TSOP372..H, TSOP374..H Datasheet

TSOP372..H, TSOP374..H
www.vishay.com
Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
FEATURES
• Very low supply current
• Photo detectors and preamplifier in one package
• Internal filter for PCM frequency
• Supply voltage: 2.5 V to 5.5 V
• Improved immunity against ambient light
• Insensitive to supply voltage ripple and noise
• External metal shield
• Material categorization:
for definitions of compliance
www.vishay.com/doc?99912
22594
please
see
DESCRIPTION
The TSOP372..H, TSOP374..H series are miniaturized
receiver modules for infrared remote control systems. A PIN
diode and a preamplifier are assembled on a PCB, the
epoxy lens cap contains an IR filter.
ORDERING CODE
Taping:
TSOP37...TT1 - top view taped
The TSOP374..H series devices are optimized to suppress
almost all spurious pulses from energy saving lamps like
CFLs. The AGC4 used in the TSOP374..H may suppress
some data signals. The TSOP372..H series are provided
primarily for compatibility with old AGC2 designs. New
designs should prefer the TSOP374..H series containing the
newer AGC4.
TSOP37...TT2 - top view taped
These components have not been qualified according to
automotive specifications.
PARTS TABLE
LEGACY, FOR
LONG BURST REMOTE CONTROLS (AGC2)
RECOMMENDED FOR
LONG BURST CODES (AGC4)
36 kHz
TSOP37236H
TSOP37436H (1)(/2)(3)
38 kHz
TSOP37238H
TSOP37438H (4)(5)(8)
AGC
Carrier
frequency
40 kHz
TSOP37240H
TSOP37440H
56 kHz
TSOP37256H
TSOP37456 H(6)(7)
Package
Belobog shield
Pinning
1 = OUT, 2, 3, 6, 7, 8 = GND, 4, 5 = VS
Dimensions (mm)
4.3 W x 4.3 H x 1.0 D
Mounting
SMD
Application
Best remote control code
Rev. 1.6, 11-Nov-15
Remote control
(1)
RC-5
(2)
RC-6
(3)
Panasonic
1
(4)
NEC
(5)
Sharp
(6)
r-step
(7)
Thomson RCA
(8)
r-map
Document Number: 82622
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BLOCK DIAGRAM
APPLICATION CIRCUIT
17170_5
4, 5
Transmitter
with
TSALxxxx
VS
30 kΩ
R1
IR receiver
VS
Input
Demodulator
Band
pass
AGC
Circuit
1
OUT
VO
GND
GND
Control circuit
µC
OUT
2, 3,
6, 7, 8
PIN
+ VS
C1
GND
R1 and C1 are recommended for protection against EOS.
Components should be in the range of 33 Ω < R1 < 1 kΩ,
C1 > 0.1 µF.
20445-5
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VALUE
Supply voltage
TEST CONDITION
VS
-0.3 to +6
V
Supply current
IS
3
mA
Output voltage
VO
-0.3 to (VS + 0.3)
V
Output current
IO
5
mA
Junction temperature
UNIT
Tj
100
°C
Storage temperature range
Tstg
-25 to +85
°C
Operating temperature range
Tamb
-25 to +85
°C
Ptot
10
mW
Power consumption
Tamb ≤ 85 °C
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Supply voltage
SYMBOL
MIN.
TYP.
MAX.
UNIT
VS
2.5
-
5.5
V
VS = 3.3 V, Ev = 0
ISD
0.27
0.35
0.45
mA
Ev = 40 klx, sunlight
ISH
-
0.45
-
mA
Ev = 0, IR diode TSAL6200,
IF = 200 mA, test signal see fig. 1
d
-
45
-
m
Output voltage low
IOSL = 0.5 mA, Ee = 0.7 mW/m2,
test signal see fig. 1
VOSL
-
-
100
mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee min.
-
0.12
0.25
mW/m2
Maximum irradiance
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee max.
