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Data Sheet
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1-888-IN
April 3, 2008
Dual Input Lithium Ion Battery Charger
with OVP USB Bypass and 10mA LDO
The ISL9221 Lithium Ion charging IC is designed to meet the
charging requirements of most of today’s handheld devices.
The IC provides two inputs for either USB connection where
the current is limited by the USB standard or for
powering/charging from a power adapter.
If the voltage at either VUSB or VDC pin is within the safe
allowable range, the PPR pin is pulled low indicating to the
system processor that external power is available.
Charging can be enabled/disabled by controlling the state of
the EN pin. While charging, the CHG pin is pulled low
indicating the battery is being charged.
The battery is charged to 4.2V with only a 1% error across
the temperature range. USB charge current, Adapter charge
current and charge termination currents can be programmed
via external resistors.
The ISL9221 adds an additional feature in providing a limited
amount of current to system architecture while protecting the
system from destructively high voltage.
• Lithium Ion/Polymer battery charging
• Dual input - USB host or car/wall adapter
• Input voltage withstanding up to 28V
• 5.4V overvoltage protection on VUSB inputs
• Charging current up to 1.2A
• 4.9V/10mA linear regulator with input OVP
• Current limit on bypass path
• Programmable end-of-charge current
• Programmable charging current
• Programmable USB current limit
• Charging and power present indicator pins
• Charge enable pin
• Reverse current protection
• Pb-free (RoHS compliant)
Applications
• Smart Handheld Devices
Ordering Information
• Handheld Test Equipment
ISL9221IRZ
PART
MARKING
TEMP.
RANGE (°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
9221
-40°C to +85°C 12 Ld 4x3 DFN L12.4x3
ISL9221IRZ-T* 9221
-40°C to +85°C 12 Ld 4x3 DFN L12.4x3
*Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets; molding compounds/die attach materials
and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which
is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
1
FN6541.1
Features
The device contains Thermal regulation and protection to
provide additional safety features of this device. When the
temperature exceeds +125°C, the current will fold back to
reduce and control the die temperature.
PART
NUMBER
(Note)
ISL9221
• Cell Phones, PDAs, MP3 Players
• Digital Still Cameras
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Technical Brief TB389 “PCB Land Pattern Design and
Surface Mount Guidelines for QFN Packages”
Pinout
ISL9221
(12 LD DFN)
TOP VIEW
VDC
1
VUSB
2
11 BAT
PPR
3
10 USB_BYP
CHG
4
9
IVDC
EN
5
8
GND
IMIN
6
7
IUSB
12 VDC_LDO
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL9221
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VDC, VUSB). . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V
Other Input Voltage (EN, IMIN, IUSB, IVDC) . . . . . . . . . . -0.3V to 7V
Open Drain Pull Voltage (PPR, CHG) . . . . . . . . . . . . . . .-0.3V to 7V
Other Pin Voltage(VDC_LDO, USB_BYP, VBAT) . . . . . .-0.3V to 7V
Thermal Resistance (Typical, Notes 1, 2) JA (°C/W)
JC (°C/W)
4x3 DFN Package . . . . . . . . . . . . . . . . . . . . 41
3.5
Maximum Junction Temperature (Plastic Package)+ . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Supply Voltage (VUSB) . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 5.3V
Supply Voltage (VDC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 6.7V
Typical Adapter Charge Current . . . . . . . . . . . . . . . . 100mA to 1.2A
Typical USB Charge Current . . . . . . . . . . . . . . . . 46.5mA to 465mA
Typical USB Bypass Current . . . . . . . . . . . . . . . . . . . 0mA to 200mA
Typical LDO Current . . . . . . . . . . . . . . . . . . . . . . . . . . 0mA to 10mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
2. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
3. Parts are 100% tested at +25°C. Temperature limits established by characterization and are not production tested.
Electrical Specifications
Typical Values are tested at USB = VDC = 5V and ambient temperature at +25°C, unless otherwise noted. All
maximum and minimum values are guaranteed under the recommended operating conditions.
MIN
(Note 3)
TYP
Rising VUSB/VDC Threshold
3.4
3.9
4.2
V
Falling VUSB/VDC Threshold
3.2
3.7
4.0
V
-
150
250
mV
20
80
-
mV
EN = HIGH or both inputs are floating
-
0.05
0.5
µA
PARAMETERS
SYMBOL
CONDITIONS
MAX
(Note 3) UNITS
CHARGER POWER-ON THRESHOLDS
INPUT VOLTAGE OFFSET
Rising Edge of VDC or VUSB Relative to
VBAT
VOSHC
Falling Edge of VDC or VUSB Relative
to VBAT
VOSLC
VBAT = 4.0V, use CHG pin to indicate the
comparator output
STANDBY CURRENT
BAT Pin Sink Current
ISTANDBY
VDC Pin Supply Current
IVDC
EN = HIGH, ILDO = 0
-
365
420
µA
VUSB Pin Supply Current
IVUSB
EN = HIGH, USB_BYP disconnected
-
300
360
µA
EN = LOW, ILDO = 0, USB_BYP disconnected
-
0.63
0.85
mA
Load = 10mA
4.158
4.2
4.242
V
Load = 10mA (TJ = +25°C)
4.174
4.2
4.226
V
VDC/USB Pin Supply Current
VOLTAGE REGULATION
Output Voltage
VBAT
VDC Linear ON-resistance
VBAT =3.8V, IVDC = 0.3A, (TJ = +25°C)
-
600
-
m
USB Linear ON-resistance
VBAT =3.8V, IUSB = 0.3A, (TJ = +25°C)
-
600
-
m
1.19
1.22
1.25
V
CHARGE CURRENT
IVDC Pin Output Voltage
VIVDC
VBAT = 3.8V
VDC Constant Current Accuracy
IVDC_CHRG RIVDC = 12.4k, VBAT = 2.7V to 3.8V
500
550
580
mA
VDC Trickle Charge Current
IVDC_TRKL
16
18
20
%
2
RIVDC = 12.4kVBAT = 2.2V, given as a % of the
IVDC_CHARGE
FN6541.1
April 3, 2008
ISL9221
Electrical Specifications
Typical Values are tested at USB = VDC = 5V and ambient temperature at +25°C, unless otherwise noted. All
maximum and minimum values are guaranteed under the recommended operating conditions. (Continued)
PARAMETERS
SYMBOL
IUSB Pin Output Voltage
VIUSB
CONDITIONS
VBAT = 3.8V
MIN
(Note 3)
TYP
MAX
(Note 3) UNITS
1.19
1.22
1.25
V
VUSB Constant Current Accuracy
IUSB_CHRG RIUSB = 29.4k,VBAT = 2.7V to 3.8V
211
232
246
mA
VUSB Trickle Charge Current
IUSB_TRKL
16
18
20
%
-
IUSB_CHRG
-
%
46.5
55
63.5
mA
VMIN
2.5
2.6
2.7
V
VRCH
3.8
3.9
4.0
V
VDC Overvoltage Level
OVP
6.7
6.8
6.9
V
VDC Overvoltage Hysteresis
HOVP
-
90
130
mV
-
1
-
µs
5.3
5.4
5.5
V
VUSB Overvoltage Hysteresis
-
60
90
mV
VUSB Overvoltage Protection Delay
-
1
-
µs
-
400
600
mA
Measured at 200mA, 4.3V < VDC < 5.3V
-
1.3
2.0

IOUT = 150mA, VUSB > 4.3V
-
200
-
mV
TFOLD
-
125
-
°C
EN Pin Logic Input HIGH
VIH
1.3
-
-
V
EN Pin Logic Input LOW
VIL
-
-
0.4
V
350
600
850
k
10
-
-
mA
-
4.94
-
V
Initial accuracy, ILDO = 10mA; TJ = +25°C
-2.0
-
+2.0
%
Line/Load, ILDO = 10µA to 10mA,
VDC = VLDO + 0.5V to 6.5V; TJ = -40°C to +125°C
-2.8
-
+2.8
%
-
30
50
mV
12
-
-
mA
RIUSB = 29.4kVBAT = 2.2V and if IUSB_CHRG
 IVDC_TRKL, then given as a % of the IUSB_CHRG
If IUSB_CHRG  IVDC_TRKL
DC and USB End-of-Charge Threshold
IMIN
RMIN = 10k
PRECONDITIONING CHARGE THRESHOLD
Preconditioning Charge Threshold
Voltage
RECHARGE THRESHOLD
Recharge Threshold Voltage
PROTECTIONS
VDC Overvoltage Protection Delay
VUSB Overvoltage Level
Short Circuit (USB_BYP)
IOCP
BYPASS FETS
Resistance VUSB to USB_BYP
USB_
rDS(ON)
Drop Out VUSB to USB_BYP
VUSBDO
INTERNAL TEMPERATURE MONITORING
Current Fold Back Threshold
LOGIC INPUT AND OUTPUT
EN Pin Internal Pull-down Resistance
CHG and PRR Sink Current
Pin Voltage = 0.8V
LINEAR REGULATOR
Output Voltage
VLDO
Voltage Regulation Accuracy
VREG
Dropout (VDC to VLDO)
VDO
ILDO = 10mA, VLDO= 4.9V, VDC > VLDO+0.5V
Current Limit
ILIMIT
For ILDO = 10mA option, VDC = 5.5V
3
FN6541.1
April 3, 2008
ISL9221
Pin Assignments
NAME
PIN
TYPE
DESCRIPTION
VDC
1
AI
Input pin from car adapter or AC/DC adapter
VUSB
2
AI
Input pin from USB host device
VDC_LDO
12
AO
Output pin of Linear Regulator
USB_BYP
10
AO
Output pin from USB bypass circuitry
IVDC
9
AI
Battery current setting pin for adapter power
IUSB
7
AI
Current setting pin for USB power
IMIN
6
AI
End-of-charge current setting pin
BAT
11
AO
Output pin to battery
EN
5
DI
Active low charge enable pin
PPR
3
OD
Active low power present indicator pin
CHG
4
OD
Active low charging indication pin
GND
8
G
Ground pad
TABLE 1. TYPE CHART
SYMBOL
DESCRIPTION
A
Analog Pin
D
Digital Pin
I
Input Pin
O
Output Pin
OD
Open-Drain
G
The maximum current drawn from the VUSB pin is the
combination of the load at USB_BYP and the programmed
USB charging current.
A 1µF bypass capacitor is recommended on the VUSB pin.
Higher values of bypass capacitance can be utilized but the
designer should refer to the maximum allowed bus capacitance
per USB application standard. When using ceramic capacitors,
a small resistance value, such as 1 in series with the
capacitor, is recommended to reduce voltage overshoot.
Ground
IVDC
Functional Pin Descriptions
VDC
Adapter input pin. This pin is usually connected to adapter
power. The maximum input voltage is 28V. The charge
current from this pin is programmable up to 1.2A by selection
of the resistor on the IVDC pin. When this pin is connected to
a power source, no charge current is drawn from the USB
pin. A 1µF or larger value ceramic capacitor is
recommended for decoupling.
Adapter charging current setting pin. A resistor on this pin
sets the maximum charging current to be delivered to the
BAT pin. The maximum current, however, may be reduced
by the adapter’s current limit or by the power dissipation
within the charging IC.
IUSB
USB charge current pin. This pin is connected internally to a
current source for setting the programmed charging current
delivered to the BAT pin.
VDC_LDO
BAT
Linear regulator output. A 0.1µF to 1µF ceramic capacitor
from this pin to ground is required.
