Si1025X Vishay Siliconix P-Channel 60 V (D-S) MOSFET FEATURES PRODUCT SUMMARY VDS (min) (V) RDS(on) () VGS(th) (V) ID (mA) - 60 4 at VGS = - 10 V - 1 to - 3.0 - 500 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFETs • High-Side Switching • Low On-Resistance: 4 • Low Threshold: - 2 V (typ.) • Fast Switching Speed: 20 ns (typ.) • Low Input Capacitance: 23 pF (typ.) • Miniature Package • Gate-Source ESD Protected: 2000 V • Compliant to RoHS Directive 2002/95/EC SC-89 1 G1 2 5 G2 D2 3 4 S2 6 BENEFITS D1 S1 Marking Code: D • • • • • • Ease in Driving Switches Low Offset Voltage Low-Voltage Operation High-Speed Circuits Easily Driven Without Buffer Small Board Area Top View Ordering Information: Si1025X-T1-GE3 (Lead (Pb)-free and Halogen-free) APPLICATIONS • Drivers: Relays, Solenoids, Lamps, Hammers, Displays, Memories, Transistors etc. • Battery Operated Systems • Power Supply Converter Circuits • Solid State Relays ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol 5s Steady State Drain-Source Voltage VDS - 60 Gate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 150 °C)a Pulsed Drain TA = 25 °C TA = 85 °C Currentb Operating Junction and Storage Temperature Range Gate-Source ESD Rating (HBM, Method 3015) - 200 IS TA = 25 °C TA = 85 °C PD V - 190 - 145 IDM Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa ID Unit - 135 - 650 - 450 - 380 280 250 145 130 mA mW TJ, Tstg - 55 to 150 °C ESD 2000 V Notes: a. Surface mounted on FR4 board. b. Pulse width limited by maximum junction temperature. Document Number: 71433 S10-2432-Rev. C, 25-Oct-10 www.vishay.com 1 Si1025X Vishay Siliconix SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) Parameter Symbol Test Conditions Min. VDS VGS = 0 V, ID = - 10 µA - 60 VGS(th) VDS = VGS, ID = - 0.25 mA -1 Typ. Max. Unit Static Drain-Source Breakdown Voltage Gate Threshold Voltage IGSS Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta IDSS VDS = 0 V, VGS = ± 10 V ± 200 VDS = 0 V, VGS = ± 5 V ± 100 VDS = - 50 V, VGS = 0 V - 25 VDS = - 50 V, VGS = 0 V, TJ = 85 °C ID(on) Drain-Source RDS(on) Forward Transconductancea Diode Forward Voltagea - 50 VDS = - 10 V, VGS = - 10 V - 600 mA 8 VGS = - 10 V, ID = - 500 mA 4 VGS = - 10 V, ID = - 500 mA, TJ = 125 °C 6 gfs VDS = - 10 V, ID = - 100 mA VSD IS = - 200 mA, VGS = 0 V nA - 250 VDS = - 10 V, VGS = - 4.5 V VGS = - 4.5 V, ID = - 25 mA On-Resistancea V - 3.0 100 mS - 1.4 V Dynamicb Qg Total Gate Charge Gate-Source Charge Qgs Gate-Drain Charge Qgd Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Switchingb, c Turn-On Time tON Turn-Off Time tOFF 1.7 VDS = - 30 V, VGS = - 15 V, ID - 500 mA nC 0.26 0.46 23 VDS = - 25 V, VGS = 0 V, f = 1 MHz pF 10 5 VDD = - 25 V, RL = 150 , ID - 165 mA, VGEN = - 10 V, Rg = 10 20 ns 35 Notes: a. Pulse test; pulse width 300 µs, duty cycle 2 %. b. For DESIGN AID ONLY, not subject to production testing. c. Switching time is essentially independent of operating temperature. