PANASONIC MA26V09

Variable Capacitance Diodes
MA26V09
Silicon epitaxial planar type
Unit: mm
3
2
■ Features
1
0.39+0.01
−0.03
1.00±0.05
0.25±0.05
Parameter
Symbol
Rating
Unit
Reverse voltage (DC)
VR
6
V
Junction temperature
Tj
125
°C
Storage temperature
Tstg
−55 to +125
°C
0.25±0.05
1
0.50±0.05
■ Absolute Maximum Ratings Ta = 25°C
0.15±0.05
0.05±0.03
0.35±0.01
• Good linearity and large capacitance-ratio in CD − VR relation
• Small series resistance rD
0.60±0.05
For VCO
3
0.65±0.01
2
0.05±0.03
1: Anode
2: N.C.
3: Cathode
ML3-N2 Package
Marking Symbol: 2S
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Reverse current (DC)
Symbol
IR
Conditions
VR = 5 V
Diode capacitance
CD(1V)
VR = 1 V, f = 1 MHz
CD(3V)
VR = 3 V, f = 1 MHz
Capacitance ratio
CD(1V)/CD(3V)
Series resistance
*
rD
Min
VR = 3 V, f = 470 MHz
14.9
Typ
Max
Unit
10
nA
16.4
pF
8.4
9.2
1.69
1.87

0.35
Ω
Note) 1. Rated input/output frequency: 470 MHz
2. *: Measuring instrument; YHP MODEL 4191A RF IMPEDANCE ANALYZER
Publication date: July 2002
SKD00078BED
1
MA26V09
IF  V F
CD  VR
160
f = 1 MHz
1.032
1.028
120
Ta = 60°C
100
−40°C
60
40
1.024
VR = 1 V
1.020
CD (Ta)
CD (Ta = 25°C)
140
80
1.036
f = 1 MHz
Ta = 25°C
25°C
Diode capacitance CD (pF)
Forward current IF (mA)
CD  Ta
100
180
10
1.016
3V
1.012
1.008
1.004
1.000
0.996
0.992
20
0
0.988
1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Forward voltage VF (V)
0
1
2
3
Reverse current IR (nA)
VR = 5 V
1
0.1
0.01
0
20
40
60
80
100 120 140
Ambient temperature Ta (°C)
2
5
Reverse voltage VR (V)
IR  T a
10
4
SKD00078BED
6
0.984
0
20
40
60
80
Ambient temperature Ta (°C)
100
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
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2002 JUL