Charger IC output pin. This pin is to be connected to the
positive (+) terminal of the battery. The charging IC monitors
this pin to determine the charge state of the battery.
USB_BYP
USB input bypass pin. This is an output from the low current
bypass FET connected to the USB input pin. The USB_BYP
can be connected to the system to provide safe,
voltage-limited power from the USB input pin.
A 1µF bypass capacitor from the BAT pin to ground is
recommended. The charging IC relies on the battery to help
stabilize the circuitry and it is not recommended to operate
the charger IC without a battery connected to this pin.
EN
VUSB
VUSB Input pin. This pin is usually connected to a USB port
power connector. The maximum input voltage is 28V.
However, the internal OVP circuitry will trip at 5.4V.
4
Enable charging pin. This pin is a logic level input to control
charging by the system processor. An external pull-up
resistor should be connected to processor’s I/O power
supply.
FN6541.1
April 3, 2008
ISL9221
The USB_BYP and VDC_LDO stay on regardless of the
state of this pin. This ensures that the processor can be
powered up when an external source is connected to the
VDC or VUSB input pin.
CHG
Charge indication pin. This open-drain pin is pulled low to
indicate when the battery is being charged. If connected to
the processor, a pull-up resistor should be connected to the
processors I/O supply.
PPR
The CHG pin can also be used to drive an LED to indicate to
the user the battery is being charged.
Power presence indication pin. This pin is used to notify the
system processor or enable the power circuitry when a
source is connected. The pin is an open drain output pin,
which pulls low when a valid voltage (above POR) is present
at either the VDC or VUSB pin. The PPR pin is held low
regardless of the state of the EN pin. If connected to the
processor, a pull-up resistor should be connected to the
processors I/O supply. If connected to power circuitry, a
pull-up should be tied to the appropriate bypass supply.
GND
Ground pin. This provides the ground path for all internal
circuits.
I/O_VDD
I/O_VDD
Typical Application
OFF
LDO OUTPUT
ON
CHG
PPR
VDC_LDO
VDC
EN
VDC INPUT
TO MCU
TO BATTERY
BAT
IVDC
IUSB
IMIN
VUSB
USB_BYP
ISL9221
USB INPUT
GND
RIVDC
RIMIN
5
RIUSB
FIGURE 1. APPLICATIONS CIRCUIT
USB_BYP
FN6541.1
April 3, 2008
ISL9221
Block Diagram
LDO
LDO
BYPASS
USB_BYP
4.35V TO 6.5V
VDC
BAT
+
VMIN
+
VRCH
4.35V TO 5.25V
VUSB
THERM
2.6V
3.9V
+
CC/CV
-
4.2V
6.8VOVP
150/80mV
5.4VOVP
VOS
VOLTAGE/CURRENT CONTROLLER
VOS
+
+
VDC
+
VUSB
EN
IUSB
+
-
I/O CNTL
+
IDC
CHG
IMIN
1.22V
PPR
+
GND
FIGURE 1. SIMPLIFIED BLOCK DIAGRAM
USB Charge Current
When the EN pin is pulled low and a valid USB voltage is
present at the USB pin, the IC will charge the battery at a
rate dependent on the IUSB setting. The charge current
maybe reduced by the USB source if it is set to a value
higher than the current limit of the USB source.
Equation 1 for setting the IUSB current is as follows:
6820
IUSB = ------------------  mA 
R IUSB
(EQ. 1)
Where RIUSB is in k.
The current set by the IUSB pin for charging the battery is in
addition to current drawn by the load on the USB_BYP. The
system designer should consider the maximum expected
USB_BYP load current when selecting the USB charging
current so as not to exceed the current limits set by the USB
standards.
Typically at room temperature, the rDS(ON) across the charge
path, VUSB to BAT is 600m. If the entire USB current limit
of 465mA is being supplied to the battery, the drop across
the charging FET could be more than 300mV. Thus, the
voltage at the USB pin needs to be maintained above ~4.5V.
