Proximity Sensor with Intelligent Interrupt and Sleep Modes ISL29027 Features The ISL29027 is an integrated infrared light-to-digital converter with a built-in IR LED driver and I2C Interface (SMBus Compatible). The flexible interrupt scheme is designed for minimal microcontroller utilization. • Works Under All Light Sources Including Sunlight For proximity sensor (Prox) data conversions, the built-in driver turns on an external infrared LED and the proximity sensor ADC converts the reflected IR intensity to digital. This ADC rejects ambient IR noise (such as sunlight) and has a 540μs conversion time. • Proximity Sensor with Broad IR Spectrum - Can Use 850nm and 950nm External IR LEDs • IR LED Driver with I2C Programmable Sink Currents - Net 100μs Pulse with 110mA or 220mA Amplitudes - Periodic Sleep Time up to 800ms Between Pulses • Ambient IR Noise Cancellation (Including Sunlight) Intelligent and Flexible Interrupts • Intelligent Interrupt Scheme Simplifies μC Code Proximity Sensing The ISL29027 provides proximity sensing with a typical 138μA normal operation current (110μA for sensors and internal circuitry, ~28μA for external LED) with 220mA current pulses for a net 100μs, repeating every 800ms (or under). • Proximity Interrupt Thresholds • Adjustable Interrupt Persistency - 1/4/8/16 Consecutive Triggers Required Before Interrupt Ultra Low Power The ISL29027 uses both a hardware pin and software bits to indicate an interrupt event has occurred. A proximity interrupt is defined as a measurement over a threshold limit. The user may also require that proximity interrupts occur at once, up to 16 times in a row before activating the interrupt pin. • 138μA DC Typical Supply Current for Prox Sensing - 110μA for Sensors and Internal Circuitry - 28μA Typical Current for External IR LED (Assuming 220mA for 100μs Every 800ms) • <1.0μA Supply Current When Powered Down Easy to Use The ISL29027 is designed to operate from 2.25V to 3.63V over the -40°C to +85°C ambient temperature range. It is packaged in a clear, lead-free 8 lead ODFN package. Applications - Mobile Devices: Smart Phone, PDA, GPS - Computing Devices: Laptop PC, Netbook - Consumer Devices: LCD-TV, Digital Picture Frame, Digital Camera • Set Registers; Wait for Interrupt • I2C (SMBus Compatible) Output • Temperature Compensated • Tiny ODFN8 2.0x2.1x0.7 (mm) Package Additional Features • 1.7V to 3.63V Supply for I2C Interface • 2.25V to 3.63V Sensor Power Supply • Pb-Free (RoHS Compliant) • I2C Address Selection Pin 2 COMMAND REGISTER LIGHT DATA PROCESS ALS AND IR CHANNEL ADC DATA REGISTER 1 ADDR0 5 SCL 6 SDA INTERRUPT 7 INT IR DRIVER 8 IRDR I2C IR PHOTODIODE ARRAY IREF FOSC 4 3 REXT GND FIGURE 1. BLOCK DIAGRAM February 7, 2011 FN7815.0 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL29027 Pin Configuration Pin Descriptions ISL29027 8 LD ODFN (2.0mmx2.1mmx0.7mm) TOP VIEW ADDR0 1 VDD 2 GND 3 REXT 4 THERMAL PAD 8 IRDR 7 INT 6 SDA 5 SCL *THERMAL PAD CAN BE CONNECTED TO GND OR ELECTRICALLY ISOLATED PIN NUMBER PIN NAME 0 T.PAD 1 ADDR0 I2C address pin - pull high or low (do not float) 2 VDD Positive supply: 2.25V to 3.63V 3 GND Ground 4 REXT External resistor (499kΩ; 1%) connects this pin to ground 5 SCL 6 SDA I2C clock line The I2C bus lines can be pulled from 1.7V to above VDD, 3.63V I2C data line max 7 INT 8 IRDR DESCRIPTION Thermal Pad (connect to GND or float) Interrupt pin; Logic output (open-drain) for interrupt IR LED driver pin - current flows into ISL29027 from LED cathode Ordering Information PART NUMBER (Notes 1, 2, 3) TEMP. RANGE (°C) ISL29027IROZ-T7 -40 to +85 PACKAGE Tape & Reel (Pb-free) 8 Ld ODFN PKG. DWG. # L8.2.1x2.0 NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL29027. For more information on MSL, please see Technical Brief TB363. 