SUP40N10-30-GE3 Datasheet

SUP40N10-30-GE3
Vishay Siliconix
N-Channel 100 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
100
RDS(on) (Ω)
ID (A)
0.030 at VGS = 10 V
38.5
0.034 at VGS = 6 V
36
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• Compliant to RoHS Directive 2002/95/EC
TO-220AB
D
G
G D S
S
Top View
Ordering Information: SUP40N10-30-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
100
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TC = 125 °C
Pulsed Drain Current
Avalanche Current
Single Pulse Avalanche Energya
Maximum Power Dissipationa
L = 0.1 mH
TC = 25 °C
TA = 25 °Cc
Operating Junction and Storage Temperature Range
ID
V
38.5
17
IDM
75
IAS
35
EAS
61
PD
Unit
89
A
mJ
b
3.1
W
TJ, Tstg
- 55 to 150
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient
Junction-to-Case (Drain)
PCB Mountc
Free Air
RthJA
RthJC
40
62.5
°C/W
1.4
Notes:
a. Duty cycle ≤ 1 %.
b. See SOA curve for voltage derating.
c. When mounted on 1" square PCB (FR-4 material).
Document Number: 66702
S10-1049-Rev. A, 03-May-10
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1
SUP40N10-30-GE3
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
VDS
VGS = 0 V, ID = 250 µA
100
VGS(th)
VDS = VGS, ID = 250 µA
2
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
VDS = 80 V, VGS = 0 V
1
VDS = 80 V, VGS = 0 V, TJ = 125 °C
50
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
4
VDS = 80 V, VGS = 0 V, TJ = 150 °C
Drain-Source On-State Resistancea
RDS(on)
VDS ≥ 5 V, VGS = 10 V
VGS = 10 V, ID = 15 A
0.024
0.030
VGS = 6 V, ID = 10 A
0.026
0.034
VDS = 15 V, ID = 15 A
µA
A
VGS = 10 V, ID = 15 A, TJ = 125 °C
gfs
nA
150
75
0.054
VGS = 10 V, ID = 15 A, TJ = 150 °C
Forward Transconductancea
V
Ω
0.060
10
S
b
Dynamic
2400
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
90
Total Gate Chargec
Qg
35
c
VGS = 0 V, VDS = 25 V, f = 1 MHz
270
pF
60
Gate-Source Charge
Qgs
Gate-Drain Chargec
Qgd
9
Rg
1.7
td(on)
11
20
12
20
30
45
12
20
Gate Resistance
Turn-On Delay Timec
Rise Timec
Turn-Off Delay Time
tr
c
Fall Timec
td(off)
VDS = 50 V, VGS = 10 V, ID = 40 A
VDD = 50 V, RL = 1.25 Ω
ID ≅ 40 A, VGEN = 10 V, Rg = 2.5 Ω
tf
Source-Drain Diode Ratings and Characteristics TC = 25
Continuous Current
11
nC
Ω
°Cb
IS
40
Pulsed Current
ISM
75
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 30 A, VGS = 0 V
trr
IRM(REC)
Qrr
ns
IF = 30 A, dI/dt = 100 A/µs
A
1.0
1.5
V
60
100
ns
5
8
A
0.15
0.4
µC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 66702
S10-1049-Rev. A, 03-May-10
SUP40N10-30-GE3
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
75
75
VGS = 10 V thru 6 V
60
I D - Drain Current (A)
I D - Drain Current (A)
60
45
5V
30
15
45
30
TC = 125 °C
15
25 °C
4V
- 55 °C
0
0
0
2
4
6
8
10
0
1
2
3
4
5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
6
0.08
100
TC = - 55 °C
R DS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
80
25 °C
60
125 °C
40
20
0.06
0.04
VGS = 6 V
VGS = 10 V
0.02
0.00
0
0
15
30
45
60
0
75
30
45
60
75
ID - Drain Current (A)
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
20
3000
V GS - Gate-to-Source Voltage (V)
Ciss
2400
C - Capacitance (pF)
15
1800
1200
600
Coss
Crss
VDS = 50 V
ID = 40 A
16
12
8
4
0
0
0
20
40
60
80
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 66702
S10-1049-Rev. A, 03-May-10
100
0
10
20
30
40
50
60
70
Qg - Total Gate Charge (nC)
Gate Charge
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SUP40N10-30-GE3
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2.0
100
VGS = 10 V
ID = 15 A
I S - Source Current (A)
RDS(on) - On-Resistance
(Normalized)
1.5
1.0
0.5
0
- 50
- 25
0
25
50
75
100
125
TJ = 150 °C
10
TJ = 25 °C
1
0
150
0.3
TJ - Junction Temperature (°C)
1.2
Source-Drain Diode Forward Voltage
1000
VDS - Drain-to-Source Breakdown Voltage (V)
125
100
I Dav (A)
0.9
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
IAV (A) at TA = 25 °C
10
1
IAV (A) at TA = 150 °C
0.1
0.00001
0.0001
0.001
0.01
0.1
tin (s)
Avalanche Current vs. Time
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0.6
1
ID = 10 mA
120
115
110
105
100
95
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
Drain-Source Breakdown Voltage
vs. Junction Temperature
Document Number: 66702
S10-1049-Rev. A, 03-May-10
SUP40N10-30-GE3
Vishay Siliconix
THERMAL RATINGS
50
100
10 μs
Limited by RDS(on)*
100 μs
ID - Drain Current (A)
ID - Drain Current (A)
40
30
20
10
1 ms
10 ms
1
100 ms,
DC
10
TA = 25 °C
Single Pulse
0
- 50
- 25
0
25
50
75
0.1
0.1
150
TC - Case Temperature (°C)
1
BVDSS Limited
10
100
1000
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Maximum Avalanche and Drain Current
vs. Case Temperature
Safe Operating Area
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?66702.
Document Number: 66702
S10-1049-Rev. A, 03-May-10
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Revision: 02-Oct-12
1
Document Number: 91000