PANASONIC 2SK3938

Silicon MOSFETs (Small Signal)
2SK3938
Silicon N-channel MOSFET
For switching circuits
Unit: mm
 Features
0.33+0.05
–0.02
 High-speed switching
 SSSMini type package, allowing downsizing of the equipment and automatic insertion through the tape packing
Drain-source surrender voltage
VDSS
30
V
Gate-source surrender voltage
VGSS
±12
V
Drain current
ID
100
mA
Peak drain current
IDP
200
mA
Power dissipation
PD
100
mW
Channel temperature
Tch
125
°C
Storage temperature
Tstg
–55 to +125
°C
0.15 min.
5°
0.80±0.05
1.20±0.05
5°
0.15 max.
Unit
0.52±0.03
Rating
0 to 0.01
Symbol
2
(0.40) (0.40)
0.15 min.
1
0.23+0.05
–0.02
1.20±0.05
0.80±0.05
3
 Absolute Maximum Ratings Ta = 25°C
Parameter
0.10+0.05
–0.02
1: Gate
2: Source
3: Drain
SSSMini3-F1 Package
Marking Symbol: 6U
 Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Drain-source surrender voltage
VDSS
ID = 10 µA, VGS = 0
Drain-source cutoff current
IDSS
VDS = 20 V, VGS = 0
1.0
µA
Gate-source cutoff current
IGSS
VGS = ±10
10 V, VDS = 0
±10
µA
Gate threshold voltage
VTH
ID = 1.0 µA,
A, VDS = 3 V
1.0
1.5
V
ID = 10 mA, VGS = 2.5 V
7
12
ID = 10 mA, VGS = 4.0 V
5
8
Drain-source ON resistance
RDS(on)
Forward transfer admittance
Yfs
30
Unit
V
0.5
ID = 10 mA, VDS = 3 V, f = 1 kHz
20
Ω
55
mS
12
pF
10
pF
6
pF
Short-circuit forward transfer capacitance
(Common source)
Ciss
Short-circuit output capacitance
(Common source)
Coss
Reverse transfer capacitance
(Common source)
Crss
Turn-on time *
ton
VDD = 3 V, VGS = 0 V to 3 V, ID = 10 mA
350
ns
*
toff
VDD = 3 V, VGS = 3 V to 0 V, ID = 10 mA
350
ns
Turn-off time
VDS = 3 V, VGS = 0, f = 1 MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. * : ton , toff measurement circuit
VOUT
90%
290 Ω
10%
VGS
VOUT
VGS = 0 V to 3 V
50 Ω
100 µF
VDD = 3 V
ton
Publication date: December 2004
SJF00043AED
10%
90%
toff
of
1
2SK3938
2SK3938_ PD-Ta
2SK3938_ ID-VDS
PD  Ta
2SK3938_ ID-VGS
ID  VDS
ID  VGS
120
120
80
40
VGS = 2.8 V
80
2.6 V
2.4 V
40
VDS = 3 V
Ta = −25°C
120
Drain current ID (mA)
Drain current ID (A)
Power dissipation PD (mW)
Ta = 25°C
25°C
85°C
80
40
2.2 V
2.0 V
0
80
40
0
120
0
2
3
4
2SK3938_ Yfs -VGS
2SK3938_ Yfs -ID
2SK3938_ RDS(on)-VGS
Yfs  ID
Ta = −25°C
120
25°C
85°C
80
40
1
2
3
Forward transfer admittance Yfs  (mS)
Forward transfer admittance Yfs  (mS)
1
Gate-source voltage VGS (V)
Gate-source voltage VGS (V)
2
0
Drain-source voltage VDS (V)
VDS = 3 V
0
0
12
8
Ambient temperature Ta (°C)
Yfs  VGS
0
4
VGS = 3 V
Ta = 25°C
120
80
40
0
0
20
40
60
80
Drain current ID (mA)
SJF00043AED
5
RDS(on)  VGS
20
Drain-source ON resistance RDS(on) (Ω)
0
100
ID = 10 mA
16
12
8
Ta = 85°C
4
0
25°C
−25°C
0
4
8
Gate-source voltage VGS (V)
12
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP