Radiation Hardened High Speed, Quad SPST, CMOS Analog Switch HS-201HSRH, HS-201HSEH Features The HS-201HSRH, HS-201HSEH are monolithic CMOS analog switch featuring power-off high input impedance, very fast switching speeds and low ON-resistance. Fabrication on our DI RSG process assures SEL immunity and only very slight sensitivity to low dose rate (ELDRS). These Class V/Q devices are tested and guaranteed for 300krad (Si) total dose performance. • Electrically screened to DLA SMD# 5962-99618 Power-off high input impedance enables the use of this device in redundant circuits without causing data bus signal degradation. ESD protection, overvoltage protection, fast switching times, low ON-resistance, and guaranteed radiation hardness, make the HS-201HSRH ideal for any space application where improved switching performance is required. • Overvoltage protection (power on, switch off) . . . . . . . . . . . ±30V • QML qualified per MIL-PRF-38535 • Radiation performance - High dose rate (50-300rad(Si)/s). . . . . . . . . . . 300krad(Si) - Low dose rate (0.01rad(SI)/s) . . . . . . . . . . . . . . 50krad(Si) - SEL immune . . . . . . . . . . . . . . . . . . . . . . . . . DI RSG process • Power off high impedance . . . . . . . . . . . . . . . . . . . . . . . . ±17V • Fast switching times - tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110ns (max) - tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80ns (max) • Low “ON” resistance . . . . . . . . . . . . . . . . . . . . . . . . 50Ω (max) • Pin compatible with industry standard 201 types • Operating supply range . . . . . . . . . . . . . . . . . . . . . . .±10V to ±15V • Wide analog voltage range (±15V supplies) . . . . . . . . . . . . ±15V • TTL compatible Applications • High speed multiplexing • Sample and hold circuits • Digital filters • Operational amplifier gain switching networks • Integrator reset circuits Pin Configuration HS1-201HSRH, HS1-201HSEH SBDIP (CDIP2-T16) HS9-201HSRH, HS9-201HSEH FLATPACK (CDFP4-F16) TOP VIEW A1 1 OUT1 2 IN1 3 14 IN2 13 V+ GND 5 12 NC IN4 6 11 IN3 A4 8 1 15 OUT2 V- 4 OUT4 7 February 11, 2014 FN4874.3 16 A2 10 OUT3 9 A3 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2000, 2006, 2013, 2014. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. HS-201HSRH, HS-201HSEH Ordering Information INTERNAL MKT. NUMBER (Note 1) ORDERING SMD NUMBER (Note 2) PART MARKING TEMP. RANGE (°C) PACKAGE (RoHS Compliant) PKG. DWG. # 5962F9961801VEC HS1-201HSRH-Q Q 5962F99 61801VEC -55 to +125 16 Ld SBDIP D16.3 5962F9961802VEC HS1-201HSEH-Q Q 5962F99 61802VEC -55 to +125 16 Ld SBDIP D16.3 5962F9961801QEC HS1-201HSRH-8 Q 5962F99 61801QEC -55 to +125 16 Ld SBDIP D16.3 5962F9961801VXC HS9-201HSRH-Q Q 5962F99 61801VXC -55 to +125 16 Ld Flatpack K16.A 5962F9961802VXC HS9-201HSEH-Q Q 5962F99 61802VXC -55 to +125 16 Ld Flatpack K16.A 5962F9961801QXC HS9-201HSRH-8 Q 5962F99 61801QXC -55 to +125 16 Ld Flatpack K16.A 5962F9961801V9A HS0-201HSRH-Q -55 to +125 Die 5962F9961802V9A HS0-201HSEH-Q -55 to +125 Die HS1-201HSRH/PROTO HS1-201HSRH/PROTO HS1-201HSRH/PROTO -55 to +125 16 Ld SBDIP D16.3 HS9-201HSRH/PROTO HS9-201HSRH/PROTO HS9-201HSRH/PROTO -55 to +125 16 Ld Flatpack K16.A HS0-201HSRH/SAMPLE HS0-201HSRH/SAMPLE -55 to +125 Die NOTES: 1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 2. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the “Ordering Information” table must be used when ordering 2 FN4874.3 February 11, 2014 HS-201HSRH, HS-201HSEH Die Characteristics DIE DIMENSIONS ASSEMBLY RELATED INFORMATION 2790µm x 4950µm (110 mils x 195 mils) Thickness: 483µm ±25.4µm (19 mils ±1 mil) Substrate Potential Unbiased (DI) INTERFACE MATERIALS ADDITIONAL INFORMATION Glassivation Worst Case Current Density Type: Phosphorus Silicon Glass (PSG) Thickness: 8.0kÅ ±1.0kÅ <2.0 x 105 A/cm2 Transistor Count Metallization 328 Type: Al Si Cu Thickness: 16.0kÅ ± 2kÅ Substrate Rad Hard Silicon Gate, Dielectric Isolation Backside Finish Silicon Metallization Mask Layout OUT4 IN4 GND V- IN1 OUT1 A4 A1 A3 A2 OUT3 IN3 3 V+ IN2 OUT2 FN4874.3 February 11, 2014 HS-201HSRH, HS-201HSEH Package Outline Drawing K16.A 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE Rev 2, 1/10 0.015 (0.38) 0.008 (0.20) PIN NO. 1 ID OPTIONAL 1 2 0.050 (1.27 BSC) PIN NO. 1 ID AREA TOP VIEW 0.022 (0.56) 0.015 (0.38) 0.115 (2.92) 0.045 (1.14) 0.440 (11.18) MAX 0.005 (0.13) MIN 4 0.045 (1.14) 0.026 (0.66) 6 0.285 (7.24) 0.245 (6.22) 0.009 (0.23) 0.004 (0.10) -D-H- -C- 0.13 (3.30) MIN SEATING AND BASE PLANE 0.370 (9.40) 0.250 (6.35) 0.03 (0.76) MIN LEAD FINISH SIDE VIEW NOTES: 0.006 (0.15) 0.004 (0.10) 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab may be used to identify pin one. LEAD FINISH 0.009 (0.23) BASE METAL 0.004 (0.10) 0.019 (0.48) 0.015 (0.38) 3. The maximum limits of lead dimensions (section A-A) shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 4. Measure dimension at all four corners. 0.0015 (0.04) MAX 5. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 0.022 (0.56) 0.015 (0.38) 3 SECTION A-A 2. If a pin one identification mark is used in addition to a tab, the limits of the tab dimension do not apply. 6. Dimension shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 7. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 8. Controlling dimension: INCH. 4 FN4874.3 February 11, 2014 HS-201HSRH, HS-201HSEH Ceramic Dual-In-Line Metal Seal Packages (SBDIP) D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C) LEAD FINISH c1 -A- 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S SECTION A-A D S D BASE PLANE Q S2 -C- SEATING PLANE A L S1 eA A A b2 b e eA/2 c aaa M C A - B S D S ccc M C A - B S D S INCHES (c) NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. Dimension Q shall be measured from the seating plane to the base plane. SYMBOL MIN MILLIMETERS MAX MIN MAX NOTES A - 0.200 - 5.08 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 0.840 - 21.34 - E 0.220 0.310 5.59 7.87 - e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - eA/2 0.150 BSC 3.81 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 5 S1 0.005 - 0.13 - 6 S2 0.005 - 0.13 - 7 α 90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2 N 16 16 8 Rev. 0 4/94 6. Measure dimension S1 at all four corners. 7. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead. 8. N is the maximum number of terminal positions. 9. Braze fillets shall be concave. 10. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 11. Controlling dimension: INCH. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 5 FN4874.3 February 11, 2014