2 FN7815.0 February 7, 2011 ISL29027 Absolute Maximum Ratings (TA = +25°C) Thermal Information VDD Supply Voltage between VDD and GND . . . . . . . . . . . . . . . . . . . . . .4.0V I2C Bus Pin Voltage (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V I2C Bus Pin Current (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA REXT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V IRDR Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5V ADDR0 Pin Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V INT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V INT Pin Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA ESD Rating Human Body Model (Note 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 8 Ld ODFN Package (Notes 4, 5) . . . . . . . . 88 10 Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +90°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +100°C Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 6. ESD on all pins is 2kV except for IRDR, which is 1.5kV. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER VDD VDD = 3.0V, TA = +25°C, REXT = 499kΩ 1% tolerance. DESCRIPTION CONDITION Power Supply Range MIN MAX (Note 9) TYP (Note 9) UNIT 2.25 3.0 3.63 V SR_VDD Input Power-up Slew Rate VDD Rising Edge between 0.4V and 2.25V IDD_OFF Supply Current when Powered Down PROX_EN = 0 0.1 PROX_EN = 1 80 µA Internal Oscillator Frequency 5.25 MHz tINTGR_PROX 8-bit Prox Integration/Conversion Time 0.54 ms DATAPROX_0 Prox Measurement w/o Object in Path 1 DATAPROX_F Full Scale Prox ADC Code DATAPROX_1 Prox Measurement Result (Note 7) tr Rise Time for IRDR Sink Current RLOAD = 15Ω at IRDR pin, 20% to 80% 500 ns tf Fall time for IRDR Sink Current RLOAD = 15Ω at IRDR pin, 80% to 20% 500 ns IIRDR_0 IRDR Sink Current PROX_DR = 0; VIRDR = 0.5V IIRDR_1 IRDR Sink Current PROX_DR = 1; VIRDR = 0.5V IRDR Leakage Current PROX_EN = 0; VDD = 3.63V (Note 8) VIRDR Acceptable Voltage Range on IRDR Pin Register bit PROX_DR = 0 tPULSE Net IIRDR On Time Per PROX Reading 100 µs VREF Voltage of REXT Pin 0.51 V FI2C I2C Clock Rate Range VI2C Supply Voltage Range for I2C Interface IDD_PRX_SLP Supply Current for Prox in Sleep Time fOSC IIRDR_LEAK 0.5 36 95 V/ms 46 110 0.8 2 Counts 255 Counts 56 Counts 125 220 0.001 0.5 1.7 µA mA mA 1 µA 4.3 V 400 kHz 3.63 V 0.55 V VIL SCL and SDA Input Low Voltage VIH SCL and SDA Input High Voltage ISDA SDA Current Sinking Capability VOL = 0.4V 3 5 mA IINT INT Current Sinking Capability VOL = 0.4V 3 5 mA 3 1.25 V FN7815.0 February 7, 2011 ISL29027 Electrical Specifications PARAMETER PSRRIRDR VDD = 3.0V, TA = +25°C, REXT = 499kΩ 1% tolerance. (Continued) DESCRIPTION (ΔIIRDR)/(ΔVIRDR) CONDITION MIN MAX (Note 9) TYP (Note 9) UNIT PROX_DR = 0; VIRDR = 0.5V to 4.3V 4 mA/V NOTES: 7. An 850nm infrared LED is used to test PROX/IR sensitivity in an internal test mode. 8. Ability to guarantee IIRDR leakage of ~1nA is limited by test hardware.. 9. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. I2C Electrical Specifications (Note 10). PARAMETER For SCL and SDA unless otherwise noted, VDD = 3V, TA = +25°C, REXT = 499kΩ 1% tolerance DESCRIPTION CONDITION MIN TYP MAX UNIT 3.63 V VI2C Supply Voltage Range for I2C Interface fSCL SCL Clock Frequency 400 kHz VIL SCL and SDA Input Low Voltage 0.55 V VIH SCL and SDA Input High Voltage Vhys Hysteresis of Schmitt Trigger Input VOL Low-level Output Voltage (Open-drain) at 4mA Sink Current Ii 1.7 Input Leakage for each SDA, SCL Pin 1.25 V 0.05VDD V -10 0.4 V 10 µA tSP Pulse Width of Spikes that must be Suppressed by the Input Filter 50 ns tAA SCL Falling Edge to SDA Output Data Valid 900 ns Ci Capacitance for each SDA and SCL Pin 10 pF tHD:STA Hold Time (Repeated) START Condition After this period, the first clock pulse is generated 600 ns tLOW LOW Period of the SCL Clock Measured at the 30% of VDD crossing 1300 ns tHIGH HIGH period of the SCL Clock 600 ns tSU:STA Set-up Time for a Repeated START Condition 600 ns tHD:DAT Data Hold Time 30 ns tSU:DAT Data Set-up Time 100 ns tR Rise Time of both SDA and SCL Signals (Note 11) 20 + 0.1xCb ns tF Fall Time of both SDA and SCL Signals (Note 11) 20 + 0.1xCb ns Set-up Time for STOP Condition 600 ns Bus Free Time Between a STOP and START Condition 1300 ns tSU:STO tBUF Cb Capacitive Load for Each Bus Line 400 Maximum is determined by tR and tF 1 pF Rpull-up SDA and SCL System Bus Pull-up Resistor kΩ tVD;DAT Data Valid Time 0.9 µs tVD:ACK Data Valid Acknowledge Time 0.9 µs VnL Noise Margin at the LOW Level 0.1VDD V VnH Noise Margin at the HIGH Level 0.2VDD V NOTES: 10. All parameters in I2C Electrical Specifications table are guaranteed by design and simulation. 11. Cb is the capacitance of the bus in pF. 4 FN7815.0 February 7, 2011 ISL29027 FIGURE 2. I2C TIMING DIAGRAM Register Map There are ten 8-bit registers accessible via I2C. Registers 0x1 and 0x2 define the operation mode of the device. Registers 0x3 and 0x4 store the various Prox thresholds which trigger interrupt events. Registers 0x8 store the results of Prox ADC conversions. TABLE 1. ISL29028A REGISTERS AND REGISTER BITS BIT ADDR REG NAME 7 6 0x00 (n/a) 0x01 CONFIGURE PROX EN 0x02 INTERRUPT PROX_FLAG 5 4 3 2 1 0 (Reserved) PROX_SLP[2:0] PROX_PRST[1:0] PROX_DR (Write 0) (Write0) DEFAULT (n/a) (Write 0) (Write0) (Write 0) (Write0) 0x00 (Write 0) 0x00 0x03 PROX_LT PROX_LT[7:0] 0x00 0x04 PROX_HT PROX_HT[7:0] 0xFF 0x05 (n/a) (Reserved) (n/a) 0x06 (n/a) (Reserved) (n/a) 0x07 (n/a) (Reserved) (n/a) 0x08 PROX_DATA PROX_DATA[7:0] 0x00 0x09 (n/a) (Reserved) (n/a) 0x0A (n/a) (Reserved) (n/a) 0x0E TEST1 (Write as 0x00) 0x00 0x0F TEST2 (Write as 0x00) 0x00 5 FN7815.0 February 7, 2011 ISL29027 Register Descriptions TABLE 2. REGISTER 0x00 (RESERVED) BIT # ACCESS DEFAULT NAME 7:0 RO (n/a) (n/a) FUNCTION/OPERATION Reserved - no need to read or write TABLE 3. REGISTER 0x01 (CONFIGURE) - PROX CONFIGURATION BIT # ACCESS DEFAULT NAME FUNCTION/OPERATION 7 RW 0x00 PROX_EN (Prox Enable) When = 0, proximity sensing is disabled When = 1, continuous proximity sensing is enabled. Prox data will be ready 0.54ms after this bit is set high 6:4 RW 0x00 PROX_SLP (Prox Sleep) For bits 6:4 = (see the following) 