6
Otherwise, the period to charge the battery may be
prolonged.
Adapter Charge Current
When the EN pin is pulled low and a valid adapter voltage is
present at the VDC pin, the IC will charge the battery at a
rate dependent on the IVDC setting; the charge on the
battery and the source connected to the VDC pin. An
example of this is while the IVDC is set for 1000mA, the
adapter supply may only provide 800mA and the battery is
limited to the 800mA.
Typically the rDS(ON) across the charge path, VDC to BAT is
600m. At a 1.0A charging rate, 600mV is dropped across
the charge path. Thus, the voltage at the VDC pin needs to
be maintained above ~4.80V. Otherwise the period to charge
the battery may be prolonged.
6820
IVDC = ------------------  mA 
R IVDC
(EQ. 2)
Where RIVDC is in k.
It is recommended that the maximum charging current be
programmed to between 100mA and 1200mA.
FN6541.1
April 3, 2008
ISL9221
Floating Charge Voltage
Power-Good Condition
The floating voltage during the constant voltage phase is
4.2V. The floating voltage has 1% accuracy over the ambient
temperature range of -40°C to +85°C.
Even if there is a power present at one of the power input
pins, the charger will not deliver power to the battery for
charging if three of the conditions below are not met:
Trickle Charge Current
• VDC or VUSB > VPOR
When the battery voltage is below 2.7V (VBATmin), the
charger operates in trickle/preconditioning mode, where the
charge current is typically 18% of the programmed current
set by RIVDC.
• VDC or VUSB - VBAT > VOS
End-of-Charge Indication
When an EOC condition (charge current falls below IMIN
during constant-voltage charging) is encountered, the
internal open-drain MOSFET at the CHG pin turn-off.
IMIN threshold is programmable by the resistor RIMIN at the
IMIN pin for both adapter and USB inputs. If the
programmed fast charge current is less than IMIN, then after
the de-bounce period for VBAT = VBATmax expires, EOC
occurs. Once EOC is reached, the status is latched and can
be reset by one of the following conditions:
• VDC or VUSB < VOVP
Where VPOR is the power on reset voltage and VOS is the
offset voltage of the input-to-output comparator. All of these
voltages have hysteresis, as given in the “Electrical
Specifications” table on page 2.
POR_DLY
6.8VOVP
OVP- HOVP
POR
VDC
5.4V OVP
OVP- HOVP
POR
VUSB
• The part is disabled and re-enabled
• The selected input source is removed and reapplied
• The BAT pin voltage falls below the recharge threshold
(~3.9V)
PPR
ENABLE ACTIVE
EN
IMIN
IMIN sets the charge termination current for EOC (End-ofCharge). IMIN can be calculated by Equation 3:
550
IMIN = ----------------  mA 
R IMIN
CHG
ILDO + ICHG
(EQ. 3)
Where RIMIN is in k. IMIN is applicable for both adapter and
USB charging.
Power Presence Indication
When either the Adapter power or USB is above the POR
threshold, the PPR internal Open-Drain MOSFET pulls the
pin low indicating that there is a valid source on one of the
power input pins.
If only one source is connected and it is above VOVP or both
sources are connected and both exceed VOVP, the PPR will
be released (HIGH) indicating that the voltage at the pin(s) is
invalid. If one input is valid while the other isn’t, the PPR pin
will be pulled low.
Thermal Fold Back (Thermaguard™)
The thermal fold back function reduces the charge current
when the internal temperature reaches the thermal foldback
threshold, which is typically +125°C. This protects the
charger from excessive thermal stress at high input voltages.
