X-ray TDI camera C12200 series High speed readout Large field of view High Resolution High Sensitivity Evolutional high speed scanning with TDI technology High speed readout 36.8 m/min. Detection area 293 mm Horizontal spatial resolution 6144 pixels X-ray TDI camera C12200 Series is useful for in-line applications requiring high-speed operation with high sensitivity. TDI imaging is appropriate for applications where it is desired to record a linear movement, or where the aspect ratio of the subject being imaged is significantly asymmetric. Low brightness under high resolution usage, a problem with conventional line sensor cameras, is improved with this X-ray TDI camera, making it suitable for applications which require high resolution. Printed circuit board (PCB) inspection Surface-mounted component inspection Battery inspection High-resolution in-line non-destructive inspection TDI technology Time Delay Integration is a technology of scanning in which a frame transfer device produces a continuous video image of a moving object by means of a stack of linear arrays aligned with and synchronized to the motion of the object to be imaged in such a way that, as the image moves from one line to the next, the integrated charge moves along with it, providing higher resolution at lower light levels than is possible with a line-scan camera. Shield box X-ray source Object motion Object X-ray TDI camera Conveyor belt TDI sensor Signal intensity Features High S/N ratio with 12 bit (-321) /16 bit (-461) output Camera Link interface (Base configuration) Single power supply (+15 V) operation Real time dark current / shading correction function Frame readout mode for easy installation alignment High-resolution, High-speed Camera with a Large Field of View for In-line 100 % X-ray Inspection High speed readout Large field of view High Resolution High Sensitivity TDI technology offers all four simultaneously. High resolution image acquisition X-ray Source Large field of view Object X-ray TDI Camera High speed readout *C12200-321 measurement image SPECIFICATIONS Type number Scintillator Window Effective X-ray tube voltage range CCD pixel size Number of pixels X-ray sensitive area TDI line rate 1×1 C12200-461 CsI Scintillator FOS (Fiber optic plate with scintillator) Approx. 25 kV to 90 kV *1 48 μm × 48 μm 6144 (H) × 110 (V) *2 4608 (H) × 110 (V) 221.1 mm (H) × 5.2 mm (V) 293.4 mm (H) × 5.2 mm (V) Max. 8.0 kHz (23.04 m/min) Max. 6.4 kHz (36.864 m/min) 5.0 MHz 12 bit 16 bit Camera Link Base Configuration 40 MHz 50 MHz 12 bit digital output 16 bit digital output DC +15 V Approx. 40 VA C12200-321 Binning 2 × 2 CCD pixel clock A/D converter Digital interface Interface (Camera Link) Pixel clock (Camera Link) Output signals (Image data) Power supply Power consumption *1 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance. *2 "Active CCD pixel number" is all outputting pixel number including overlapped pixel. When the overlapped pixels are deleted, actual pixel numbers will vary. And also, X-ray sensitive area will vary. Dead space between chips Wide detection width with no dead areas. C12200-461 offers a wide detection area with no dead areas due to its staggered sensors. C12200-321 (Unit: mm) Dead space 1 Center chip Left chip Edge pixel Right chip Center chip 10 pixels C12200-461 (Min. 4 pixels, Max. 16 pixels) Dead space 2: 130 μm min. 200 μm max. ±50 μm MAX. Edge pixel ±50 μm MAX. Dead space 1: 130 μm min. 200 μm max. Dead space 2 Overlapped type measurement example 15.1±0.5 C12200-321 has a following dead space between chips. MEASUREMENT EXAMPLES Inspection of a solder's back fillet Soldering failure Normal soldering Line scan Line scan Profile If the back fillet of the solder on a PCB has a defect, a connection error will occur even with small vibrations. For observation of the back fillet part, X-ray transmission technique has been applied but only with an off-line system. Our X-ray TDI camera realizes in-line inspection because it can acquire high speed profile data with high sensitivity. 3D brightness level can be displayed using software. 3D display Defect point Lithium-ion battery inspection In case of 2D sensor, the dimensional measurement cannot be implemented correctly because the image is distorted on the corner areas of the X-ray irradiation. The long length sample needs to be located on center of X-ray source, so the sample has to be relocated each time. X-ray TDI camera can capture the image with no distortion by line scan method, so it is not necessary to relocate the samples and it enables the continuous inspection for long length object without stopping. Inspection by 2D sensor X-ray image intensifier (I.I.) camera : Not necessary to relocate the samples and possible to inspect the long length object with no distortion. The image is distorted on the corner areas in thickness direction, and the dimensional measurement cannot be implemented correctly. Inspection by X-ray TDI camera X-ray TDI camera : The non-distortion image can be realized since X-ray is radiated vertically to the object and the dimensional measurement can be implemented correctly. Slack of rolling Possible to inspect the mismatch of rolling and measure the length of electrode with no distortion. Short of the solution Condition of the connection on electrode MEASUREMENT EXAMPLES Void inspection of BGAs (Ball Grid array) X-ray TDI camera Line sensor reduced X-ray irradiation area X-ray light source X-ray TDI camera can inspect the samples easily by high speed scan with narrow irradiate area. S/N ratio is one of advantage and low X-ray radiation is enough to inspect the void existence. Furthermore it contribute to make a smaller size of system by reducing a lot of X-ray irradiation. DIMENSIONAL OUTLINES X-ray TDI camera can reduce the X-ray irradiation on the sample dramatically by high speed with narrow irradiation area. So it can reduce the risks to break down the ICs on the PC. (Sensor position) 160 30 10.6 15.1 4-Φ4.5 228 300 360 134 123 6(Sensor range) 112 64 11 160 50.05 5.5 370 25 5.5 (Unit: mm) C12200-461 (Approx. 7 kg) 32 (Sensor range) 11 221 Moving direction 293 239 250 C12200-321 (Approx. 5 kg) Object (Sensor range) 270 302.2 6−Φ4.5 66 50 147 42.4 (Approx. 2 kg) 32.5 A8206-35 (Option) (Sensor position) 50 10.7 (Sensor position) (38.264) 16.1 2-M4 D=6 OPTIONS Power supply unit : A8206-35 Power cable 5 m : A10847-05 Software API Support (Microsoft Windows) : DCAM-API (http://www.dcamapi.com) Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers. Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative. Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearance are subject to change without notice. © 2016 Hamamatsu Photonics K.K. HAMAMATSU PHOTONICS K.K. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Systems Division 812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: [email protected] U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, NJ 08807, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected] Germany: Hamamatsu Photonics Deutschland GmbH.: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-265-8 E-mail: [email protected] France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected] United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court,10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, UK, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected] North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected] Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39)02-935-81-733, Fax: (39)02-935-81-741 E-mail: [email protected] China: Hamamatsu Photonics (China) Co., Ltd.: 1201 Tower B, Jiaming Center, 27 Dongsanhuan Beilu, Chaoyang District, 100020 Beijing, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected] Taiwan: Hamamatsu Photonics Taiwan Co., Ltd.: 8F-3, No.158, Section2, Gongdao 5th Road, East District, Hsinchu, 300, Taiwan R.O.C. Telephone: (886)03-659-0080, Fax: (886)07-811-7238 E-mail: [email protected] Cat. No. SFAS0026E12 JUN/2016 HPK Created in Japan