Reel Taping Specifications for SMA / SMB / SMC P0 P1 d E F W B A P MAX.3° A MAX.3° T C H C D2 R E T D D1 W1 Fig. : Configuration of flat MELF taping (SMA / SMB / SMC) M E Item Symbol DO-214AC (SMA) mm (inch) DO214-AA (SMB) mm (inch) DO214-AB (SMC) mm (inch) A 3.0 ±0.1 (0.122 ±0.004) 3.65 ±0.1 (0.148 ±0.004) 6.0 ±0.1 (0.24 ±0.004) B 5.4 ±0.1 (0.213 ±0.004) 5.69 ±0.1 (0.224 ±0.004) 8.30 ±0.1 (0.33 ±0.004) C 2.4 ±0.1 (0.098 ±0.004) 2.67 ±0.1 (0.105 ±0.004) 2.5 ±0.1 (0.1 ±0.004) d 1.5 ±0.1 (0.059 ±0.004) 1.5 ±0.1 (0.059 ±0.004) 1.5 ±0.1 (0.059 ±0.004) D 178 ±2 (7 ±0.079) 178 ±2 (7 ±0.079) 178 ±2 (7 ±0.079) D1 50 min. 50 min. 50 min. D2 13 ±0.5 (0.512 ±0.02) 13 ±0.5 (0.512 ±0.02) 13 ±0.5 (0.512 ±0.02) E 1.5 ±0.1 (0.059 ±0.004) 1.5 ±0.1 (0.059 ±0.004) 1.5 ±0.1 (0.059 ±0.004) F 5.65 ±0.05 (0.222 ±0.002) 5.65 ±0.05 (0.222 ±0.002) 7.65 ±0.05 (0.301 ±0.002) P 4 ±0.1 (0.157 ±0.004) 8 ±0.1 (0.315 ±0.004) 8 ±0.1 (0.315 ±0.004) Sprocket hole pitch P0 4 ±0.1 (0.157 ±0.004) 4 ±0.1 (0.157 ±0.004) 4 ±0.1 (0.157 ±0.004) Embossment center P1 2 ±0.1 (0.079 ±0.004) 2 ±0.1 (0.079 ±0.004) 4 ±0.1 (0.157 ±0.004) Total tape thickness T 0.3 ±0.05 (0.012 ±0.002) 0.6 Max. 0.6 Max. Tape width W 12 ±0.2 (0.472 ±0.008) 12 ±0.2 (0.472 ±0.008) 16 ±0.2 (0.63 ±0.008) Reel with W1 16.8 ±2 (0.661 ±0.079) 16.8 ±2 (0.661 ±0.079) 24 ±2 (0.945 ±0.079) Carrier width Carrier length Carrier depth Sprocket hole S Reel outside diameter Reel inner diameter Feed hole diameter Strocker hole position Punch hole position Punch hole pitch Note: Devices are packed in accordance with EIA standard RS-481-A and specification given above. SEMTECH ELECTRONICS LTD. Subsidiary of Sino-Tech International (BVI) Limited ® Dated : 23/04/2008