7
IVDC
ILDO
IUSB_BYP + ICHRG
IUSB_BYP
IVUSB
VBAT
USB_BYP
4.94V
VDC_LDO
0V
FIGURE 2. . CHARGING PROFILE
Input Bypass Capacitors
Due to the wall or car power adapter power lead inductance,
the VDC input capacitor type must be properly selected to
prevent high voltage transient during a hot-plug event. This
is also true for the USB input capacitor. A tantalum capacitor
is a good choice for its high ESR, providing damping to the
voltage transient. Multi-layer ceramic capacitors, however
FN6541.1
April 3, 2008
ISL9221
have a very low ESR and hence when chosen as input
capacitors, a 1 series resistor must be placed between the
capacitor and ground, as shown in the Typical Applications
Section, to provide adequate damping.
CHG
CHARGE
DISABLE
EN
CHARGE ENABLE
VMAX
VRCH
IMAX
Fault Summary
If VDC is greater than 6.8V, then the VDC_LDO and
charging FETs are turned off until VDC < VOVP - HOVP
(Where HOVP is the OVP hysteresis). PPR will be asserted
high (off), unless VUSB is valid.
If VUSB is greater than 5.4V, then the VUSB bypass and
charging FETs are turned off until VUSB < VOVP - HOVP. PPR
will be asserted high (off), unless VDC is valid.
If the load on VUSB_BYP exceeds 400mA, the FET will be
current limited to protect the load and the IC.
If VUSB_BYP > VUSB, USB Bypass FET is turned off.
VMIN
State Diagram
VBAT
0.18*IMAX
IMIN
ICHG
EOC
FIGURE 3. TIMING DIAGRAM
8
The state diagram for the charger functions is shown in
Figure 4. The diagram starts with the Power-off state. When
at least one input voltage rises above the POR threshold, the
charger resets itself. If both input voltages are above the
POR threshold, the charger selects the VDC input as the
power source. Then if the EN pin is at a logic HIGH voltage,
the charger will stay in the disabled state. If the EN pin is
LOW or is brought LOW charging begins. Any time the EN
pin is asserted high, the charger returns to the disabled
state. When the EOC condition is reached, the CHG will turn
to a logic HIGH to indicate a charge complete status but
charging will continue.
FN6541.1
April 3, 2008
ISL9221
VDC BAD,
VUSB GOOD
VDC = GOOD, IF VPOR < VDC < 6.8V
VUSB = GOOD, IF VPOR < VUSB < 5.4V
POWER OFF
CHARGER: OFF
PPR: OFF
CHG: OFF
LDO: OFF
BYP: OFF
VOVP < VDC,
VUSB BAD
VDC BAD,
VOVP < VUSB
VDC GOOD,
VUSB GOOD
EN = HI
VDC BAD,
VUSB GOOD
EN = HI
NOT
ENABLED,
EN = HI
POR
VDC INPUT
CHARGER: OFF
PPR: ON
CHG: OFF
LDO: ON
BYP: ON
POR
USB INPUT ONLY
CHARGER: OFF
PPR: ON
CHG: OFF
LDO: OFF
BYP: ON
VDC GOOD,
VOVP < VUSB
VBAT < VMIN,
EN = LOW
VMIN < VBAT < VMAX,
EN = LOW
POR
VDC INPUT
CHARGER: OFF
PPR: ON
CHG: OFF
LDO: ON
BYP: OFF
NOT
ENABLED,
EN = HI
VOVP < VDC,
VUSB GOOD
TRICKLE CHARGE
CHARGER: ON
