REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED 88-08-26 D. A. DiCENZO Add case outlines, terminal connections and thermal resistance values for case outlines 2 and 3. For device type 01, 02, and 03, add subgroup 3 to IIH and IIL test, add RDS1 test, add VISO test, delete VCT test, change RL and CL test A conditions for tON(A) and tOFF(A) tests, change CL test condition for tON(EN) and tOFF(EN) tests, change value of ID for RDS1 test, change value of ID and VS for RDS2 test, add test condition circuits. Editorial changes throughout. B Add device types 07, 08, and 09. Table I changes. Editorial changes throughout. 93-06-28 M. A. FRYE C Changes in accordance with NOR 5962-R061-95. 95-01-25 M. A. FRYE D Changes in accordance with NOR 5962-R032-96. 96-01-09 M. A. FRYE E Incorporate NOR’s and current requirements. Editorial changes throughout. - drw 02-12-30 R. MONNIN F Make change to the tON(A) and tOFF(A) subgroup 9 test limit for devices 01, 02, and 03 as specified under Table I. - ro 07-09-13 R. HEBER REV F F F SHEET 35 36 37 REV F F F F F F F F F F F F F F F F F F F F SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY MARCIA B. KELLEHER STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY RAY MONNIN APPROVED BY D. A. DiCENZO MICROCIRCUIT, LINEAR, CMOS, MULTIPLEXER / DEMULTIPLEXER, MONOLITHIC SILICON DRAWING APPROVAL DATE 86-06-30 REVISION LEVEL F SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-85131 37 5962-E563-07 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-85131 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 03 04 05 06 07 08 09 Generic number Circuit function HI546 HI547 HI549 HI5116 HI5216 HI5208 HI506 HI507 HI509 Single 16-channel MUX/DEMUX with overvoltage protection Differential 8-channel MUX/DEMUX with overvoltage protection Differential 4-channel MUX/DEMUX with overvoltage protection Single 16-channel MUX/DEMUX with overvoltage protection Differential 8-channel MUX/DEMUX with overvoltage protection Differential 4-channel MUX/DEMUX with overvoltage protection Single 16-channel MUX/DEMUX Differential 8-channel MUX/DEMUX Differential 4-channel MUX/DEMUX 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter E X 2 3 Descriptive designator Terminals GDIP-T16 or CDIP-T16 GDIP-T28 or CDIP-T28 CQCC1-N20 CQCC1-N28 16 28 20 28 Package style Dual-in-line Dual-in-line Square leadless chip carrier Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 2 1.3 Absolute maximum ratings. Supply voltage between +V and -V .............................................................. Supply voltage between +V and ground: Device types 01-03, 07-09 ....................................................................... Device types 04-06 .................................................................................. Supply voltage between -V and ground: Device types 01-03, 07-09 ....................................................................... Device types 04-06 .................................................................................. Digital input voltage range (VA, VEN): Device types 01-03, 07-09 ....................................................................... +44 V Continuous current, source or drain ............................................................ Peak current, source or drain, pulsed, 1 ms, 10 percent duty cycle max ........................................................................... Storage temperature range ......................................................................... Maximum power dissipation (PD): Case E ..................................................................................................... Case X ..................................................................................................... Case 2 ..................................................................................................... Case 3 ..................................................................................................... Derating factor: Case E ..................................................................................................... 