PANASONIC XP04878

Composite Transistors
XP04878
Silicon N-channel MOSFET
For switching
5
0.12+0.05
–0.02
4
■ Features
5˚
• Allowing 2.5 V drive
• Incorporating a built-in gate protection-diode
• S-Mini type 6-pin package, reduction of the mounting area and
assembly cost by one half
0.2±0.1
1.25±0.10
2.1±0.1
6
Unit: mm
(0.425)
0.2±0.05
1
3
2
(0.65) (0.65)
1.3±0.1
2.0±0.1
0.9±0.1
■ Basic Part Number
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Drain-source surrender voltage
VDSS
50
V
Gate-source voltage (Drain open)
VGSO
±7
V
Drain current
ID
100
mA
Peak drain current
IDP
200
mA
Total power dissipation
PT
150
mW
Channel temperature
Tch
150
°C
Storage temperature
Tstg
−55 to +150
°C
1: Source (FET1)
2: Gate (FET1)
3: Drain (FET2)
EIAJ: SC-88
Symbol
Internal Connection
Conditions
Drain-source surrender voltage
VDSS
ID = 10 µA, VGS = 0
Drain-source cutoff current
IDSS
VDS = 50 V, VGS = 0
Gate-source cutoff current
IGSS
VGS = ±7 V, VDS = 0
Gate threshold voltage
Vth
ID = 1 µA, VDS = 3 V
Drain-source ON resistance
Forward transfer admittance
RDS(on)
Yfs
4: Source (FET2)
5: Gate (FET2)
6: Drain (FET1)
SMini6-G1 Package
Marking Symbol: 7Y
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
0 to 0.1
• 2SK3539 × 2
0.9+0.2
–0.1
10˚
6
5
4
1
2
3
Min
Typ
Max
Unit
1.0
µA
50
V
±5
µA
1.2
1.5
V
ID = 10 mA, VGS = 2.5 V
8
15
Ω
ID = 10 mA, VGS = 4.0 V
6
12
ID = 10 mA, VGS = 4.0 V
VDS = 3 V, VGS = 0 V, f = 1 MHz
0.9
20
60
mS
12
pF
Short-circuit forward transfer
capacitance (Common-source)
Ciss
Short-circuit output capacitance
(Common-source)
Coss
7
pF
Reverse transfer capacitance
Crss
3
pF
(Common-source)
Turn-on time
ton
VDD = 3 V, VGS = 0 V to 3 V, RL = 470 Ω
200
ns
Turn-off time
toff
VDD = 3 V, VGS = 3 V to 0 V, RL = 470 Ω
200
ns
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring methods for transistors.
Publication date: December 2003
SJJ00263BED
1
XP04878
PT  Ta
ID  VDS
70
80
40
Ta = 25°C
60
VGS = 2.0 V
50
1.9 V
40
1.8 V
30
1.7 V
20
1.6 V
0
0
Ta = −25°C
200
25°C
75°C
150
100
40
80
120
160
1.5 V
0
2
4
6
8
Yfs  VGS
0.08
0.04
0
1.0
2.0
Gate-source voltage VGS (V)
0
3.0
1.0
2.0
3.0
Gate-source voltage VGS (V)
VIN  IO
10
VO = 5 V
Ta = 25°C
ID = 10 mA
50
Input voltage VIN (V)
Drain-source ON resistance RDS(on) (Ω)
VDS = 3 V
f = 1 MHz
Ta = 25°C
0.12
0
0
12
RDS(on)  VGS
60
0.16
10
Drain-source voltage VDS (V)
Ambient temperature Ta (°C)
Forward transfer admittance |Yfs | (mS)
VDS = 3 V
50
10
0
2
ID  VGS
250
Drain current ID (mA)
120
Drain current ID (mA)
Total power dissipation PT (mW)
160
40
30
20
Ta = 75°C
10
25°C
−25°C
0
1
0
2
4
6
Gate-source voltage VGS (V)
SJJ00263BED
10 −1
1
10
Output current IO (mA)
102
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
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2003 SEP