X-ray TDI camera C10650 series High speed readout Large field of view High resolution High sensitivity High quality image output with high resolution achieved by TDI technology Max. Horizontal spatial resolution Max. 10.7 586 m/min. mm 6144×2 High speed readout Detection area pixels X-ray TDI camera C10650 series is useful for in-line applications requiring high-speed operation with high sensitivity. TDI imaging is appropriate for applications where it is desired to record a linear movement, or where the aspect ratio of the subject being imaged is significantly asymmetric. Low brightness under high resolution usage, a problem with conventional line sensor cameras, is improved with this X-ray TDI camera, making it suitable for applications which require high resolution. Vertical X-ray TDI cameras that can be installed in narrow spaces are new additions to the series. Printed circuit board (PCB) inspection Surface-mounted component inspection Lithium-ion battery inspection High-resolution in-line non-destructive inspection TDI technology Time Delay Integration is a scanning technology in which a frame transfer device produces a continuous video image of a moving object by means of a stack of linear arrays aligned with and synchronized to the motion of the object to be imaged in such a way that, as the image moves from one line to the next, the integrated charge moves along with it, providing higher resolution at lower light levels than is possible with a line-scan camera. Shield box X-ray source Object Motion Object X-ray TDI camera Conveyor belt TDI sensor Signal intensity Features High S/N ratio with 12 bit / 16 bit output Camera Link interface (Base configuration) Single power supply (+15 V) operation Real time dark current / shading correction function Frame readout mode for easy installation alignment High-resolution, High-speed Camera with a Large Field of View for In-line 100 % X-ray Inspection High speed readout Large field of view High resolution High sensitivity TDI technology offers all four simultaneously. High resolution image acquisition X-ray Source Large field of view Object Detect dark sample with high sensitivity X-ray TDI Camera High speed readout PRODUCT LINEUP Standard type Type number Sensor number X-ray sensitive area C10650-221 2 145 mm C10650-321 3 221 mm C10650-261 2 146 mm C10650-361 3 220 mm C10650-461 4 293 mm C10650-261V 2 146 mm C10650-361V 3 220 mm C10650-461V 4 293 mm C10650-361W 7 513 mm C10650-461W 8 586 mm Horizontal chassis / Overlap type Type number Sensor number X-ray sensitive area Vertical chassis / Overlap type Type number Sensor number X-ray sensitive area Vertical chassis / Overlap type (2 cameras output) Type number Sensor number X-ray sensitive area C10650-261W 6 439 mm SPECIFICATIONS Type number CCD pixel number Active CCD pixel number CCD pixel size X-ray sensitive area X-ray receiving surface Scintillator type Recommended use range CCD pixel clock TDI line rate 1×1 binning 2 × 2 A/D converter Data output Interface (Camera Link) Pixel clock (Camera Link) A/D gain value *3 Power requirements Power consumption C10650-221 3072(H) × 128(V) 3040(H) × 128(V) C10650-321 4608(H) × 128(V) 4608(H) × 128(V) C10650-461V C10650-461 6144(H) × 128(V) 6144(H) × 128(V) *1 48 μm × 48 μm 145 mm(H) × 6 mm(V) 221 mm(H) × 6 mm(V) 293 mm(H) × 6 mm(V) *1 FOS (Fiber optic plate with scintillator) CsI Approx. 25 kV to 90 kV *2 4.0 MHz 62 Hz to 2.109 kHz (0.178 m/min to 6.073 m/min) 62 Hz to 1.858 kHz (0.357 m/min to 10.702 m/min) 12 bit 16 bit 12 bit 16 bit Base Configuration 16.0 MHz 0 dB to 20 dB (64 steps) DC +15 V (±1 V) 25 VA 30 VA C10650-461W 6144 × 2(H) ×128(V) 6144 × 2(H) × 128(V) *1 586 mm(H) × 6 mm(V)*1 30 VA + 30 VA *4 *1 "Active CCD pixel number" is all outputting pixel number including overlapped pixel. When the overlapped pixels are deleted, actual pixel numbers will vary. And also, X-ray sensitive area will vary. *2 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance. *3 Multiple gain option (M8815-01) is optional. *4 2 units of the power supply unit and the power cable are necessary for C10650-461W. MEASUREMENT EXAMPLES Inspection of a solder's back fillet If the back fillet of the solder on a PCB has a defect, a connection error will occur even with small vibrations. For observation of the back fillet part, X-ray transmission technique has been applied but only with an off-line system. Our X-ray TDI camera realizes in-line inspection because it can acquire high speed profile data with high sensitivity. 