High-performance, small form-factor devices protect the NFC antenna

NXP NFC antenna
protection diodes
PESD18VF1Bx and
PESD24VF1Bx
High-performance, small form-factor
devices protect the NFC antenna
The best ESD protection for NFC systems - from the global leader in ESD protection and
Near-Field Communication (NFC).
Features
`` Bidirectional configuration, allowing operating voltages up
to 18 V and 24 V
`` Very low capacitance, enabling easy design of the antenna
matching circuit
`` Very small voltage dependency of the diode capacitance,
avoiding intermodulation distortion
`` Small form-factor packages of 1006 (0402 inch) and 0603
(0201 inch) standard size
General description
NFC is the breakthrough technology that allows tags in
posters, check-in signs, and contactless payment terminals
to interact with mobile phones. The NFC antenna is often
integrated into the battery cover or the battery itself and is
connected to the NFC ICs via small contacts on the phone –
an entry point for ESD strikes which are potentially hazardous
to the NFC IC. These new NXP devices are optimized for the
requirements of the NFC system and ensure the best-possible
protection of the NFC IC.
VRWM (V)
Cline typ (pF)
Cline max (pF)
ESD rating max
(kV)
Configuration
Package
Size (mm)
PESD18VF1BL
PESD18VF1BSF*
PESD24VF1BL
PESD24VF1BSF*
* in development
Protected lines
Type number
Selection guide
1
1
1
1
18
18
24
24
0.35
0.3
0.35
0.3
0.5
0.45
0.5
0.45
10
10
10
10
Bidirectional
Bidirectional
Bidirectional
Bidirectional
DFN1006-2
DSN0603-2
DFN1006-2
DSN0603-2
1 x 0.6 x 0.48
0.6 x 0.3 x 0.3
1 x 0.6 x 0.48
0.6 x 0.3 x 0.3
The highly linear diode capacitance, with very small variation,
Using tiny packages makes PCB design more flexible.
minimizes signal degradation.
0.6
filter circuit
matching circuit
antenna terminal
+ ESD protection
antenna coil
0.5
Diode capacitance (pF)
NFC controller
0.4
0.3
0.2
0.1
0
-20
Circuit diagram
-15
-10
-5
0
5
10
15
20
DC bias voltage (V)
Diode capacitance versus bias voltage diagram
DFN1006 and DSN0603 packages
These small packages are ideally suited for use in slim, compact mobile devices.
DFN1006-2 Outline
DSN0603-2 Outline
0.15
0.13
1
2
0.25
0.23
0.4
0.625
0.575
0.325
0.275
0.32
0.28
0.0076
(2)
Note
1. Dimension A is including coating foil thickness.
2. The marking bar indicates the cathode.
More information about
NXP antenna protection
www.nxp.com/products/esd_emi_and_signal_conditioning/application_specific_esd_and_esd_emi_solutions/nfc_antenna_protection/
www.nxp.com
© 2014 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
Date of release: January 2014
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and
Document order number: 9397 750 17519
may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof
Printed in the Netherlands
does not convey nor imply any license under patent- or other industrial or intellectual property rights.