111; sleep time between prox IR LED pulses is 0.0ms (run continuously) 110; sleep time between prox IR LED pulses is 12.5ms 101; sleep time between prox IR LED pulses is 50ms 100; sleep time between prox IR LED pulses is 75ms 011; sleep time between prox IR LED pulses is 100ms 010; sleep time between prox IR LED pulses is 200ms 001; sleep time between prox IR LED pulses is 400ms 000; sleep time between prox IR LED pulses is 800ms 3 RW 0x00 PROX_DR (Prox Drive) When = 0, IRDR behaves as a pulsed 110mA current sink When = 1, IRDR behaves as a pulsed 220mA current sink 2 RW 0x00 Unused (Write 0) Unused register bit (write 0) 1 RW 0x00 Unused (Write 0) Unused register bit (write 0) 0 RW 0x00 Unused (Write 0) Unused register bit (write 0) TABLE 4. REGISTER 0x02 (INTERRUPT) - PROX INTERRUPT CONTROL BIT # 7 ACCESS FLAG DEFAULT BIT NAME 0x00 PROX_FLAG (Prox Flag) When = 0, no Prox interrupt event has occurred since power-on or last “clear” When = 1, a Prox interrupt event occurred. Clearable by writing “0” FUNCTION/OPERATION For bits 6:5 = (see the following) 00; set PROX_FLAG if 1 conversion result trips the threshold value 01; set PROX_FLAG if 4 conversion results trip the threshold value 10; set PROX_FLAG if 8 conversion results trip the threshold value 11; set PROX_FLAG if 16 conversion results trip the threshold value 6:5 RW 0x00 PROX_PRST (Prox Persist) 4 RW 0x00 Unused (Write 0) Unused register bit - write 0 3 RW 0x00 Unused (Write 0) Unused register bit - write 0 RW 0x00 Unused (Write 0) Unused register bit - write 0 2:1 RW 0x00 Unused (Write 0) Unused register bit - write 0 0 TABLE 5. REGISTER 0x03 (PROX_LT) - INTERRUPT LOW THRESHOLD FOR PROXIMITY SENSOR BIT # ACCESS 7:0 RW 6 DEFAULT BIT NAME 0x00 PROX_LT (Prox Threshold) FUNCTION/OPERATION 8-bit interrupt low threshold for proximity sensing FN7815.0 February 7, 2011 ISL29027 TABLE 6. REGISTER 0x04 (PROX_HT) - INTERRUPT HIGH THRESHOLD FOR PROXIMITY SENSOR BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION 7:0 RW 0xFF PROX_HT (Prox Threshold) 8-bit interrupt high threshold for proximity sensing TABLE 7. REGISTER 0x08 (PROX_DATA) - PROXIMITY SENSOR DATA BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION 7:0 RO 0x00 PROX_DATA (Proximity Data) Results of 8-bit proximity sensor ADC conversion TABLE 8. REGISTER 0x0E (TEST1) - TEST MODE BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION 7:0 RW 0x00 (Write as 0x00) Test mode register. When 0x00, in normal operation TABLE 9. REGISTER 0x0F (TEST2) - TEST MODE 2 BIT # ACCESS DEFAULT BIT NAME 7:0 RW 0x00 (Write as 0x00) I2C DATA DEVICE ADDRESS START I2C SDA MASTER Test mode register. When 0x00, in normal operation REGISTER ADDRESS W A A SDA DRIVEN BY MASTER 1 2 3 4 5 6 7 8 9 A SDA DRIVEN BY MASTER 1 2 3 4 5 6 DEVICE ADDRESS STOP START A6 A5 A4 A3 A2 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0 A I2C SDA SLAVE (ISL29027) I2C CLK FUNCTION/OPERATION 7 8 A6 A5 A4 A3 A2 A1 A0 W SDA DRIVEN BY MASTER 1 9 2 3 4 5 DATA BYTE0 A SDA DRIVEN BY ISL29027 A A D7 D6 D5 D4 D3 D2 D1 D0 6 7 8 9 1 2 3 4 5 6 7 8 9 FIGURE 3. I2C DRIVER TIMING DIAGRAM FOR MASTER AND SLAVE CONNECTED TO COMMON BUS Principles of Operation I2C Interface The ISL29027’s I2C interface slave address is internally hardwired as 0b100010<x>, where “0b” signifies binary notation and x