Silicon MOS FETs (Small Signal) 2SK2211 Silicon N-Channel MOS FET Unit : mm For switching 1.5±0.1 4.5±0.1 0.4±0.08 2.5±0.1 0.4 max. 45˚ +0.1 • Low ON-resistance RDS(ON) • High-speed switching • Mini-power type package, allowing downsizing of the sets and automatic insertion through the tape/magazine packing. 1.0–0.2 ■ Features 4.0+0.25 –0.20 2.6±0.1 1.6±0.2 0.5±0.08 0.4±0.04 1.5±0.1 3.0±0.15 ■ Absolute Maximum Ratings Ta = 25°C Parameter 3 2 1 Symbol Ratings Unit Drain to Source voltage VDS 30 V Gate to Source voltage VGSO ±20 V ID ±1 A IPD ±2 A PD 1 W Marking Symbol: 2M Internal Connection Drain current Max drain current Allowable power dissipation * Channel temperature Pch 150 °C Storage temperature Tstg −55 to +150 °C marking 1: Gate 2: Drain 3: Source Mini-Power Type Package (3-pin) Note) * PC board: Copper foil of the drain portion should have a area of 1 cm2 or more and the board thickness should be 1.7 mm. D G S ■ Electrical Characteristics Ta = 25°C Parameter Symbol Conditions Min Typ Max Unit Drain to Source cut-off current IDSS VDS = 25 V, VGS = 0 10 µA Gate to Source leakage current IGSS VGS = ±15 V, VDS = 0 ±10 µA Drain to Source breakdown voltage VDSS ID = 0.1 mA, VGS = 0 30 V Gate to Source voltage VGSS IGS = 0.1 mA, VDS = 0 ±20 V 0.8 Gate threshold voltage Drain to Source ON-resistance * Forward transfer admittance Vth VDS = 5 V, ID = 1 mA RDS(ON)1 VGS = 4 V, ID = 0.5 A RDS(ON)2 VGS = 10 V, ID = 0.5 A Yfs VDS = 10 V, ID = 0.5 A Input capacitance (Common Source) Ciss Output capacitance (Common Source) Coss Reverse transfer capacitance (Common Source) Crss Turn-on time tON Fall time Turn-off time (delay time) tf tOFF VDS = 10 V, VGS = 0, f = 1 MHz 2 V 0.48 0.75 Ω 0.35 0.6 Ω 0.5 S 87 pF 69 pF 23 pF VGS = 10 V, ID = 0.5 A, VDD = 10 V 12 ns RL = 10 Ω 160 ns 60 ns Note) *: Pulse measurement 1 2SK2211 Silicon MOS FETs (Small Signal) ID VDS ID VDS 3.0 2.5 Drain to source ON-resistance RDS(ON) (Ω) VDS =10 V Ta = 25°C Ta = 25°C 2.5 VGS = 3.5 V 2.0 1.5 3.0 V 1.0 Drain current ID (A) Drain current ID (A) RDS VDS 1.6 3.0 2.0 1.5 1.0 2.5 V 0.5 0.5 2.0 V 0 0 2 4 6 8 10 0 Drain to source voltage VDS (V) 1 2 RDS ID 5 1.0 0.8 VGS = 4 V 10 V 0.2 1.0 1.5 0.4 0.2 0 2 2.0 Drain current ID (A) 2.5 1.2 1.0 0.8 0.6 0.4 0.2 0 0.5 1.0 1.5 6 8 10 12 Ciss, Coss, Crss VDS VDS = 10 V f = 1 kHz Ta = 25°C 1.4 4 Gate to source voltage VGS (V) 0 0.5 0.6 6 Input capacitance (Common source), Output capacitance (Common source), Reverse transfer capacitance (Common source) Ciss,Coss,Crss (pF) Forward transfer admittance |Yfs| (S) Drain to source ON-resistance RDS(ON) (Ω) 4 Ta = 25°C 1.2 0 0.8 Yfs ID 0 2 3 1.6 0.4 1.0 Gate to source voltage VGS (V) 1.4 0.6 1.2 0 0 12 ID = 0.5 A Ta = 25°C 1.4 2.0 Drain current ID (A) 2.5 140 f = 1 MHz Ta = 25°C 120 100 80 Ciss 60 Coss 40 20 Crss 0 0.3 1 3 10 30 100 300 Drain to source voltage VDS (V)