Silicon Junction FETs (Small Signal) 2SK198 Silicon N-Channel Junction FET For low-frequency amplification unit: mm +0.2 2.8 –0.3 ■ Features +0.25 1.45 0.95 3 +0.1 0.4 –0.05 1.9±0.2 1 VDSX 30 V Gate to Drain voltage VGDO −30 V Drain current ID 20 mA Gate current IG 10 mA Allowable power dissipation PD 150 mW Channel temperature Tch 150 °C Storage temperature Tstg −55 to +150 °C +0.1 0.16 –0.06 Drain to Source voltage 0.1 to 0.3 0.4±0.2 0 to 0.1 Unit 0.8 Ratings +0.2 1.1 –0.1 Symbol 0.65±0.15 2 ■ Absolute Maximum Ratings (Ta = 25°C) Parameter 1.5 –0.05 0.95 +0.2 ● High mutual conductance gm ● Low noise type ● Mini-type package, allowing downsizing of the sets and automatic insertion through the tape/magazine packing. 2.9 –0.05 0.65±0.15 1: Source 2: Drain 3: Gate JEDEC: TO-236 EIAJ: SC-59 Mini Type Package (3-pin) Marking Symbol (Example): 1O ■ Electrical Characteristics (Ta = 25°C) Parameter Symbol Drain to Source cut-off current IDSS * Gate to Source leakage current IGSS VGS = −30V, VDS = 0 Gate to Source cut-off voltage VGSC VDS = 10V, ID = 10µA Mutual conductance gm Input capacitance (Common Source) Ciss Reverse transfer capacitance (Common Source) Crss Noise figure * NV Conditions VDS = 10V, VGS = 0 VDS = 10V, ID = 0.5mA, f = 1kHz VDS = 10V, VGS = 0, f = 1kHz VDS = 10V, VGS = 0, f = 1MHz VDS = 30V, ID = 1mA, GV = 80dB Rg = 100kΩ, Function = FLAT min typ 0.5 − 0.1 4 13 max Unit 12 mA −100 nA −1.5 V mS 14 pF 3.5 pF 60 mV IDSS rank classification Runk P Q R IDSS (mA) 0.5 to 3 2 to 6 4 to 12 Marking Symbol 1OP 1OQ 1OR 1 Silicon Junction FETs (Small Signal) 2SK198 PD Ta ID VDS 8 9.6 7 200 8.0 120 80 6 VGS=0V 5 4 – 0.1V 3 – 0.2V 2 – 0.3V 40 1 4.8 3.2 Ta=75˚C 25˚C – 0.4V –25˚C 20 40 60 80 100 120 140 160 0 Ambient temperature Ta (˚C) 2 4 6 8 10 0 –1.0 12 Drain to source voltage VDS (V) gm VGS 8 IDSS=5.0mA 4 IDSS=5.0mA VDS=10V Ta=25˚C 16 12 2.0mA 8 4 2.0mA 0 – 0.8 0 – 0.6 – 0.4 – 0.2 0 0 Gate to source voltage VGS (V) 1 2 3 4 5 6 7 8 Drain current ID (mA) Crss VDS 12 VGS=–3V f=1MHz Ta=25˚C Noise figure NF (dB) 3 2 1 VDS=10V ID=5.2mA Ta=25˚C 10 4 8 6 Rg=500Ω 4 2 1kΩ 0 0 1 3 10 30 100 Drain to source voltage VDS (V) – 0.2 0 1 10 102 103 Frequency f (Hz) f=1MHz VGS=–3V Ta=25˚C 8 6 Ciss 4 Coss 2 0 1 3 10 30 100 Drain to source voltage VDS (V) NF f 5 – 0.4 Ciss, Coss VDS Input capacitance (Common source), Output capacitance (Common source) Ciss,Coss (pF) Mutual conductance gm (mS) VDS=10V Ta=25˚C 12 – 0.6 10 20 16 – 0.8 Gate to source voltage VGS (V) g m ID 20 Reverse transfer capacitance (Common source) Crss (pF) 6.4 1.6 0 0 Mutual conductance gm (mS) Drain current ID (mA) 160 0 2 VDS=10V Ta=25˚C Drain current ID (mA) Allowable power dissipation PD (mW) 240 ID VGS 105