Condition of Soldering for Transistor & Diode • Recommended condition of flow soldering (°C) Preliminary Heating Soldering Cooling (in air) 300 Temperature of Soldering 265°C 250 245°C 200 150 120°C 100 100°C 50 0 2 to 5min less than 10s more than 1min • Recommended condition of reflow soldering (°C) Peak Temperature 245 to 260°C, 10s max. 250 Reflow Heating Rate 1 to 5°C / s Temperature 200 150 100 50 Pre Heating Rate Preliminary Heating 1 to 5°C / s 130 to 170°C, 50 to 120s Soldering 230°C, 20 to 30s Cooling 60s min. 0 2 times max. Recommended peak temperature is over 245 OC. If peak temperature is below 245 OC, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) • Condition of hand soldering Temperature: 370 OC Time: 3s max. Times: one time • Remark: Lead free solder paste (96.5Sn/3.0Ag/0.5Cu) SEMTECH ELECTRONICS LTD. Subsidiary of Sino-Tech International (BVI) Limited ® Page 1 of 1 Dated : 29/09/2007