IP4238CZ10 SO T1 197 - 1 Surge protection for ethernet and telecom Rev. 1 — 1 October 2012 Product data sheet 1. Product profile 1.1 General description The device provides ElectroStatic Discharge (ESD) and surge protection on ethernet and telecom ports. It includes low capacitance protection diodes for high-speed signal lines and is encapsulated in a leadless medium power DFN2626-10 (SOT1197-1) Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) 30 kV IEC 61000-4-2 ESD protection of all signal lines 25 A surge protection 8/20 s according to IEC 61000-4-5 Matched 0.5 mm trace spacing Line capacitance of only 3 pF typical for each channel 1.3 Applications High-speed receiver and transmitter port protection for: Ethernet routers, hubs, modems Notebooks, main board graphic cards and ports Set-top boxes and game consoles 2. Pinning information Table 1. Pinning Pin Symbol Description 1 CH1 surge protection channel 1 2 n.c. not connected 3 CH3 surge protection channel 3 4 n.c. not connected 5 n.c. not connected 6 n.c. not connected 7 CH4 surge protection channel 4 8 n.c. not connected 9 CH2 surge protection channel 2 10 n.c. not connected 11 GND ground pad Simplified outline Graphic symbol 7UDQVSDUHQW WRSYLHZ DDD IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom 3. Ordering information Table 2. Ordering information Type number IP4238CZ10 Package Name Description Version DFN2626-10 plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals; body 2.6 2.6 0.5 mm SOT1197-1 4. Marking Table 3. Marking code Type number Marking code IP4238CZ10 4238 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VI input voltage Conditions Min Max Unit 0.5 +5.5 V VESD electrostatic discharge voltage 30 +30 kV Tstg storage temperature 55 +125 C Tamb ambient temperature 40 +125 C [1] [1] IEC 61000-4-2; contact discharge All pins to ground. 6. Characteristics Table 5. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VBR breakdown voltage Itest = 1 mA 6 - IRM reverse leakage current Vbias = 3 V - - 100 nA VF forward voltage Itest = 1 mA Cline line capacitance - 0.7 - V f = 1 MHz; Vbias = 2.5 V [1] - 3 - pF [1][2] - 0.07 - pF - 0.23 - Cline(mutual) mutual line capacitance f = 1 MHz; Vbias = 2.5 V rdyn dynamic resistance surge [3] positive transient - 0.23 - IPP = 1 A [3] - 2.1 - V IPP = 10 A [3] - 4.0 - V IPP = 25 A [3] - 7.3 - V negative transient VCL(ch)trt(pos) [1] positive transient channel clamping voltage V This parameter is guaranteed by design. [2] Between signal pin and pin n.c. [3] According to IEC 61000-4-5 (8/20 s). IP4238CZ10 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 1 October 2012 © NXP B.V. 2012. All rights reserved. 2 of 11 IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom , $ DDD , $ 9&/9 tp = 100 ns; Transmission Line Pulse (TLP) Fig 1. DDD 9&/9 tp = 100 ns; Transmission Line Pulse (TLP) Dynamic resistance with positive clamping Fig 2. Dynamic resistance with negative clamping The device uses an advanced clamping structure showing a negative dynamic resistance. This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited DC current sources to the data lines to avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage (due to an ESD pulse for instance). DDD 9&/ 9 9&/ 9 DDD ,&/$ IEC 61000-4-5; tp = 8/20 s; positive pulse (1) Tamb = 125 C (2) Tamb = 75 C (2) Tamb = 75 C (3) Tamb = 25 C (3) Tamb = 25 C Dynamic resistance with positive clamping IP4238CZ10 Product data sheet ,&/$ IEC 61000-4-5; tp = 8/20 s; negative pulse (1) Tamb = 125 C Fig 3. Fig 4. Dynamic resistance with negative clamping All information provided in this document is subject to legal disclaimers. Rev. 1 — 1 October 2012 © NXP B.V. 2012. All rights reserved. 3 of 11 IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom DDD ,50 $ 7DPE& Vbias = 3 V Fig 5. Reverse leakage current as a function of ambient temperature; typical values IP4238CZ10 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 1 October 2012 © NXP B.V. 2012. All rights reserved. 4 of 11 IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom 7. Application information The device can be configured to protect line-to-line and line-to-ground configurations, as well as parallel configurations to increase the clamping performance. When designing the Printed-Circuit Board (PCB), consider the parasitic resistance of traces for relatively long surge pulses. For signal integrity, give careful consideration to basic high-speed routing guidelines, impedance matching, and signal coupling. Do not connect the signal lines to unlimited current sources like for example, a battery. QF 3+< QF 5- 3+< 5- QF DDD Fig 6. Line-to-line surge protection of an ethernet interface with IP4238CZ10 DDD Fig 7. Line-to-ground surge protection of an ethernet interface with IP4238CZ10 QF QF 3+< 5- QF QF DDD Fig 8. Enhanced surge protection of an ethernet interface with IP4238CZ10 (ground pad floating) IP4238CZ10 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 1 October 2012 © NXP B.V. 2012. All rights reserved. 5 of 11 IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom 8. Package outline 'LPHQVLRQVLQPP Fig 9. PLQ PD[ PD[ Package outline DFN2626-10 (SOT1197-1) 9. Packing information Table 6. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 4000 IP4238CZ10 [1] IP4238CZ10 Product data sheet DFN2626-10 4 mm pitch, 8 mm tape and reel (SOT1197-1) -115 For further information and the availability of packing methods, see Section 13. All information provided in this document is subject to legal disclaimers. Rev. 1 — 1 October 2012 © NXP B.V. 2012. All rights reserved. 6 of 11 IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom 10. Soldering Footprint information for reflow soldering of DFN2626-10 package SOT1197-1 Hx Gx D P 0.025 0.025 Ay Gy By SPy SLy nSPy Hy nSPx SPx SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area solder resist DIMENSIONS in mm P Ay By D SLx SLy SPx SPy Gx Gy Hx Hy 0.5 3.05 1.9 0.25 2.2 1.3 0.8 0.4 2.5 2.85 2.85 3.3 Issue date 11-07-27 12-09-16 sot1197-1_fr Fig 10. Reflow soldering footprint DFN2626-10 (SOT1197-1) IP4238CZ10 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 1 October 2012 © NXP B.V. 2012. All rights reserved. 7 of 11 IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom 11. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4238CZ10 v.1 20121001 Product data sheet - - IP4238CZ10 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 1 October 2012 © NXP B.V. 2012. All rights reserved. 8 of 11 IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. IP4238CZ10 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 1 October 2012 © NXP B.V. 2012. All rights reserved. 9 of 11 IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP4238CZ10 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 1 October 2012 © NXP B.V. 2012. All rights reserved. 10 of 11 IP4238CZ10 NXP Semiconductors Surge protection for ethernet and telecom 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Application information. . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 1 October 2012 Document identifier: IP4238CZ10