Data Sheet

BAS32L
High-speed switching diode
Rev. 7 — 20 January 2011
Product data sheet
1. Product profile
1.1 General description
Single high-speed switching diode, fabricated in planar technology, and encapsulated in a
small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package.
1.2 Features and benefits
„
„
„
„
„
High switching speed: trr ≤ 4 ns
Reverse voltage: VR ≤ 75 V
Repetitive peak reverse voltage: VRRM ≤ 100 V
Repetitive peak forward current: IFRM ≤ 450 mA
Small hermetically sealed glass SMD package
1.3 Applications
„ High-speed switching
„ Reverse polarity protection
1.4 Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
IF
forward current
IFRM
repetitive peak forward
current
VR
reverse voltage
VF
forward voltage
trr
reverse recovery time
Conditions
[1]
IF = 100 mA
[2]
Min
Typ
Max
Unit
-
-
200
mA
-
-
450
mA
-
-
75
V
-
-
1000
mV
-
-
4
ns
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
BAS32L
NXP Semiconductors
High-speed switching diode
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
k
a
2
1
006aab040
[1]
The marking band indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
BAS32L
-
hermetically sealed glass surface-mounted package;
2 connectors
SOD80C
Table 4.
Marking codes
4. Marking
Type number
Marking code
BAS32L
marking band
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
BAS32L
Product data sheet
Symbol
Parameter
VRRM
repetitive peak reverse
voltage
VR
reverse voltage
IF
forward current
IFRM
repetitive peak forward
current
IFSM
non-repetitive peak forward
current
Conditions
Min
Max
Unit
-
100
V
-
75
V
-
200
mA
-
450
mA
tp = 1 μs
-
4
A
tp = 1 ms
-
1
A
tp = 1 s
-
0.5
A
[1]
square wave
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 20 January 2011
[2]
© NXP B.V. 2011. All rights reserved.
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BAS32L
NXP Semiconductors
High-speed switching diode
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Ptot
total power dissipation
Tamb = 25 °C
-
500
mW
Tj
junction temperature
-
200
°C
Tamb
ambient temperature
−65
+200
°C
Tstg
storage temperature
−65
+200
°C
[1]
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Tj = 25 °C prior to surge.
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Rth(j-a)
thermal resistance from
junction to ambient
Rth(j-sp)
thermal resistance from
junction to solder point
[1]
in free air
[1]
Min
Typ
Max
Unit
-
-
350
K/W
-
-
300
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 5 mA
620
-
750
mV
IF = 100 mA
-
-
1000
mV
IF = 100 mA; Tj = 100 °C
-
-
930
mV
VR = 20 V
-
-
25
nA
VR = 75 V
-
-
5
μA
VR = 20 V; Tj = 150 °C
-
-
50
μA
VR = 75 V; Tj = 150 °C
-
-
100
μA
IR
Cd
BAS32L
Product data sheet
reverse current
diode capacitance
VR = 0 V; f = 1 MHz
trr
reverse recovery
time
[1]
VFR
forward recovery
voltage
[2]
-
-
2
pF
-
-
4
ns
-
-
2.5
V
[1]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
[2]
When switched from IF = 50 mA; tr = 20 ns.
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 20 January 2011
© NXP B.V. 2011. All rights reserved.
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BAS32L
NXP Semiconductors
High-speed switching diode
mbg451
300
mbg464
600
IF
(mA)
IF
(mA)
200
400
(1)
(2)
(3)
200
100
0
0
0
100
0
200
Tamb (°C)
1
VF (V)
2
(1) Tj = 175 °C; typical values
FR4 PCB, standard footprint
(2) Tj = 25 °C; typical values
(3) Tj = 25 °C; maximum values
Fig 1.
Forward current as a function of ambient
temperature; derating curve
Fig 2.
mbg704
102
Forward current as a function of forward
voltage
mgd006
103
IR
(μA)
IFSM
(A)
102
10
(1)
(2)
(3)
10
1
1
10−1
10−1
1
10
102
103
104
10−2
0
100
tp (μs)
Based on square wave currents.
