IRF730AS, SiHF730AS, IRF730AL, SiHF730AL Vishay Siliconix Power MOSFET FEATURES PRODUCT SUMMARY VDS (V) • Halogen-free According to IEC 61249-2-21 Definition • Low Gate Charge Qg Results in Simple Drive Requirement • Improved Gate, Avalanche and Dynamic dV/dt Ruggedness • Fully Characterized Capacitance and Avalanche Voltage and Current • Effective Coss Specified • Compliant to RoHS Directive 2002/95/EC 400 RDS(on) (Max.) () VGS = 10 V 1.0 Qg (Max.) (nC) 22 Qgs (nC) 5.8 Qgd (nC) 9.3 Configuration Single D D2PAK (TO-263) I2PAK (TO-262) APPLICATIONS • Switch Mode Power Supply (SMPS) • Uninterruptible Power Supply • High Sspeed Power Switching G G G D S D S TYPICAL SMPS TOPOLOGIES S • Single Transistor Flyback Xfmr. Reset • Single Transistor Forward Xfmr. Reset (Both US Line Input Only) N-Channel MOSFET ORDERING INFORMATION Package Lead (Pb)-free and Halogen-free Lead (Pb)-free D2PAK (TO-263) SiHF730AS-GE3 IRF730ASPbF SiHF730AS-E3 D2PAK (TO-263) SiHF730ASTRL-GE3a IRF730ASTRLPbFa SiHF730ASTL-E3a D2PAK (TO-263) SiHF730ASTRR-GE3a IRF730ASTRRPbFa SiHF730ASTR-E3a I2PAK (TO-262) SiHF730AL-GE3 IRF730ALPbF SiHF730AL-E3 Note a. See device orientation. ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER Drain-Source Voltage Gate-Source Voltage Continuous Drain Current VGS at 10 V TC = 25 °C TC = 100 °C SYMBOL LIMIT VDS VGS 400 ± 30 5.5 3.5 22 0.6 290 5.5 7.4 74 4.6 - 55 to + 150 300d ID IDM Pulsed Drain Currenta, e Linear Derating Factor Single Pulse Avalanche Energyb, e EAS IAR Avalanche Currenta Repetiitive Avalanche Energya EAR Maximum Power Dissipation TC = 25 °C PD dV/dt Peak Diode Recovery dV/dtc, e Operating Junction and Storage Temperature Range TJ, Tstg Soldering Recommendations (Peak Temperature) for 10 s Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Starting TJ = 25 °C, L = 19 mH, Rg = 25 , IAS = 5.5 A (see fig. 12). c. ISD 5.5 A, dI/dt 90 A/μs, VDD VDS, TJ 150 °C. d. 1.6 mm from case. e. Uses IRF730A, SiHF730A data and test conditions. UNIT V A W/°C mJ A mJ W V/ns °C * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 91046 S11-1048-Rev. C, 30-May-11 www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 IRF730AS, SiHF730AS, IRF730AL, SiHF730AL Vishay Siliconix THERMAL RESISTANCE RATINGS SYMBOL TYP. MAX. Maximum Junction-to-Ambient (PCB Mounted, steady-state)a PARAMETER RthJA - 40 Maximum Junction-to-Case (Drain) RthJC - 1.7 UNIT °C/W Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage VDS Temperature Coefficient Gate-Source Threshold Voltage VDS VGS = 0, ID = 250 μA 400 - - V VDS/TJ Reference to 25 °C, ID = 1 mAd - 0.5 - V/°C VGS(th) VDS = VGS, ID = 250 μA 2.0 - 4.5 V Gate-Source Leakage IGSS VGS = ± 30 V - - ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = 400 V, VGS = 0 V - - 25 VDS = 320 V, VGS = 0 V, TJ = 125 °C - - 250 Drain-Source On-State Resistance Forward Transconductance RDS(on) gfs ID = 3.3 Ab VGS = 10 V VDS = 50 V, ID = 3.3 Ad μA - - 1.0 3.1 - - S - 600 - - 