Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L10.2.1X3.5E
10 LEAD OPTICAL CO-PACKAGE
Rev 3, 4/15
0.37
A
2.10
0.36
B
PIN # 1
0.37
(0.39)
6
PIN 1
INDEX AREA
0.36
10
0.37
1.24
0.25
1.00
0.20
4
ISL29028
3.50
0.90
0.50
29030
0.49
6
(4X)
5
0.10
0.10 M C A B
0.63
0.63
0.41
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
C
BASE PLANE
SEATING PLANE
0.08 C
0.20
(0.17)
0.68 ± 0.065
SIDE VIEW
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
0.86
PACKAGE
OUTLINE
0.44
0.37
0.03
(0.20)
SIDE VIEW
0.37
1.00
0.15
NOTES:
0.50
0.20
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance: Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.015mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is guaranteed by the
non-symmetry of the package created by the 2 omitted pads.
0.81
2.49
0.44
TYPICAL RECOMMENDED LAND PATTERN
1