(1) VR = 75 V; maximum values
Tj = 25 °C prior to surge
(2) VR = 75 V; typical values
Tj (°C)
200
(3) VR = 20 V; typical values
Fig 3.
Non-repetitive peak forward current as a
function of pulse duration; maximum values
BAS32L
Product data sheet
Fig 4.
Reverse current as a function of junction
temperature
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Rev. 7 — 20 January 2011
© NXP B.V. 2011. All rights reserved.
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BAS32L
NXP Semiconductors
High-speed switching diode
mgd004
1.2
Cd
(pF)
1.0
0.8
0.6
0.4
0
10
20
VR (V)
f = 1 MHz; Tj = 25 °C
Fig 5.
Diode capacitance as a function of reverse voltage; typical values
8. Test information
tr
tp
t
D.U.T.
10 %
+ IF
IF
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
trr
t
Ri = 50 Ω
V = VR + IF × RS
(1)
90 %
VR
mga881
input signal
output signal
Input signal: Reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty factor δ ≤ 0.05
Oscilloscope: Rise time tr = 0.35 ns
(1) IR = 1 mA
Fig 6.
Reverse recovery time test circuit and waveforms
I
1 kΩ
RS = 50 Ω
D.U.T.
450 Ω
I
V
90 %
OSCILLOSCOPE
VFR
Ri = 50 Ω
10 %
t
tr
t
tp
input signal
output signal
mga882
Input signal: Forward pulse rise time tr = 20 ns; forward current pulse duration tp ≥ 100 ns; duty factor δ ≤ 0.005
Fig 7.
Forward recovery voltage test circuit and waveforms
BAS32L
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 20 January 2011
© NXP B.V. 2011. All rights reserved.
5 of 11
BAS32L
NXP Semiconductors
High-speed switching diode
9. Package outline
0.3
0.3
1.60
1.45
3.7
3.3
Dimensions in mm
Fig 8.
06-03-16
Package outline SOD80C
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
BAS32L
[1]
BAS32L
Product data sheet
Package
SOD80C
Description
4 mm pitch, 8 mm tape and reel
Packing quantity
2500
10000
-115
-135
For further information and the availability of packing methods, see Section 14.
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 20 January 2011
© NXP B.V. 2011. All rights reserved.
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BAS32L
NXP Semiconductors
High-speed switching diode
11. Soldering
4.55
4.30
2.30
solder lands
solder paste
2.25 1.70 1.60
solder resist
occupied area
Dimensions in mm
0.90
(2x)
Fig 9.
sod080c
Reflow soldering footprint SOD80C
6.30
4.90
2.70
1.90
solder lands
solder resist
occupied area
2.90 1.70
tracks
Dimensions in mm
sod080c
Fig 10. Wave soldering footprint SOD80C
BAS32L
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 20 January 2011
© NXP B.V. 2011. All rights reserved.
7 of 11
BAS32L
NXP Semiconductors
High-speed switching diode
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAS32L v.7
20110120
Product data sheet
-
BAS32L v.6
Modifications:
•
•
Table 4 “Marking codes”: amended
Section 13 “Legal information”: updated
BAS32L v.6
20081029
Product data sheet
-
BAS32L v.5
BAS32L v.5
20080103
Product data sheet
-
BAS32L v.4
BAS32L v.4
20050322
Product data sheet
-
BAS32L v.3
BAS32L v.3
20020123
Product specification
-
BAS32L v.2
BAS32L v.2
19960910
Product specification
-
BAS32L v.1
BAS32L v.1
19960423
Product specification
-
-
BAS32L
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 20 January 2011
© NXP B.V. 2011. All rights reserved.
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BAS32L
NXP Semiconductors
High-speed switching diode
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BAS32L
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 20 January 2011
© NXP B.V. 2011. All rights reserved.
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BAS32L
NXP Semiconductors
High-speed switching diode
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BAS32L
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 20 January 2011
© NXP B.V. 2011. All rights reserved.
10 of 11
BAS32L
NXP Semiconductors
High-speed switching diode
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 20 January 2011
Document identifier: BAS32L