represents the logic level on pin ADDR0. Figure 3 shows a sample one-byte read. The I2C bus master always drives the SCL (clock) line, while either the master or the slave can drive the SDA (data) line. Every I2C transaction begins with the master asserting a start condition (SDA falling while SCL remains high). The first transmitted byte is initiated by the master and includes 7 address bits and a R/W bit. The slave is responsible for pulling SDA low during the ACK bit after every transmitted byte. Each I2C transaction ends with the master asserting a stop condition (SDA rising while SCL remains high). subtracts the IR reading before and after the LED is driven (to remove ambient IR such as sunlight), and converts this value to a digital count stored in Register 0x8. Because of the conversion times, the user must let the ADCs perform one full conversion first before reading from I2C Registers PROX_DATA (wait 0.54ms). The proximity sensor runs continuously with a time between conversions decided by PROX_SLP (Register 1 Bits [6:4]).(as shown in Figure 4). PROX SENSOR ACTIVE IRDR (CURRENT DRIVER) 0.54m s FOR PROX CONVERSION TIME SERIES OF CURRENT PULSES TOTALING 0.1ms TIME For more information about the I2C standard, please consult the Philips™ I2C specification documents. Photodiodes and ADCs The ISL29027 contains photodiode arrays which convert photons (light) into current. The proximity sensor is an 8-bit ADC. When proximity sensing is enabled, the IRDR pin will drive a usersupplied infrared LED, the emitted IR reflects off an object (i.e., a human head) back into the ISL29027, and a sensor converts the reflected IR wave to a current signal in 0.54ms. The ADC 7 SLEEP TIME (PROX_SLP) FIGURE 4. CURRENT DRIVE MODE OPTIONS Proximity Sensing When proximity sensing is enabled (PROX_EN = 1), the external IR LED is driven for 0.1ms by the built-in IR LED driver through the IRDR pin. The amplitude of the IR LED current depends on Register 1 bit 3: PROX_DR. If this bit is low, the load will see a FN7815.0 February 7, 2011 ISL29027 fixed 110mA current pulse. If this bit is high, the load on IRDR will see a fixed 220mA current pulse as seen in Figure 5. 220mA (PROX_DR = 1) 110mA (PROX_DR = 0) PIN 8 - IRDR (IRDR IS HI-Z WHEN NOT DRIVING) FIGURE 5. CURRENT DRIVE MODE OPTIONS When the IR from the LED reaches an object and gets reflected back into the ISL29027, the reflected IR light is converted into current as per the IR spectral response shown in Figure 7. One entire proximity measurement takes 0.54ms for one conversion (which includes 0.1ms spent driving the LED), and the period between proximity measurements is decided by PROX_SLP (sleep time) in (Register 1 Bits 6:4). Average LED driving current consumption is given by Equation 1. I lRDR ;PEAK × 100μs I lRDR ;AVE = ----------------------------------------------------T SLEEP (EQ. 1) Interrupt persistency is another useful option available for proximity measurements. Persistency requires X-in-a-row interrupt flags before the INT pin is driven low. Prox have their own independent interrupt persistency options. See PROX_PRST bits in Register 2. VDD Power-up and Power Supply Considerations Upon power-up, please ensure a VDD slew rate of 0.5V/ms or greater. After power-up, or if the user’s power supply temporarily deviates