WIRE SERIAL INTERFACE –5V Figure 53. Bipolar Operation The load regulation of the REF195 is typically 2 ppm/mA, which results in a 3 ppm (15 μV) error for the 4 mA current drawn from it. This corresponds to a 0.196 LSB error. SYNC AD5024/ AD5044/ AD5064 3-WIRE SERIAL INTERFACE 3 mA + (5 V/5 kΩ) = 4 mA REF195 0.1µF ±5V VOUT 06803-017 USING A REFERENCE AS A POWER SUPPLY Figure 52. REF195 as Power Supply to the AD5024/AD5044/AD5064 BIPOLAR OPERATION The AD5024/AD5044/AD5064 have been designed for singlesupply operation, but a bipolar output range is also possible using the circuit shown in Figure 53. The circuit gives an output voltage range of ±5 V. Rail-to-rail operation at the amplifier output is achievable using an AD820 or an OP295 as the output amplifier. Assuming VDD = VREF, the output voltage for any input code can be calculated as follows: ⎡ ⎛ D ⎞ ⎛ R1 + R2 ⎞ ⎛ R2 ⎞⎤ VOUT = ⎢VDD × ⎜ ⎟×⎜ ⎟ − VDD × ⎜ ⎟⎥ R1 65 , 536 ⎝ ⎠ ⎝ R1 ⎠⎦ ⎝ ⎠ ⎣ In process control applications in industrial environments, it is often necessary to use a galvanically isolated interface to protect and isolate the controlling circuitry from any hazardous common-mode voltages that can occur in the area where the DAC is functioning. iCoupler® provides isolation in excess of 2.5 kV. The AD5024/AD5044/AD5064 use a 3-wire serial logic interface, so the ADuM1300 three-channel digital isolator provides the required isolation (see Figure 54). The power supply to the part also needs to be isolated, which is done by using a transformer. On the DAC side of the transformer, a 5 V regulator provides the 5 V supply required for the AD5024/ AD5044/AD5064. 5V REGULATOR 10µF POWER 0.1µF VDD SCLK VIA VOA SCLK ADuM1300 SDI VIB VOB SYNC DATA VIC VOC DIN AD5024/ AD5044/ AD5064 VOUT where D represents the input code in decimal (0 to 65,535). VOUT ⎛ 10 × D ⎞ =⎜ ⎟ −5V ⎝ 65,536 ⎠ GND 06803-018 With VDD = 5 V, R1 = R2 = 10 kΩ, Figure 54. AD5024/AD5044/AD5064 with a Galvanically Isolated Interface Rev. 0 | Page 24 of 28 AD5024/AD5044/AD5064 OUTLINE DIMENSIONS 5.10 5.00 4.90 16 9 4.50 4.40 4.30 6.40 BSC 1 8 PIN 1 1.20 MAX 0.15 0.05 0.30 0.19 0.65 BSC COPLANARITY 0.10 0.20 0.09 SEATING PLANE 0.75 0.60 0.45 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 55. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters ORDERING GUIDE Model AD5064BRUZ 1 AD5064BRUZ-REEL71 AD5044BRUZ1 AD5044BRUZ-REEL71 AD5024BRUZ1 AD5024BRUZ-REEL71 1 Temperature Range −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C Accuracy ±1 LSB INL ±1 LSB INL ±1 LSB INL ±1 LSB INL ±1 LSB INL ±1 LSB INL Resolution 16 Bits 16 Bits 14 Bits 14 Bits 12 Bits 12 Bits Z = RoHS Compliant Part. Rev. 0 | Page 25 of 28 Package Description 16-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP Package Option RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 AD5024/AD5044/AD5064 NOTES Rev. 0 | Page 26 of 28 AD5024/AD5044/AD5064 NOTES Rev. 0 | Page 27 of 28 AD5024/AD5044/AD5064 NOTES ©2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06803-0-8/08(0) Rev. 0 | Page 28 of 28