SiHB22N60S www.vishay.com Vishay Siliconix S Series Power MOSFET FEATURES PRODUCT SUMMARY VDS at TJ max. (V) • Generation one 650 RDS(on) max. at 25 °C (Ω) VGS = 10 V • High EAR capability 0.190 Qg max. (nC) 98 • Lower figure-of-merit Ron x Qg Qgs (nC) 17 • 100 % avalanche tested Qgd (nC) 25 • Ultra low Ron Configuration Available Single • dV/dt ruggedness • Ultra low gate charge (Qg) D D2PAK (TO-263) • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS G • PFC power supply stages • Hard switching topologies G D • Solar inverters S S • UPS N-Channel MOSFET • Motor control • Lighting • Server telecom ORDERING INFORMATION Package D2PAK (TO-263) Lead (Pb)-free and Halogen-free SiHB22N60S-GE3 Lead (Pb)-free SiHB22N60S-E3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT Drain-Source Voltage VDS 600 Gate-Source Voltage VGS ± 30 VGS at 10 V Continuous Drain Current Pulsed Drain TC = 25 °C TC = 100 °C Current a IDM D2PAK (TO-263) Linear Derating Factor Single Pulse Avalanche Energy ID b Repetitive Avalanche Energy a Maximum Power Dissipation Drain-Source Voltage Slope D2PAK (TO-263) TJ = 125 °C Reverse Diode dV/dt d Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) c 13 A 65 EAS 690 EAR 25 PD 250 TJ, Tstg for 10 s V 22 2 dV/dt UNIT 37 5.3 -55 to +150 300 W/°C mJ W V/ns °C Notes a. Repetitive rating; pulse width limited by maximum junction temperature. b. VDD = 50 V, starting TJ = 25 °C, L = 28.2 mH, Rg = 25 Ω, IAS = 7 A. c. 1.6 mm from case. d. ISD ≤ ID, dI/dt = 100 A/μs, starting TJ = 25 °C. S15-0982-Rev. F, 27-Apr-15 Document Number: 91395 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHB22N60S www.vishay.com Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. Maximum Junction-to-Ambient D2PAK (TO-263) RthJA - 62 Maximum Junction-to-Case (Drain) D2PAK (TO-263) RthJC - 0.5 UNIT °C/W SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage VDS Temperature Coefficient Gate-Source Threshold Voltage (N) Gate-Source Leakage Zero Gate Voltage Drain Current VDS VGS = 0 V, ID = 1 mA 600 - - V ΔVDS/TJ Reference to 25 °C, ID = 1 mA - 0.70 - V/°C VGS(th) VDS = VGS, ID = 250 μA 2.0 - 4.0 V IGSS VGS = ± 20 V - - ± 100 nA μA IDSS VGS = ± 30 V - - ±1 VDS = 600 V, VGS = 0 V - - 1 VDS = 600 V, VGS = 0 V, TJ = 150 °C - - 100 μA - 0.160 0.190 Ω gfs VDS = 50 V, ID = 13 A - 9.4 - S Input Capacitance Ciss 2810 - Coss - 1480 - Reverse Transfer Capacitance Crss VGS = 0 V, VDS = 25 V, f = 1.0 MHz - Output Capacitance - 33 - Effective Output Capacitance (Time Related) Coss eff. (TR)a 155 - Drain-Source On-State Resistance Forward Transconductance a RDS(on) VGS = 10 V ID = 11 A Dynamic Total Gate Charge Qg Gate-Source Charge Qgs VGS = 0 V VDS = 0 V to 480 V - 75 110 VGS = 10 V ID = 22 A, VDS = 480 V - 17 - Gate-Drain Charge Qgd - 25 - Turn-On Delay Time td(on) - 24 50 Rise Time Turn-Off Delay Time tr td(off) Fall Time tf Gate Input Resistance Rg VDD = 380 V, ID = 22 A, Rg = 9.1 Ω, VGS = 10 V - 68 100 - 77 115 - 59 90 f = 1 MHz, open drain - 0.65 - - - 22 - - 88 pF nC ns Ω Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current IS Pulsed Diode Forward Current ISM Diode Forward Voltage VSD Reverse Recovery Time trr Reverse Recovery Charge Qrr Reverse Recovery Current IRRM MOSFET symbol showing the integral reverse p - n junction diode D A G TJ = 25 °C, IS = 22 A, VGS = 0 V TJ = 25 °C, IF = IS, dI/dt = 100 A/μs, VR = 25 V S - - 1.2 V - 462 690 ns - 8.3 16 μC - 30 60 A Note a. Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDS. S15-0982-Rev. F, 27-Apr-15 Document Number: 91395 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHB22N60S www.vishay.com Vishay Siliconix ID, Drain Current (A) 50 VGS Top 15 V 14 V 13 V 12 V 11 V 10 V 9V 8V 7V 6V 5V Bottom 4 V 40 30 20 10 TJ = 25 °C 4V 0 0 4 8 12 16 20 RDS(on), Drain-to-Source On Resistance (Normalized) TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 24 3.5 ID = 22 A VGS = 10 V 3 2.5 2 1.5 1 0.5 0 - 60 - 40 - 20 0 VDS, Drain-to-Source Voltage (V) Fig. 1 - Typical Output Characteristics, TJ = 25 °C Fig. 4 - Normalized On-Resistance vs. Temperature 100 000 VGS Top 15 V 14 V 13 V 12 V 11 V 10 V 9V 8V 7V 6V 5V Bottom 4 V 18 12 Capacitance (pF) ID, Drain Current (A) 30 24 Ciss 1000 Crss TJ = 150 °C 4 .0 V 10 0 4 8 12 16 20 24 1 10 Fig. 2 - Typical Output Characteristics, TJ = 150 °C Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage 60 12.0 VGS, Gate-to-Source Voltage (V) ID, Drain Current (A) TJ = 25 °C 50 40 30 20 TJ = 150 °C 10 0 4 6 8 VGS, Gate-to-Source Voltage (V) Fig. 3 - Typical Transfer Characteristics S15-0982-Rev. F, 27-Apr-15 100 VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V) 2 VGS = 0 V, f = 1 MHz Ciss = Cgs + Cgd • Cds shorted Crss = Cgd Coss = Cds + Cgd Coss 10 000 100 6 0 20 40 60 80 100 120 140 160 180 TJ, Junction Temperature (°C) 10 ID = 22 A 10.0 VDS = 480 V VDS = 300 V VDS = 120 V 8.0 6.0 4.0 2.0 0.0 0 10 20 30 40 50 60 70 80 90 100 QG, Total Gate Charge (nC) Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage Document Number: 91395 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHB22N60S www.vishay.com Vishay Siliconix 25 100 20 10 ID, Drain Current (A) ISD, Reverse Drain Current (A) 1000 TJ = 150 °C TJ = 25 °C 1 0.1 0.01 15 10 5 0.001 VGS = 0 V 0.0001 0.2 0.4 0.6 0.8 1 1.2 0 25 1.4 VSD, Source-to-Drain Voltage (V) 75 100 125 150 TC, Case Temperature (°C) Fig. 7 - Typical Source-Drain Diode Forward Voltage Fig. 9 - Maximum Drain Current vs. Case Temperature 725 VDS, Drain-to-Source Breakdown Voltage (V) 1000 ID, Drain Current (A) 50 Operation in this area limited by RDS(on) 100 10 100 µs 1 ms 1 TC = 25 °C TJ = 150 °C Single Pulse 0.1 1 10 ms 10 100 1000 700 675 650 625 600 575 550 - 60 - 40 - 20 0 10 000 VDS, Drain-to-Source Voltage (V) 20 40 60 80 100 120 140 160 180 TJ, Junction Temperature (°C) Fig. 8 - Maximum Safe Operating Area Fig. 10 - Drain-to-Source Breakdown Voltage normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 10-4 Single Pulse 10-3 10-2 0.1 1 Square Wave Pulse Duration (s) Fig. 11 - Normalized Thermal Transient Impedance, Junction-to-Case S15-0982-Rev. F, 27-Apr-15 Document Number: 91395 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHB22N60S www.vishay.com Vishay Siliconix RD VDS QG VGS VGS D.U.T. Rg QGS + - VDD 10 V QGD VG Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Charge Fig. 16 - Basic Gate Charge Waveform Fig. 12 - Switching Time Test Circuit Current regulator Same type as D.U.T. VDS 90 % 50 kΩ 12 V 0.2 µF 0.3 µF 10 % VGS + D.U.T. td(on) - VDS td(off) tf tr VGS Fig. 13 - Switching Time Waveforms 3 mA IG ID Current sampling resistors L Vary tp to obtain required IAS VDS Fig. 17 - Gate Charge Test Circuit Rg D.U.T + - I AS V DD 10 V 0.01 W tp Fig. 14 - Unclamped Inductive Test Circuit VDS tp VDD VDS IAS Fig. 15 - Unclamped Inductive Waveforms S15-0982-Rev. F, 27-Apr-15 Document Number: 91395 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHB22N60S www.vishay.com Vishay Siliconix Peak Diode Recovery dV/dt Test Circuit + D.U.T. Circuit layout considerations • Low stray inductance • Ground plane • Low leakage inductance current transformer + - - Rg • • • • + dV/dt controlled by Rg Driver same type as D.U.T. ISD controlled by duty factor “D” D.U.T. - device under test + - VDD Driver gate drive P.W. Period D= P.W. Period VGS = 10 Va D.U.T. lSD waveform Reverse recovery current Body diode forward current dI/dt D.U.T. VDS waveform Diode recovery dV/dt Re-applied voltage Inductor current VDD Body diode forward drop Ripple ≤ 5 % ISD Note a. VGS = 5 V for logic level devices Fig. 18 - For N-Channel Vishay Siliconix maintains worldwide manufacturing capability. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000