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) 1200 1.0 VGS = 10 V TJ = - 55 °C 7V 8V I D - Drain Current (mA) I D - Drain Current (A) 0.8 6V 0.6 0.4 5V 900 25 °C 125 °C 600 300 0.2 4V 0.0 0 0 1 2 3 4 VDS - Drain-to-Source Voltage (V) Output Characteristics www.vishay.com 2 5 0 2 4 6 8 10 VGS - Gate-to-Source Voltage (V) Transfer Characteristics Document Number: 71433 S10-2432-Rev. C, 25-Oct-10 Si1025X Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) 20 40 VGS = 0 V VGS = 4.5 V 32 12 VGS = 5 V 8 VGS = 10 V 4 Ciss C - Capacitance (pF) R DS(on) - On-Resistance (Ω) 16 24 16 Coss 8 0 Crss 0 0 200 400 600 800 1000 0 5 I D - Drain Current (mA) 10 25 Capacitance 15 1.8 ID = 500 mA 1.5 12 VDS = 48 V 9 6 VGS = 10 V at 500 mA 1.2 (Normalized) VDS = 30 V R DS(on) - On-Resistance VGS - Gate-to-Source Voltage (V) 20 VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current VGS = 4.5 V at 25 mA 0.9 0.6 3 0 0.0 15 0.3 0.3 0.6 0.9 1.2 1.5 0.0 - 50 1.8 - 25 0 25 50 75 100 125 Qg - Total Gate Charge (nC) TJ - Junction Temperature (°C) Gate Charge On-Resistance vs. Junction Temperature 150 10 1000 R DS(on) - On-Resistance (Ω) I S - Source Current (A) VGS = 0 V 100 TJ = 125 °C 10 TJ = 25 °C 8 ID = 500 mA 6 4 ID = 200 mA 2 TJ = - 55 °C 0 1 0.00 0.3 0.6 0.9 1.2 1.5 0 2 4 6 8 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage Document Number: 71433 S10-2432-Rev. C, 25-Oct-10 10 www.vishay.com 3 Si1025X Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) 0.5 0.4 ID = 250 µA V GS(th) Variance (V) 0.3 0.2 0.1 0.0 - 0.1 - 0.2 - 0.3 - 50 - 25 0 25 50 75 100 125 150 TJ - Junction Temperature (°C) Threshold Voltage Variance Over Temperature Normalized Effective Transient Thermal Impedance 2 1 Duty Cycle = 0.5 0.2 Notes: 0.1 PDM 0.1 0.05 t1 t2 1. Duty Cycle, D = 0.02 t1 t2 2. Per Unit Base = RthJA = 500 °C/W 3. TJM - TA = PDMZthJA(t) Single Pulse 4. Surface Mounted 0.01 10 -4 10 -3 10 -2 10 -1 1 Square Wave Pulse Duration (s) 10 100 600 Normalized Thermal Transient Impedance, Junction-to-Ambient Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?71433. www.vishay.com 4 Document Number: 71433 S10-2432-Rev. C, 25-Oct-10 Package Information www.vishay.com Vishay Siliconix SC-89 6-Leads (SOT-563F) E1/2 2 3 aaa D e1 4 C 2x 4 A B D 6 5 4 SECTION B-B C E/2 2 E E1 3 6 2x DETAIL “A” aaa C 1 5 2 2x 3 bbb C e B 6x b 4 ddd M C A–B D L1 A1 L A A1 SEE DETAIL “A” Notes 1. Dimensions in millimeters. 2. Dimension D does not include mold flash, protrusions or gate burrs. Mold flush, protrusions or gate burrs shall not exceed 0.15 mm per dimension E1 does not include interlead flash or protrusion, interlead flash or protrusion shall not exceed 0.15 mm per side. 3. Dimensions D and E1 are determined at the outmost extremes of the plastic body exclusive of mold flash, the bar burrs, gate burrs and interlead flash, but including any mismatch between the top and the bottom of the plastic body. 4. Datums A, B and D to be determined 0.10 mm from the lead tip. 5. Terminal numbers are shown for reference only. 6. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. Revision: 11-Aug-14 DIM. MILLIMETERS MIN. NOM. A 0.56 0.58 MAX. 0.60 A1 0 0.02 0.10 b 0.15 0.22 0.30 0.18 c 0.10 0.14 D 1.50 1.60 1.70 E 1.50 1.60 1.70 1.25 E1 1.15 1.20 e 0.45 0.50 0.55 e1 0.95 1.00 1.05 L 0.25 0.35 0.50 L1 0.10 0.20 0.30 C14-0439-Rev. C, 11-Aug-14 DWG: 5880 Document Number: 71612 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Application Note 826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead 0.051 0.012 0.020 (0.300) (0.500) 0.019 (0.478) 0.031 (0.798) 0.069 (1.753) (1.300) 0.051 (0.201) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index Return to Index APPLICATION NOTE Document Number: 72605 Revision: 21-Jan-08 www.vishay.com 21 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000