from our specification (2.25V to 3.63V), Intersil recommends the user write the following: write 0x00 to register 0x01, write 0x29 to register 0x0F, write 0x00 to register 0x0E, and write 0x00 to register 0x0F. The user should then wait ~1ms or more and then rewrite all registers to the desired values. If the user prefers a hardware reset method instead of writing to test registers: set VDD = 0V for 1 second or more, power back up at the required slew rate, and write registers to the desired values. Power-Down To put the ISL29027 into a power-down state, the user can set PROX_EN bits to 0 in Register 1. Or more simply, set all of Register 1 to 0x00. Noise Rejection Total current consumption is the sum of IDD and IIRDR. The IRDR pin sinks current (as shown in Figure 5) and the average IRDR current can be calculated using Equation 1. IDD depends on voltage and the mode-of-operation, as seen in Figure 9. Charge balancing ADC’s have excellent noise-rejection characteristics for periodic noise sources whose frequency is an integer multiple of the conversion rate. For instance, a 60Hz AC unwanted signal’s sum from 0ms to k*16.66ms (k = 1,2...ki) is zero. Similarly, setting the device’s integration time to be an integer multiple of the periodic noise signal greatly improves the light sensor output signal in the presence of noise. Since wall sockets may output at 60Hz or 50Hz, our integration time is 0.54ms: the lowest common integer number of cycles for both frequencies. Interrupt Function Proximity Detection of Various Objects The ISL29027 has an intelligent interrupt scheme designed to shift some logic processing away from intensive microcontroller I2C polling routines (which consume power) and towards a more independent light sensor, which can instruct a system to “wake up” or “go to sleep”. Proximity sensing relies on the amount of IR reflected back from objects. A perfectly black object would absorb all light and reflect no photons. The ISL29027 is sensitive enough to detect black ESD foam which reflects only 1% of IR. For biological objects, blonde hair reflects more than brown hair and customers may notice that skin tissue is much more reflective than hair. IR penetrates into the skin and is reflected or scattered back from within. As a result, the proximity count peaks at contact and monotonically decreases as skin moves away. The reflective characteristics of skin are very different from that of paper. A typical IRDR scheme is 220mA amplitude pulses every 800ms, which yields 28μA DC. Total Current Consumption A proximity interrupt event (PROX_FLAG) is governed by the high and low thresholds in registers 3 and 4 (PROX_LT and PROX_HT). PROX_FLAG is set when the measured proximity data is more than the higher threshold X-times-in-a-row (X is set by user; see next paragraph). The proximity interrupt flag is cleared when the prox data is lower than the low proximity threshold X-times-in-a-row, or when the user writes “0” to PROX_FLAG. 8 FN7815.0 February 7, 2011 ISL29027 Typical Circuit Suggested PCB Footprint A typical application for the ISL29027 is shown in Figure 6. The ISL29027’s I2C address is internally hardwired as 0b100010<x>, with x representing the logic state of input I2C address pin ADDR0. The device can be tied onto a system’s I2C bus together