X-ray TDI camera C12200 series High speed readout Large field of view High Resolution High Sensitivity Evolutional high speed scanning with TDI technology High speed readout Detection area Horizontal spatial resolution 36.8 293 6144 m/min. mm pixels X-ray TDI camera C12200 Series is useful for in-line applications requiring high-speed operation with high sensitivity. TDI imaging is appropriate for applications where it is desired to record a linear movement, or where the aspect ratio of the subject being imaged is significantly asymmetric. Low brightness under high resolution usage, a problem with conventional line sensor cameras, is improved with this X-ray TDI camera, making it suitable for applications which require high resolution. Printed circuit board (PCB) inspection Surface-mounted component inspection Battery inspection High-resolution in-line non-destructive inspection TDI technology Time Delay Integration is a technology of scanning in which a frame transfer device produces a continuous video image of a moving object by means of a stack of linear arrays aligned with and synchronized to the motion of the object to be imaged in such a way that, as the image moves from one line to the next, the integrated charge moves along with it, providing higher resolution at lower light levels than is possible with a line-scan camera. Shield box X-ray source Object motion Object X-ray TDI camera Conveyor belt TDI sensor Signal intensity Features High S/N ratio with 12 bit (-321) / 16 bit (-461) output Camera Link interface (Base configuration) Single power supply (+15 V) operation Real time dark current / shading correction function Frame readout mode for easy installation alignment High-resolution, High-speed Camera with a Large Field of View for In-line 100 % X-ray Inspection High speed readout Large field of view High Resolution High Sensitivity TDI technology offers all four simultaneously. High resolution image acquisition X-ray Source Large field of view Object X-ray TDI Camera *C12200-321 measurement image High speed readout SPECIFICATIONS Type number CCD pixel number Active CCD pixel number CCD pixel size X-ray sensitive area X-ray receiving surface Scintillator type Recommended use range CCD pixel clock 1×1 TDI line rate C12200-461 6144 (H) × 128 (V) 6144 (H) × 110 (V) *1 C12200-321 4608 (H) × 128 (V) 4608 (H) × 110 (V) 48 μm × 48 μm 221 mm (H) × 6 mm (V) 293 mm (H) × 6 mm (V) FOS (Fiber optic plate with scintillator) CsI Approx. 25 kV to 90 kV *2 5.0 MHz 1.0 kHz to 8.0 kHz (2.88 m/min to 23.04 m/min) 1.0 kHz to 6.4 kHz (5.76 m/min to 36.864 m/min) 12 bit 16 bit 12 bit 16 bit Base Configuration 40 MHz 50 MHz 0 dB to 14 dB (64 steps) DC +15 V (±1 V) 40 VA 45 VA binning 2 × 2 A/D converter Data output Interface (Camera Link) Pixel clock (Camera Link) A/D gain value Power requirements Power consumption *1 "Active CCD pixel number" is all outputting pixel number including overlapped pixel. When the overlapped pixels are deleted, actual pixel numbers will vary. And also, X-ray sensitive area will vary. *2 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance. Dead space between chips Wide detection width with no dead areas. C12200-321 has a following dead space between chips. The effect by the dead space to X-ray image depends on the measurement conditions such as X-ray magnification ratio and X-ray source's focus size. C12200-461 offers a wide detection area with no dead areas due to its staggered sensors. 10 pixels Center chip Left chip Dead space 1: 130 μm min. 200 μm max. ±50 μm MAX. Edge pixel Dead space 2 C12200-461 (Min. 4 pixels, Max. 16 pixels) Right chip Center chip Edge pixel Dead space 2: 130 μm min. 200 μm max. ±50 μm MAX. Dead space 1 Overlapped type measurement example 15.1±0.5 (Unit: mm) C12200-321 MEASUREMENT EXAMPLES Inspection of a solder's back fillet Soldering failure Normal soldering Line scan Line scan Profile If the back fillet of the solder on a PCB has a defect, a connection error will occur even with small vibrations. For observation of the back fillet part, X-ray transmission technique has been applied but only with an off-line system. Our X-ray TDI camera realizes in-line inspection because it can acquire high speed profile data with high sensitivity. 3D brightness level can be displayed using software. 3D display Defect point Lithium-ion battery inspection In case of 2D sensor, the dimensional measurement cannot be implemented correctly because the image is distorted on the corner areas of the X-ray irradiation. The long length sample needs to be located on center of X-ray source, so the sample has to be relocated each time. X-ray TDI camera can capture the image with no distortion by line scan method, so it is not necessary to relocate the samples and it enables the continuous inspection for long length object without stopping. Inspection by 2D sensor X-ray image intensifier (I.I.) camera : Not necessary to relocate the samples and possible to inspect the long length object with no distortion. The image is distorted on the corner areas in thickness direction, and the dimensional measurement cannot be implemented correctly. Inspection by X-ray TDI camera X-ray TDI camera: The non-distortion image can be realized since X-ray is radiated vertically to the object and the dimensional measurement can be implemented correctly. Slack of rolling Possible to inspect the mismatch of rolling and measure the length of electrode with no distortion. Short of the solution Condition of the connection on electrode MEASUREMENT EXAMPLES Void inspection of BGAs X-ray TDI camera Line sensor reduced X-ray irradiation area X-ray light source X-ray TDI camera can inspect the samples easily by high speed scan with narrow irradiate area. S/N ratio is one of advantage and low X-ray radiation is enough to inspect the void existence. Furthermore it contribute to make a smaller size of system by reducing a lot of X-ray irradiation. X-ray TDI camera can reduce the X-ray irradiation on the sample dramatically by high speed with narrow irradiation area. So it can reduce the risks to break down the ICs on the PC. 160±0.5 160±0.5 10.6 11±0.5 293 239±0.5 250±0.5 15.1±0.3 4-φ4.5 30±0.2 300±0.2 360±0.5 50.05±0.5 (Sensor position) 370±0.5 25±0.5 228±0.5 64±0.5 6(Sensor range) 112±0.5 C12200-461 (Approx. 7 kg) 134±0.5 32±0.5 (Sensor range) 123±0.2 11±0.5 221 5.5±0.2 C12200-321 (Approx. 5 kg) 5.5±0.3 DIMENSIONAL OUTLINES (Unit: mm) (Sensor range) 10.7±0.5 50±0.5 (38.264±0.5) (Approx. 2 kg) 270±0.5 302.2 42.4±0.5 50±0.5 66 (Sensor position) 6−φ4.5 147 32.5 A8206-35 (Option) 16.1 2-M4 D=6 OPTIONS Power supply unit : A8206-35 Power cable 5 m : A10847-05 Software API Support (Microsoft Windows) : DCAM-API (http://www.dcamapi.com) ★ Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers. ● ● Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative. Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearance are subject to change without notice. © 2015 Hamamatsu Photonics K.K. HAMAMATSU PHOTONICS K.K. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Systems Division 812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: [email protected] U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J 08807, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected] Germany: Hamamatsu Photonics Deutschland GmbH.: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-265-8 E-mail: [email protected] France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected] United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court,10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, UK, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected] North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected] Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6 20020 Arese (Milano), Italy, Telephone: (39)02-93581733, Fax: (39)02-93581741 E-mail: [email protected] China: Hamamatsu Photonics (China) Co., Ltd.: B1201 Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected] Cat. No. SFAS0026E10 MAR/2015 HPK Created in Japan