3D brightness level can be displayed using software. Soldering failure Normal soldering Line scan Line scan Lithium-ion battery inspection In case of 2D sensor, the dimensional measurement cannot be implemented correctly because the image is distorted on the corner areas of the X-ray irradiation. The long length sample needs to be located on center of X-ray source, so the sample has to be relocated each time. X-ray TDI camera can capture the image with no distortion by line scan method, so it is not necessary to relocate the samples and it enables the continuous inspection for long length object without stopping. Not necessary to relocate the samples and possible to inspect the long length object with no distortion. Inspection by 2D sensor Inspection by X-ray TDI camera Profile X-ray image intensifier (I.I.) camera : X-ray TDI camera: The image is distorted on the corner areas in thickness direction, and the dimensional measurement cannot be implemented correctly. The non-distortion image can be realized since X-ray is radiated vertically to the object and the dimensional measurement can be implemented correctly. Slack of rolling 3D display Defect point Short of the solution Condition of the connection on electrode Dead space between chips Wide detection width with no dead areas Standard type have dead space between chips as shown below. The effect of the dead space on an X-ray image depends on the measurement conditions such as X-ray magnification ratio and X-ray source's focus size. The overlapped type offers a wide detection area with no dead areas due to its staggered sensors. 10 pixels C10650-321 C10650-461 Center chip Edge pixel Dead space 1: 250 μm min. 350 μm max. ±50 μm MAX. Left chip Dead space 2 Center chip Edge pixel Dead space 2: 130 μm min. 200 μm max. Right chip ±50 μm MAX. Dead space 1 (Min. 4 pixels, Max. 16 pixels) Overlapped type measurement example 15.1±0.5 (Unit: mm) C10650-221 DIMENSIONAL OUTLINES (Unit: mm) C10650-221 (Approx. 5 kg) C10650-261V, -361V, -461V (Approx. 7 kg) 360±0.5 300 32.9±0.5 15.1 10.6 65±0.2 80 16 130±1 10.7±0.3 146 (Sensor range : C10650-261V) 220 (Sensor range : C10650-361V) 293 (Sensor range : C10650-461V) 6±0.2 5±0.2 73.764±0.5 360±0.5 300 221 (Sensor range) 175±1 C10650-321 (Approx. 5 kg) 30 32.9 371±1 5.5 112±0.5 6(Sensor range) 64 123 134±0.5 11±0.5 2-φ8.2 39±0.5 (Sensor position) 5.5 112±0.5 50±0.5 4-φ4.5 407±1 17 6(Sensor range) 64±0.5 123 134±0.5 11±0.5 441±1 30 145 (Sensor range) 10.7 50±0.5 4-φ4.5 C10650-261, -361, -461 (Approx. 7 kg) (15.1) 10.6 (38.264±0.5) 65±0.2 80 (Sensor position) 664±1 A8206-35 (Option) (Approx. 2 kg) 147 66 32.5 270±0.5 302.2 175±1 42.4±0.5 (Sensor position) 50±0.5 6-φ4.5 6±0.2 8.3 5±0.2 73.764±0.5 439 (Sensor range : C10650-261W) 513 (Sensor range: C10650-361W) 586 (Sensor range : C10650-461W) 22 239±0.5 250±0.5 293 (Sensor range : C10650-461) 2-φ8.2 130±1 39±0.5 (Sensor position) 50.05±0.5 10.6 220 (Sensor range : C10650-361) 734±1 700±1 1 15.1±0.3 146 (Sensor range : C10650-261) 228±0.5 C10650-261W, -361W, -461W (Approx. 16 kg) (Sensor position) 160±0.5 11±0.5 160±0.5 5.5±0.3 370±0.5 25±0.5 16.1 2-M4 D=6 OPTIONS Power supply unit : A8206-35 Power cable 5 m : A10847-05 Software API Support (Microsoft Windows) : DCAM-API (http://www.dcamapi.com) Additional function module 64 gain : M8815-01 ★ Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers. ● ● Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative. Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearance are subject to change without notice. © 2015 Hamamatsu Photonics K.K. HAMAMATSU PHOTONICS K.K. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Systems Division 812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: [email protected] U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J 08807, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected] Germany: Hamamatsu Photonics Deutschland GmbH.: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-265-8 E-mail: [email protected] France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected] United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court,10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, UK, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected] North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected] Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6 20020 Arese (Milano), Italy, Telephone: (39)02-93581733, Fax: (39)02-93581741 E-mail: [email protected] China: Hamamatsu Photonics (China) Co., Ltd.: B1201 Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected] Cat. No. SFAS0025E07 MAR/2015 HPK Created in Japan