PPR: ON
CHG: ON
LDO: ON (IF VDC GOOD)
BYP: ON (IF VUSB GOOD)
OVP
USB INPUT ONLY
CHARGER: OFF
PPR: OFF
CHG: OFF
LDO: OFF
BYP: OFF
VDC GOOD,
VUSB BAD
EN = HI
OVP
VDC INPUT SELECTED
CHARGER: OFF
PPR: OFF
CHG: OFF
LDO: OFF
BYP: OFF
VMIN < VBAT < VMAX,
EN = LOW
VMIN < VBAT
VDC BAD
FAST CHARGE
@ IUSB
CHARGER: ON
PPR: ON
CHG: ON
LDO: OFF
BYP: ON
VDC GOOD
FAST CHARGE
@ IVDC
CHARGER: ON
PPR: ON
CHG: ON
LDO: ON
BYP: ON (IF VUSB GOOD)
RECHARGE
CONDITION MET,
VBAT < VRCH
VMAX = VBAT,
EN = LOW
VMAX = VBAT,
EN = HI
CHARGE COMPLETE
CHARGER: ON
PPR: ON
CHG: OFF
LDO: ON (IF VDC GOOD)
BYP: ON (IF VUSB GOOD)
VMAX = VBAT,
EN = LOW
VMAX = VBAT,
EN = HI
FIGURE 4. STATE DIAGRAM FOR CHARGER FUNCTIONS
9
FN6541.1
April 3, 2008
ISL9221
Logic Function State Table
VDC INPUT
VIN < VPOR
PGOOD,
VPOR < VDC
< VOVP
USB INPUT
VIN > VOVP
VIN < VPOR
X
X
X
X
X
BAT
CHARGING
VDC_LDO
OUTPUT
USB_BYP
Hi Z
No,
Reverse
Blocked
No,
Reverse
Blocked
No,
Reverse
Blocked
Low
Low
Yes, USB
Charging
No,
reverse
blocked
Yes
Low
Low
Low
Yes, VDC
Charging
Yes
No,
Reverse
Blocked
Low
Low
Low
Yes, VDC
Charging
Yes
Yes
High
(Disables
Charging)
Low
Hi Z
No,
Reverse
Blocked
Yes
No,
Reverse
Blocked
Yes
High
(Disables
Charging)
Low
Hi Z
No,
Reverse
Blocked
No,
reverse
blocked
Yes
Yes
High
(Disables
Charging)
Low
Hi Z
No,
Reverse
Blocked
Yes
Yes
VIN > VOVP
EN
PPR
CHG
X
Don’t
Care
Hi Z
Low
Yes
Yes
X
Yes
X
Yes
Yes
X
PGOOD,
VPOR < VUSB
< VOVP
X
X
Yes
X
NOTES:
4. ”X” denotes that the input is either less than VPOR or greater than VOVP
5. VDC_VOVP is a nominal 6.8V
6. VUSB_VOVP is a nominal 5.4V
10
FN6541.1
April 3, 2008
ISL9221
Dual Flat No-Lead Plastic Package (DFN)
L12.4x3
12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-229-VGED-4 ISSUE C)
2X
0.15 C A
A
D
MILLIMETERS
2X
0.15 C B
SYMBOL
0.80
A1
-
A3
E
b
6
INDEX
AREA
D2
B
//
A
SIDE VIEW
C
SEATING
PLANE
0.10
0.08
A3
7
8
-
-
0.05
-
0.23
0.30
5,8
4.00 BSC
3.15
3.30
3.40
7,8
3.00 BSC
1.55
e
1.70
1.80
7,8
0.50 BSC
-
k
0.20
-
-
-
L
0.30
0.40
0.50
8
N
12
2
Nd
6
3
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
2
4. All dimensions are in millimeters. Angles are in degrees.
NX k
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
E2
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
(DATUM A)
E2/2
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
NX L
N
N-1
NX b
e
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
5
(Nd-1)Xe
REF.
BOTTOM VIEW
NX (b)
C
NOTES
1.00
NOTES:
D2/2
1
C
MAX
0.90
Rev. 1 2/05
D2
(DATUM B)
8
0.18
E
E2
NOMINAL
0.20 REF
D
TOP VIEW
6
INDEX
AREA
MIN
A
0.10
M C A B
CL
(A1)
L
5
e
SECTION "C-C" TERMINAL TIP
FOR EVEN TERMINAL/SIDE
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
11
FN6541.1
April 3, 2008