20 mA +22 V +20 V -25 V -20 V [ (-V) -4 V) to (+V) +4 V ] or 20 mA whichever comes first Device types 04-06 .................................................................................. -V to +V or 20 mA whichever comes first Analog input voltage range (VS): Device types 01-03 .................................................................................. [ (-V) -20 V) to (+V) +20 V ] Device types 04-06 .................................................................................. [ (-V) -25 V) to (+V) +25 V ] Device types 07-09 .................................................................................. [ (-V) -2 V) to (+V) +2 V ] 40 mA -65°C to +150°C 1.25 W 2W 1.32 W 1.23 W 12.5 mW/°C above TA = +75°C Case X ..................................................................................................... 20 mW/°C above TA = +75°C Case 2 ..................................................................................................... 13.2 mW/°C above TA = +75°C Case 3 ..................................................................................................... 12.3 mW/°C above TA = +75°C Thermal resistance, junction-to-case (θJC): Cases E, X, 2, and 3................................................................................. Thermal resistance, junction-to-ambient (θJA): Case E ..................................................................................................... Case X ..................................................................................................... Case 2 ..................................................................................................... Case 3 ..................................................................................................... Lead temperature (soldering, 10 seconds) .................................................. Junction temperature (TJ) ........................................................................... See MIL-STD-1835 80°C/W 50°C/W 76°C/W 81°C/W +275°C +175°C 1.4 Recommended operating conditions. Supply voltage between +V and ground ...................................................... +15 V Supply voltage between -V and ground ....................................................... -15 V VREF (device types 01 and 02 only) ............................................................ open VAL(max) ..................................................................................................... 0.8 V VAH(min): Device types 01-03 .................................................................................. Device types 04-09 .................................................................................. VEN: Device types 01-03 .................................................................................. Device types 04-09 .................................................................................. Ambient operating temperature range (TA) ................................................. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 4.0 V 2.4 V 4.0 V 2.4 V -55°C to +125°C SIZE 5962-85131 A REVISION LEVEL F SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C -V = -15 V, +V = +15 V Group A subgroups Device type unless otherwise specified Input leakage current 2/ IIH Min 1, 2, 3 Measure inputs sequentially, connect all unused inputs to GND 1, 3 01, 02, 03, 04, 05, 07, 08, 09 06 2 1, 2, 3 IIL 1, 3 06 +IS(OFF) VS = +10 V, VEN = 0.8 V, VS = -10 V, VEN = 0.8 V, all unused inputs = +10 V, +ID(OFF) VD = +10 V, VEN = 0.8 V, all unused inputs = -10 V 1.0 -10.0 10.0 10.0 01, 02, 03, 07, 08, 09 -10 +10 04, 05, 06 -1 +1 2, 3 All -50 +50 1 01, 02, 03, 07, 08, 09 -10 +10 04, 05, 06 -1 +1 2, 3 All -50 +50 1 01, 02, 03, 07, 08, 09 -10 +10 04, 05 -2 +2 06 -1 +1 01, 04, 07 -300 +300 02, 08 -200 +200 03, 06, 09 -100 +100 05 -150 +150 2, 3 µA 1.0 -10.0 VD = +10 V Leakage current into the drain terminal of an “OFF” switch -1.0 1.0 VD = -10 V -IS(OFF) Max -1.0 1 all unused inputs = -10 V, Unit 1.0 01, 02, 03, 04, 05, 07, 08, 09 2 Leakage current into the source terminal of an “OFF” switch Limits nA nA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 5 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C -V = -15 V, +V = +15 V Group A subgroups Device type Min Max 1 01, 02, 03, 07, 08, 09 -10 +10 04, 05 -2 +2 06 -1 +1 01, 04, 07 -300 +300 02, 08 -200 +200 03, 06, 09 -100 +100 05 -150 +150 01, 02, 03, 07, 08, 09 -10 +10 04, 05, 06 -2 +2 01, 04, 07 -300 +300 02, 08 -200 +200 03, 06, 09 -100 +100 05 -150 +150 01, 02, 03, 07, 08, 09 -10 +10 04, 05, 06 -2 +2 01, 04, 07 -300 +300 02, 08 -200 +200 03, 06, 09 -100 +100 05 -150 +150 unless otherwise specified Leakage current into the drain terminal of an “OFF” switch -ID(OFF) VD = -10 V, VEN = 0.8 V, all unused inputs = +10 V 2, 3 Leakage current from an “ON” driver into the switch (drain) +ID(ON) VD = +10 V, VS = +10 V, 1 all unused inputs = -10 V 2, 3 -ID(ON) VD = -10 V, VS = -10 V, 1 all unused inputs = +10 V 2, 3 Limits Unit nA nA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 6 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C -V = -15 V, +V = +15 V Group A subgroups Device type unless otherwise specified Overvoltage protected, leakage current into the drain terminal of an “OFF” switch +ID(OFF) overvoltage VS =+33 V, VD = 0 V, VEN = 0.8 V, VS applied VEN = 0.8 V, VS applied -2.0 +2.0 1, 3 04, 05, 06 -2.0 +2.0 -5 +5 1, 2, 3 01, 02, 03, -2.0 +2.0 1, 3 04, 05, 06 -2.0 +2.0 -5 +5 2 1, 2, 3 VA = 0 V, VEN = 4.0 V VA = 0 V, VEN = 2.4 V VA = 5 V, VEN = 2.4 V Standby positive supply current Standby negative supply current -I +ISBY -ISBY µA at ≤ 25% duty cycle VEN = 0.8 V Negative supply current Max 01, 02, 03, VS =-33 V, VD = 0 V, VS =-25 V, VD = 0 V, +I Min 1, 2, 3 2 VEN = 0.8 V Positive supply current Unit at ≤ 25% duty cycle VS =+25 V, VD = 0 V, -ID(OFF) overvoltage Limits 01, 02, 03 2.0 04, 05 2.0 07, 08 3.0 09 2.4 06 2.0 01, 02, 03 -1.0 VA = 0 V, VEN = 2.4 V 04, 05, 07, 08, 09 -1.0 VA = 5 V, VEN = 2.4 V 06 -1.0 1, 2, 3 VA = 0 V, VEN = 4.0 V 1, 2, 3 VA = 0 V, VEN = 0 V 1, 2, 3 VA = 0 V, VEN = 0 V mA 01, 02, 03, 04, 05, 06 2.0 07, 08 3.0 09 2.4 All mA mA -1.0 mA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 7 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C -V = -15 V, +V = +15 V Group A subgroups Device type 1 01, 02, 03 unless otherwise specified Switch “ON” resistance +RDS1 Min VS = +10 V, ID = -100 µA 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 +RDS2 3/ -RDS2 3/ Difference in switch “ON” resistance between channels ΔRDS1 +V = +10 V, -V = -10 V, 1, 3 VS = +5.0 V, ID = +100 µA 04, 05, 06 04, 05, 06 2 (+RDS1 max) – (+RDS1 min) x 100 +RDS1 Ave, TA = +25°C 1 01. 02, 03 Address 1.5 Ω 300 2.2 kΩ 2.2 7 % 7 100 -RDS1 Ave, TA = +25°C CA kΩ 2.4 (-RDS1 max) – (-RDS1 min) x Capacitance: 1.5 2.4 1, 3 VS = -5.0 V, ID = -100 µA Ω 300 400 2 +V = +10 V, -V = -10 V, 1.5 2.0 07, 08, 09 1 VS = -10 V, ID = +1 mA kΩ 1.8 04, 05, 06 1 VS = -10 V, ID = -100 µA 1.5 400 01, 02, 03 1 VS = -10 V, ID = +100 µA Max 2.0 07, 08, 09 1 VS = +10 V, ID = -1 mA Unit 1.8 04, 05, 06 1 VS = +10 V, ID = +100 µA -RDS1 Limits +V = -V = 0 V, f = 1 MHz, 4 TA = +25°C, see 4.3.1c 01, 02, 03 15 04, 05, 06 3/ 10 07, 08 12 09 10 pF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 8 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C -V = -15 V, +V = +15 V Group A subgroups Device type 4 01 85 02, 08 50 03, 09 25 04, 05, 06 3/ 85 07 90 01, 02, 03 15 04, 05, 06 3/ 10 07, 08, 09 12 7 All 10 mV 7 01, 02, 03, 07, 08, 09 -50 dB 7 04, 05, 06 -50 dB 7 04, 05, 06 -50 dB 9 01, 02, 03, 5 04, 05, 06 3/ 5 07, 08, 09 25 unless otherwise specified Capacitance: COS Output switch Capacitance: Min +V = -V = 0 V, f = 1 MHz, TA = +25°C, see 4.3.1c CIS Input switch +V = -V = 0 V, f = 1 MHz, 4 TA = +25°C, see 4.3.1c Charge transfer error VCTE VS = GND, TA = +25°C, 3/ VGEN = 0 V to 5 V VEN = 0.8 V, VS = 7 Vrms, VISO Off isolation RL = 1 kΩ, CL = 15 pF, f = 100 kHz, TA = +25°C 3/ VEN = 0 V, VGEN = 1 Vp-p, Single channel isolation VISO RL = 200 Ω, f = 200 kHz, TA = +25°C Crosstalk between channels VCT Break-before-make time delay tD Unit Max pF pF 3/ VGEN = 1 Vp-p, f = 200 kHz, TA = +25°C Limits 3/ TA = +25°C, see figure 3 RL = 1 kΩ, CL = 50 pF, TA = +25°C, see figure 3 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 9 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C -V = -15 V, +V = +15 V Group A subgroups Device type 9 01, 02, 03 750 07,08, 09 500 10, 11 01, 02, 03, 07, 08, 09 1,000 9 04, 05, 06 1,000 unless otherwise specified Propagation delay times: Address inputs to I/O channels times: tON(A), Min RL = 10 kΩ, CL = 50 pF, tOFF(A) see figure 4 RL = 1 kΩ, CL = 100 pF, see figure 4 Enable to I/O tON(EN), tOFF(EN) 10, 11 RL = 1 kΩ, CL = 50 pF, see figure 4 RL = 1 kΩ, CL = 100 pF, See figure 4 1/ Limits Unit Max ns 1,500 9 01,02, 03, 07, 500 10, 11 08, 09 1,000 9 04, 05, 06 700 10, 11 ns 1,000 For device types 01 and 02, VREF = open. For device types 01, 02, and 03, VEN = 4.0 V unless otherwise specified. For device types 04, 05, 06, 07, 08 and 09, VEN = 2.4 V unless otherwise specified. For device types 04, 05, and 06, current flowing in either direction between any associated input and output terminals of the switch shall be 30 mA. 2/ Input current of one input mode. 3/ Guaranteed, if not tested, to the limits specified. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 10 Case outlines Device types Terminal number 1 E X X X X 2 3 3 3 3 03, 06, 09 01 02 04, 07 05, 08 03, 06, 09 01 02 07 08 V+ V+ V+ V+ Terminal symbol A0 V+ V+ V+ V+ NC 2 Enable NC OUT B NC OUT B A0 NC OUT B NC OUT B 3 V- NC NC NC NC Enable NC NC NC NC 4 IN 1A IN 16 IN 8B IN 16 IN 8B V- IN 16 IN 8B IN 16 IN 8B 5 IN 2A IN 15 IN 7B IN 15 IN 7B IN 1A IN 15 IN 7B IN 15 IN 7B 6 IN 3A IN 14 IN 6B IN 14 IN 6B NC IN 14 IN 6B IN 14 IN 6B 7 IN 4A IN 13 IN 5B IN 13 IN 5B IN 2A IN 13 IN 5B IN 13 IN 5B 8 OUT A IN 12 IN 4B IN 12 IN 4B IN 3A IN 12 IN 4B IN 12 IN 4B 9 OUT B IN 11 IN 3B IN 11 IN 3B IN 4A IN 11 IN 3B IN 11 IN 3B 10 IN 4B IN 10 IN 2B IN 10 IN 2B OUT A IN 10 IN 2B IN 10 IN 2B 11 IN 3B IN 9 IN 1B IN 9 IN 1B NC IN 9 IN 1B IN 9 IN 1B 12 IN 2B GND GND GND GND OUT B GND GND GND GND 13 IN 1B VREF NC NC NC IN 4B NC IN 3B VREF NC NC A3 VREF A3 NC A3 NC A2 A2 A2 IN 2B A2 A2 A2 A2 14 V+ VREF A3 15 GND A2 16 A1 A1 A1 A1 A1 NC A1 A1 A1 A1 17 --- A0 A0 A0 A0 IN 1B A0 A0 A0 A0 18 --- Enable Enable Enable Enable V+ Enable Enable Enable Enable 19 --- IN 1 IN 1A IN 1 IN 1A GND IN 1 IN 1A IN 1 IN 1A 20 --- IN 2 IN 2A IN 2 IN 2A A1 IN 2 IN 2A IN 2 IN 2A 21 --- IN 3 IN 3A IN 3 IN 3A --- IN 3 IN 3A IN 3 IN 3A 22 --- IN 4 IN 4A IN 4 IN 4A --- IN 4 IN 4A IN 4 IN 4A 23 --- IN 5 IN 5A IN 5 IN 5A --- IN 5 IN 5A IN 5 IN 5A 24 --- IN 6 IN 6A IN 6 IN 6A --- IN 6 IN 6A IN 6 IN 6A 25 --- IN 7 IN 7A IN 7 IN 7A --- IN 7 IN 7A IN 7 IN 7A 26 --- IN 8 IN 8A IN 8 IN 8A --- IN 8 IN 8A IN 8 IN 8A 27 --- V- V- V- V- --- V- V- V- V- 28 --- OUT OUT A OUT OUT A --- OUT OUT A OUT OUT A FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 11 Device types 01, 04, and 07 A3 A2 A1 A0 EN X X X X L Device types 02, 05, and 08 CHANNEL SELECTED NONE A2 A1 A0 EN X X X L CHANNEL SELECTED NONE L L L L H 1 L L L H 1A, 1B L L L H H 2 L L H H 2A, 2B L L H L H 3 L H L H 3A, 3B L L H H H 4 L H H H 4A, 4B L H L L H 5 H L L H 5A, 5B L H L H H 6 H L H H 6A, 6B L H H L H 7 H H L H 7A, 7B L H H H H 8 H H H H 8A, 8B H L L L H 9 H L L H H 10 H L H L H 11 H L H H H 12 H H L L H 13 H H L H H 14 H H H L H 15 H H H H H 16 Device types 03, 06, and 09 A1 A0 X X L CHANNEL SELECTED NONE L L H 1A, 1B EN L H H 2A, 2B H L H 3A, 3B H H H 4A, 4B FIGURE 2. Truth tables. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 12 FIGURE 3. Break-before-make test circuit and waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 13 FIGURE 3. Break-before-make test circuit and waveforms – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 14 FIGURE 3. Break-before-make test circuit and waveforms – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 15 FIGURE 3. Break-before-make test circuit and waveforms – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 16 FIGURE 3. Break-before-make test circuit and waveforms – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 17 FIGURE 3. Break-before-make test circuit and waveforms – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 18 FIGURE 3. Break-before-make test circuit and waveforms – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 19 FIGURE 4. Switching times test circuits. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 20 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 21 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 22 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 23 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 24 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 25 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 26 1 +15 V 2 3 4 100 pF 1k 5 GND 6 +10 V 7 -10 V 8 -10 V 9 +10 V 10 11 GND 12 13 14 +V 28 OUT A 27 -V OUT B NC IN 8A IN 8B IN 7A IN 7B IN 6A IN 6B IN 5A IN 5B IN 4A IN 4B IN 3A IN 3B IN 2A IN 2B IN 1A I/O -15 V 100 pF 26 1k 25 24 GND 23 -10 V 22 +10 V 21 +10 V 20 -10 V 19 IN 1B EN GND A0 NC A1 NC A2 . GND 18 +5 V 17 PULSE GEN 16 15 (ADDRESS INPUTS TO I/O) 1 +15 V 2 3 4 100 pF 1k 5 6 +10 V 7 -10 V 8 9 GND 10 11 12 13 14 +V 28 OUT A 27 -V OUT B NC IN 8A IN 8B IN 7A IN 7B IN 6A IN 6B IN 5A IN 5B IN 4A IN 4B IN 3A IN 3B IN 2A IN 2B IN 1A I/O -15 V 100 pF 26 1k 25 24 +10 V 23 -10 V 22 GND 21 20 19 IN 1B EN GND A0 NC A1 NC A2 18 PULSE GEN 17 16 15 +5 V (ENABLE TO I/O) FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 27 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 28 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 29 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 30 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 31 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 32 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 33 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 34 FIGURE 4. Switching times test circuits – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 35 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 capacitance measurements shall be measured only for the initial test and after process or design changes which may affect capacitance. d. Subgroups 7 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125°C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 36 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) Subgroups (in accordance with MIL-STD-883, method 5005, table I) 1 1*,2,3,9 1,2,3,4,7,9,10**,11** 1 * PDA applies to subgroup 1. ** Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-85131 A REVISION LEVEL F SHEET 37 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 07-09-13 Approved sources of supply for SMD 5962-85131 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-85131013A 34371 HI4-546/883 5962-8513101XA 34371 HI1-546/883 5962-85131023A 34371 HI4-547/883 5962-8513102XA 34371 HI1-547/883 5962-85131032A 3/ HI4-549/883 5962-8513103EA 34371 HI1-549/883 M38510/19006BEA 5962-8513104XA 3/ IH5116MJI M38510/19002BXA 5962-8513105XA 3/ IH5216MJI M38510/19004BXA 5962-85131062C 1ES66 MAX359MLP/883B 1ES66 MAX359MJE/883B 3/ IH5208MJE 5962-85131073A 34371 HI4-506/883 5962-85131073C 1ES66 DG506AAZ/883B 5962-8513107XA 34371 HI1-506/883 5962-85131083A 3/ HI4-507/883 5962-85131083C 1ES66 DG507AAZ/883B 5962-8513108XA 3/ HI1-507/883 5962-85131092A 34371 HI4-509/883 5962-85131092C 1ES66 DG509AAZ/883B 5962-8513109EA 3/ HI1-509/883 5962-8513106EA Reference military specification M38510/19002BXA M38510/19004BXA M38510/19006BEA M38510/19001BXA M38510/19003BXA M38510/19008BEA 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED Vendor CAGE number Vendor name and address 34371 Intersil Corporation 1001 Murphy Ranch Road Milpitas, CA 95035-6803 Point of contact: 1650 Robert J. Conlan Blvd. Palm Bay, FL 32905 1ES66 Maxim Integrated Products 120 San Gabriel Drive Sunnyvale, CA 94086-5125 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2