103 - - 4.0 - - 890 - Dynamic Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Output Capacitance Effective Output Capacitance Coss VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5d VDS = 1.0 V, f = 1.0 MHz VGS = 0 V Coss eff. Total Gate Charge Qg Gate-Source Charge Qgs VGS = 10 V VDS = 320 V, f = 1.0 MHz - 30 - VDS = 0 V to 320 Vc, d - 45 - - - 22 - - 5.8 ID = 3.5 A, VDS = 320 V, see fig. 6 and 13b, d pF nC Gate-Drain Charge Qgd - - 9.3 Turn-On Delay Time td(on) - 10 - - 22 - - 20 - - 16 - - - 5.5 - - 22 - - 1.6 - 370 550 ns - 1.6 2.4 μC Rise Time Turn-Off Delay Time Fall Time tr td(off) VDD = 200 V, ID = 3.5 A, Rg = 12 , RD = 57 , see fig. 10b, d tf ns Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current IS Pulsed Diode Forward Currenta ISM Body Diode Voltage VSD Body Diode Reverse Recovery Time trr Body Diode Reverse Recovery Charge Qrr Forward Turn-On Time ton MOSFET symbol showing the integral reverse p - n junction diode D A G S TJ = 25 °C, IS = 5.5 A, VGS = 0 Vb TJ = 25 °C, IF = 3.5 A, dI/dt = 100 A/μsb, d V Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD) Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width 300 μs; duty cycle 2 %. c. Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDS. d. Uses IRF730A, SiHF730A data and test conditions. www.vishay.com 2 Document Number: 91046 S11-1048-Rev. C, 30-May-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 IRF730AS, SiHF730AS, IRF730AL, SiHF730AL Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 102 VGS 15 V 10 V 8.0 V 10 7.0 V 6.0 V 5.5 V 5.0 V Bottom 4.5 V 1 Top 0.1 4.5 V 20 µs Pulse Width TC = 25 °C 10-2 0.1 1 0.1 4.0 20 µs Pulse Width TC = 150 °C 91046_02 VDS, Drain-to-Source Voltage (V) Fig. 2 - Typical Output Characteristics Document Number: 91046 S11-1048-Rev. C, 30-May-11 RDS(on), Drain-to-Source On Resistance (Normalized) ID, Drain-to-Source Current (A) 0.1 10 5.0 6.0 7.0 8.0 9.0 10.0 VGS, Gate-to-Source Voltage (V) Fig. 3 - Typical Transfer Characteristics 4.5 V 1 20 µs Pulse Width VDS = 50 V 91046_03 102 10-2 0.1 TJ = 25 °C 1 Fig. 1 - Typical Output Characteristics VGS Top 15 V 10 V 8.0 V 10 7.0 V 6.0 V 5.5 V 5.0 V 1 Bottom 4.5 V TJ = 150 °C 10 102 10 VDS, Drain-to-Source Voltage (V) 91046_01 ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A) 102 102 91046_04 2.5 ID = 5.5 A VGS = 10 V 2.0 1.5 1.0 0.5 0.0 - 60 - 40 - 20 0 20 40 60 80 100 120 140 160 TJ, Junction Temperature (°C) Fig. 4 - Normalized On-Resistance vs. Temperature www.vishay.com 3 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 IRF730AS, SiHF730AS, IRF730AL, SiHF730AL Vishay Siliconix VGS = 0 V, f = 1 MHz Ciss = Cgs + Cgd, Cds Shorted Crss = Cgd Coss = Cds + Cgd C, Capacitance (pF) 104 103 Ciss 102 Coss 10 Crss 102 ISD, Reverse Drain Current (A) 105 VGS = 0 V 0.1 1 102 10 103 VDS, Drain-to-Source Voltage (V) 91046_05 0.4 102 ID, Drain Current (A) VDS = 80 V 12 8 4 For test circuit see figure 13 0 0 91046_06 5 10 15 20 Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 10 µs 10 100 µs 1 ms 1 10 ms TC = 25 °C TJ = 150 °C Single Pulse 0.1 10 25 QG, Total Gate Charge (nC) 1.2 1.0 Operation in this area limited by RDS(on) VDS = 320 V VDS = 200 V 0.8 Fig. 7 - Typical Source-Drain Diode Forward Voltage ID = 5.5 A 16 0.6 VSD, Source-to-Drain Voltage (V) 91046_07 Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage VGS, Gate-to-Source Voltage (V) TJ = 25 °C 1 1 20 TJ = 150 °C 10 91046_08 102 103 VDS, Drain-to-Source Voltage (V) Fig. 8 - Maximum Safe Operating Area Document Number: 91046 S11-1048-Rev. C, 30-May-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 IRF730AS, SiHF730AS, IRF730AL, SiHF730AL Vishay Siliconix RD VDS VGS 6.0 5.0 ID, Drain Current (A) D.U.T. Rg + - VDD 10 V Pulse width ≤ 1 µs Duty factor ≤ 0.1 % 4.0 Fig. 10a - Switching Time Test Circuit 3.0 2.0 VDS 90 % 1.0 0.0 25 50 75 100 125 150 10 % VGS TC, Case Temperature (°C) 91046_09 td(on) Fig. 9 - Maximum Drain Current vs. Case Temperature td(off) tf tr Fig. 10b - Switching Time Waveforms Thermal Response (ZthJC) 10 1 D = 0.5 0.2 0.1 PDM 0.1 0.05 t1 0.02 0.01 t2 Notes: 1. Duty Factor, D = t1/t2 2. Peak Tj = PDM x ZthJC + TC Single Pulse (Thermal Response) 10-2 10-5 10-4 10-3 10-2 0.1 1 t1, Rectangular Pulse Duration (s) 91046_11 Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case VDS 15 V tp L VDS D.U.T Rg IAS 20 V tp Driver + A - VDD IAS 0.01 Ω Fig. 12a - Unclamped Inductive Test Circuit Document Number: 91046 S11-1048-Rev. C, 30-May-11 Fig. 12b - Unclamped Inductive Waveforms www.vishay.com 5 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 IRF730AS, SiHF730AS, IRF730AL, SiHF730AL 700 ID Top 2.5 A 3.5 A Bottom 5.5 A 600 500 400 300 200 100 610 VDSav, Avalanche Voltage (V) EAS, Single Pulse Avalanche Energy (mJ) Vishay Siliconix 600 590 580 570 560 550 540 0 25 50 75 100 125 150 Starting TJ, Junction Temperature (°C) 91046_12c Fig. 12c - Maximum Avalanche Energy vs. Drain Current 0.0 2.0 1.0 3.0 4.0 5.0 6.0 IAV, Avalanche Current (A) 91046_12d Fig. 12d - Typical Drain-to-Source Voltage vs. Avalanche Current Current regulator Same type as D.U.T. 50 kΩ QG 10 V 12 V 0.2 µF 0.3 µF QGS QGD + D.U.T. VG - VDS VGS 3 mA Charge IG ID Current sampling resistors Fig. 13a - Maximum Avalanche Energy vs. Drain Current www.vishay.com 6 Fig. 13b - Gate Charge Test Circuit Document Number: 91046 S11-1048-Rev. C, 30-May-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 IRF730AS, SiHF730AS, IRF730AL, SiHF730AL Vishay Siliconix Peak Diode Recovery dV/dt Test Circuit + D.U.T. Circuit layout considerations • Low stray inductance • Ground plane • Low leakage inductance current transformer + - - Rg • • • • + dV/dt controlled by Rg Driver same type as D.U.T. ISD controlled by duty factor “D” D.U.T. - device under test + - VDD Driver gate drive P.W. Period D= P.W. Period VGS = 10 Va D.U.T. lSD waveform Reverse recovery current Body diode forward current