30
-
-
W/m2
Directivity
Angle of half transmission
distance
ϕ1/2
-
± 75
-
deg
Supply current
Transmission distance
Rev. 1.6, 11-Nov-15
2
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TSOP372..H, TSOP374..H
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Vishay Semiconductors
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Optical Test Signal
Ee
0.8
ton, toff - Output Pulse Width (ms)
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms)
t
tpi *
T
10/f0 is recommended for optimal function
* tpi
Output Signal
VO
1)
VOH
2)
VOL
td
16110
7/f0 < td < 15/f0
tpi - 5/f0 < tpo < tpi + 6/f0
1)
tpo
0.6
0.5
toff
0.4
0.3
0.2
0
0.1
2)
t
10
100
1000
10 000
Fig. 4 - Output Pulse Diagram
1.2
Ee min./Ee - Relative Responsivity
Output pulse width
0.9
tpo - Output Pulse Width (ms)
1
Ee - Irradiance (mW/m2)
20759
1.0
0.8
Input burst length
0.7
0.6
0.5
0.4
0.3
λ = 950 nm,
optical test signal, fig. 1
0.2
0.1
1.0
0.8
0.6
0.4
f = f0 ± 5 %
Δf(3 dB) = f0/10
0.2
0.0
0
0.1
20752
1
10
102
103
104
105
0.7
Ee - Irradiance (mW/m2)
Ee min. - Threshold Irradiance (mW/m2)
t
600 µs
t = 60 ms
94 8134
Output Signal, (see fig. 4)
VOH
VOL
t on
t off
t
1.3
4.0
3.5
Correlation with ambient light sources:
10 W/m2 = 1.4 klx (std. illum. A, T = 2855 K)
10 W/m2 = 8.2 klx (daylight, T = 5900 K)
3.0
2.5
Wavelength of ambient
illumination: λ = 950 nm
2.0
1.5
1.0
0.5
20757
Fig. 3 - Output Function
Rev. 1.6, 11-Nov-15
1.1
Fig. 5 - Frequency Dependance of Responsivity
Optical Test Signal
600 µs
0.9
f/f0 - Relative Frequency
16925
Fig. 2 - Output Pulse Width vs. Irradiance
VO
λ = 950 nm,
optical test signal, fig. 3
0.1
Fig. 1 - Output Function
Ee
ton
0.7
0
0.01
0.1
1
10
100
Ee - Ambient DC Irradiance (W/m2)
Fig. 6 - Sensitivity in Bright Ambient
3
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1.0
S(λ)rel - Relative Spectral Sensitivity
Ee min. - Threshold Irradiance (mW/m2)
3.0
2.5
f = f0
f = 30 kHz
f = 10 kHz
f = 100 Hz
2.0
1.5
1.0
0.5
0
1
10
100
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
750 800 850 900 950 1000 1050 1100 1150
1000
λ - Wavelength (nm)
ΔVS RMS - AC Voltage on DC Supply Voltage (mV)
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
1.0
Max. Envelope Duty Cycle
0.9
-20°
0.8
-10°
0°
10°
20°
-30°
0.7
30°
-40°
0.6
40°
-50°
50°
0.5
60°
-60°
0.4
TSOP372..H
0.3
-70°
70°
TSOP374..H
0.2
-80°
0.1
80°
f = 38 kHz, Ee = 2 mW/m²
0
0
20
40
60
80
100
0.1
21947
120
0.3
0.5
0.7
0.9
Burst Length (number of cycles/burst)
Fig. 11 - Directivity
0.30
0.30
Ee min. - Sensitivity (mW/m2)
Ee min. - Threshold Irradiance (mW/m2)
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
0.25
0.20
0.15
0.10
0.05
0.25
0.20
0.15
0.10
0.05
0.00
0
-30
-10
10
30
50
70
1
90
Fig. 9 - Sensitivity vs. Ambient Temperature
Rev. 1.6, 11-Nov-15
2
3
4
5
VS - Supply Voltage (V)
Tamb - Ambient Temperature (°C)
Fig. 12 - Sensitivity vs. Supply Voltage
4
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SUITABLE DATA FORMAT
IR Signal
The TSOP372..H, TSOP374..H series is designed to
suppress spurious output pulses due to noise or
disturbance signals. The devices can distinguish data
signals from noise due to differences in frequency, burst
length, and envelope duty cycle. The data signal should be
close to the device’s band-pass center frequency
(e.g. 38 kHz) and fulfill the conditions in the table below.
When a data signal is applied to the TSOP372..H,
TSOP374..H in the presence of a disturbance, the sensitivity
of the receiver is automatically reduced by the AGC to insure
that no spurious pulses are present at the receiver’s output.
Some examples which are suppressed are:
0
• DC light (e.g. from tungsten bulbs sunlight)
5
10
15
20
Time (ms)
16920
• Continuous signals at any frequency
Fig. 13 - IR Signal from Fluorescent Lamp
with Low Modulation
IR Signal
• Strongly or weakly modulated patterns from fluorescent
lamps with electronic ballasts (see fig. 13 or fig. 14)
0
16921
5
10
15
20
Time (ms)
Fig. 14 - IR Signal from Fluorescent Lamp
with High Modulation
TSOP372..H
TSOP374..H
Minimum burst length
10 cycles/burst
10 cycles/burst
After each burst of length
a minimum gap time is required of
10 to 70 cycles
≥ 10 cycles
10 to 35 cycles
≥ 10 cycles
For bursts greater than
a minimum gap time in the data stream is needed of
70 cycles
> 4 x burst length
35 cycles
> 10 x burst length
Maximum number of continuous short bursts/second
1800
1500
NEC code
Yes
Preferred
RC5/RC6 code
Yes
Preferred
Thomson 56 kHz code
Yes
Preferred
Sharp code
Yes
Preferred
Mild disturbance patterns
are suppressed (example:
signal pattern of fig. 13)
Complex and critical disturbance patterns
are suppressed (example: signal pattern
of fig. 14 or highly dimmed LCDs)
Suppression of interference from fluorescent lamps
Notes
• For data formats with short bursts (less than 10 carrier cycles) please see the datasheet for TSOP373..H, TSOP375..H
• For Sony 12, 15, and 20 bit IR codes please see the datasheet of TSOP37S40H
Rev. 1.6, 11-Nov-15
5
Document Number: 82622
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Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
4 x 0.75 = 3
(0.7)
(0.3)
(0.4)
(2.85)
(1.8)
(0.95)
0.475
0.55
(0.3)
(0.3)
0.75 ± 0.05
(2) Pins connected internally.