with other I2C compliant devices. It is important that users check the “Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead (ODFN) Package” before starting ODFN product board mounting. Soldering Considerations Convection heating is recommended for reflow soldering; directinfrared heating is not recommended. The plastic ODFN package does not require a custom reflow soldering profile, and is qualified to +260°C. A standard reflow soldering profile with a +260°C maximum is recommended. http://www.intersil.com/data/tb/TB477.pdf Layout Considerations The ISL29027 is relatively insensitive to layout. Like other I2C devices, it is intended to provide excellent performance even in significantly noisy environments. There are only a few considerations that will ensure best performance. Route the supply and I2C traces as far as possible from all sources of noise. 0.1µF and 1µF power supply decoupling capacitors need to be placed close to the device. VI2C_PULL-UP R1 10kΩ R2 10kΩ I2C MASTER R3 10kΩ MICROCONTROLLER INT SDA SCL VDD VIR-LED SLAVE_0 C2 0.1µF I2C SLAVE_n SDA SDA 7 SCL SCL 2 VDD C1 1µF SLAVE_1 1 ADDR0 IRDR 8 3 4 INT GND SDA REXT SCL REXT 499kΩ 6 5 ISL29027 FIGURE 6. ISL29027 TYPICAL CIRCUIT 9 FN7815.0 February 7, 2011 ISL29027 Typical Performance Curves 1.0 300 HUMAN EYE 0.9 PROX 0.8 18% GREY CARD 250 PROX COUNTS (8-BIT) NORMALIZED RESPONSE VDD = 3.0V, REXT = 499kΩ 0.7 0.6 0.5 0.4 0.3 0.2 220mA MODE 200 110mA MODE 150 100 WHITE COPY PAPER 50 0.1 0.0 300 0 400 500 600 700 800 900 1000 1100 0 20 40 60 WAVELENGTH (nm) FIGURE 7. ISL29027 SENSITIVITY TO DIFFERENT WAVELENGTHS 80 100 120 DISTANCE (mm) 140 160 180 200 FIGURE 8. PROX COUNTS vs DISTANCE WITH 10CM x 10CM REFLECTOR (USING ISL29028 EVALUATION BOARD) 160 240 120 100 80 PROX (DURING SLEEP MODE) 60 40 2.25 2.40 220mA-MODE (PROX_DR = 1) 220 IIRDR (mA) MEASURED IDD (µA) 140 200 180 160 140 120 2.55 2.70 2.85 3.00 3.15 INPUT VDD (V) 3.30 3.45 3.60 FIGURE 9. VDD vs IDD FOR VARIOUS MODES OF OPERATION 10 100 110mA-MODE (PROX_DR = 0) 0 0.5 1.0 1.5 2.0 2.5 3.0 VIRDR (V) 3.5 4.0 4.5 5.0 FIGURE 10. IRDR PULSE AMPLITUDE vs VIRDR FN7815.0 February 7, 2011 ISL29027 2.00 SENSOR OFFSET 2.10 0.43 1 8 2 7 3 6 0.50 4 5 0.42 FIGURE 11. 8 LD ODFN SENSOR LOCATION OUTLINE - DIMENSIONS IN mm 11 FN7815.0 February 7, 2011 ISL29027 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION 2/7/11 FN7815.0 CHANGE Initial Release. Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL29027 To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff FITs are available from our website at: http://rel.intersil.com/reports/sear For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 12 FN7815.0 February 7, 2011 ISL29027 Package Outline Drawing L8.2.1x2.0 8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 2, 12/10 2.10 A 0.15 B 0.25 6 PIN 1 INDEX AREA 6 PIN 1 INDEX AREA 0.50 2.00 1.50 1.50 0.20±0.05 (2X) 0.10 M C A B 0.10 8X 0 . 35 ± 0 . 05 TOP VIEW 0.75 BOTTOM VIEW SEE DETAIL "X" 2.50 0.10 C 2.10 0.70±0.05 C BASE PLANE SEATING PLANE 0.08 C SIDE VIEW (6x0.50) (1.50) (8x0.20) C (8x0.20) 5 0 . 00 MIN. 0 . 05 MAX. (8x0.55) DETAIL "X" (0.75) TYPICAL RECOMMENDED LAND PATTERN 0 . 2 REF NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.25mm and 0.35mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. 13 FN7815.0 February 7, 2011