dI/dt D.U.T. VDS waveform Diode recovery dV/dt Re-applied voltage Inductor current VDD Body diode forward drop Ripple ≤ 5 % ISD Note a. VGS = 5 V for logic level devices Fig. 14 - For N-Channel Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91046. Document Number: 91046 S11-1048-Rev. C, 30-May-11 www.vishay.com 7 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information Vishay Siliconix TO-263AB (HIGH VOLTAGE) A (Datum A) 3 A 4 4 L1 B A E c2 H Gauge plane 4 0° to 8° 5 D B Detail A Seating plane H 1 2 C 3 C L L3 L4 Detail “A” Rotated 90° CW scale 8:1 L2 B A1 B A 2 x b2 c 2xb E 0.010 M A M B ± 0.004 M B 2xe Plating 5 b1, b3 Base metal c1 (c) D1 4 5 (b, b2) Lead tip MILLIMETERS DIM. MIN. MAX. View A - A INCHES MIN. 4 E1 Section B - B and C - C Scale: none MILLIMETERS MAX. DIM. MIN. INCHES MAX. MIN. MAX. A 4.06 4.83 0.160 0.190 D1 6.86 - 0.270 - A1 0.00 0.25 0.000 0.010 E 9.65 10.67 0.380 0.420 6.22 - 0.245 - b 0.51 0.99 0.020 0.039 E1 b1 0.51 0.89 0.020 0.035 e b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625 b3 1.14 1.73 0.045 0.068 L 1.78 2.79 0.070 0.110 2.54 BSC 0.100 BSC c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 c1 0.38 0.58 0.015 0.023 L2 - 1.78 - 0.070 c2 1.14 1.65 0.045 0.065 L3 D 8.38 9.65 0.330 0.380 L4 0.25 BSC 4.78 5.28 0.010 BSC 0.188 0.208 ECN: S-82110-Rev. A, 15-Sep-08 DWG: 5970 Notes 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimensions are shown in millimeters (inches). 3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body at datum A. 4. Thermal PAD contour optional within dimension E, L1, D1 and E1. 5. Dimension b1 and c1 apply to base metal only. 6. Datum A and B to be determined at datum plane H. 7. Outline conforms to JEDEC outline to TO-263AB. Document Number: 91364 Revision: 15-Sep-08 www.vishay.com 1 Package Information Vishay Siliconix I2PAK (TO-262) (HIGH VOLTAGE) A (Datum A) E B c2 A E A L1 Seating plane D1 D C L2 C B B L A c 3 x b2 E1 A1 3xb Section A - A Base metal 2xe b1, b3 Plating 0.010 M A M B c1 c (b, b2) Lead tip Section B - B and C - C Scale: None MILLIMETERS INCHES MILLIMETERS INCHES DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX. A 4.06 4.83 0.160 0.190 D 8.38 9.65 0.330 0.380 A1 2.03 3.02 0.080 0.119 D1 6.86 - 0.270 - b 0.51 0.99 0.020 0.039 E 9.65 10.67 0.380 0.420 b1 0.51 0.89 0.020 0.035 E1 6.22 - 0.245 - b2 1.14 1.78 0.045 0.070 e b3 1.14 1.73 0.045 0.068 L 13.46 14.10 0.530 0.555 c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.065 c1 0.38 0.58 0.015 0.023 L2 3.56 3.71 0.140 0.146 c2 1.14 1.65 0.045 0.065 2.54 BSC 0.100 BSC ECN: S-82442-Rev. A, 27-Oct-08 DWG: 5977 Notes 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outmost extremes of the plastic body. 3. Thermal pad contour optional within dimension E, L1, D1, and E1. 4. Dimension b1 and c1 apply to base metal only. Document Number: 91367 Revision: 27-Oct-08 www.vishay.com 1 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000