It is not necessary to connect
externally.
1.5
Pinning from Topview
GND
1 ± 0.2
3
7
(2)
6
(GND)
8
GND
0.55
(8 x)
0.35 ± 0.05
Allowed offset
outer edge of shield
to solder pads of
molded device
± 0.1 mm
4
5
(2)
(4.3)
(0.45)
(4.3)
4 x 0.75 = 3
(2.75)
Marking area
Drawing-No.: 6.550-5316.01-4
Issue: 2; 12.02.14
3
(2)
(0.8) (3 x)
(1.2)
(2.9) (1)
Pin 1 identification
2
(2)
Proposed pad layout from
component side
(dim. for reference only)
4.3 ± 0.2
(1.7) (1)
1
Vs
(3.25)(1)
(Vs)
Out
4.3 ± 0.2
(GND)
All dimensions in mm
Not indicated tolerances ± 0.1
(1) optically effective area
(GND)
0.15
technical drawings
according to DIN
specifications
(3 x) (0.35)
Rev. 1.6, 11-Nov-15
6
Document Number: 82622
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ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
19800
50
100
150
t (s)
200
250
300
max. 2 cycles allowed
ORDERING INFORMATION
ORDERING CODE
TSOP37..HTT1
TSOP37..HTT2
PACKAGING
Tape and reel
VOLUME (1)
MOQ: 1500 pcs
MOQ: 5000 pcs
REMARKS
3.95 mm x 3.95 mm x 0.75 mm
Note
(1) MOQ: minimum order quantity
Rev. 1.6, 11-Nov-15
7
Document Number: 82622
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TAPING VERSION TSOP37..H DIMENSIONS in millimeters
Tape and Reel dimensions:
Reel size "Y"
X
Unreel direction
2±
Ø 60 min.
GS 08 Ø 180 ± 2 = 1500 pcs.
GS 18 Ø 330 ± 2 = 5000 pcs.
Tape position
coming out from reel
ØY
0.5
Not indicated tolerances ± 0.1
Ø 21 ± 0.8
Ø 13 ± 0.2
Label posted here
(12.4)
18.4 max.
Parts mounted
Empty leader 400 mm min.
100 mm min. with cover tape
Leader and trailer tape:
Empty trailer 200 mm min.
Direction of pulling out
Technical drawings
according to DIN
specifications
(Ø 1.5)
(2)
(5.5)
(0.3)
(4)
Drawing-No.: 9.700-5380.01-4
Issue: 1; 28.10.13
Reel dimensions and tape
Rev. 1.6, 11-Nov-15
(12)
(8)
(1.75)
X 2:1
8
Document Number: 82622
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LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
LOT-/serial-number
BATCH
10
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
MIXED CODE
-
xxxxxxx+
Company logo
TYPE
LENGTH
Data-code
Mixed code indicator
Origin
LONG BAR CODE TOP
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
TYPE
LENGTH
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
SHORT BAR CODE BOTTOM
DRY PACKING
FINAL PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
Aluminum bag
Label
Reel
15973
Rev. 1.6, 11-Nov-15
9
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RECOMMENDED METHOD OF STORAGE
ESD PRECAUTION
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
• Storage temperature 10 °C to 30 °C
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
• Storage humidity ≤ 60 % RH max.
After more than 168 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen)
or
BAR CODE PRODUCT LABEL (example)
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard J-STD-020 level 3 label is included
on all dry bags.
LEVEL
Caution
This bag contains
MOISTURE-SENSITIVE DEVICES
3
22178
If blank, see adjacent
bar code label
1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%
relative humidity (RH)
260
2. Peak package body temperature:_______________________°C
If blank, see adjacent bar code label
3. After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
168
a) Mounted within:___________________hours
of factory conditions
If blank, see adjacent bar code label
≤30°C/60% RH, or
b) Stored per J-STD-033
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for
level 2 devices when read at 23±5°C
b) 3a or 3b are not met
5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure
Bag Seal Date:_________________________________________
If blank, see adjacent bar code label
Note: Level and body temperature defined by IPC/JEDEC J-STD-020
22650
EIA JEDEC standard J-STD-020 level 3 label is included
on all dry bags
Rev. 1.6, 11-Nov-15
10
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Legal Disclaimer Notice
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
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provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000