APPLICATION NOTE OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN01023 TP97036.2/F5.5 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01023 Abstract This application note describes demo board OM5809. This demo board is designed for customer demonstration of Philips Semiconductors’ TZA3014 and TZA3019 ICs with positive supply voltage in HBCC32 package (SOT560AA1). The application note is limited to information not described in the data sheets. Application information includes schematics and layouts. Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. 2 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01023 APPLICATION NOTE OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN01023 Author: Marc van Laer Philips Semiconductors Systems Laboratory Eindhoven, The Netherlands Keywords Telecom Optical networks SDH, SONET STM16, OC48 CML, PECL Crosspoint Switch LIM MUX Number of pages: 52 Date: 01-05-31 3 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package THIS PAGE IS INTENTIONALLY LEFT BLANK 4 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01023 Introduction This Application note is a short description of the OM5809 demo board. The OM5809 demo board can be used to evaluate the functionality of TZA3014 and TZA3019 at 2.5 Gb/s with positive supply voltage in HBCC32 package (SOT560AA1). Demo board OM5808 can be used to evaluate the functionality of TZA3014 and TZA3019 at 2.5 Gb/s with negative supply voltage in HBCC package (SOT560AA1). This demo board is described in a separate application note. Table 1 gives an overview of the possible options for demo board OM5809. TABLE 1 Options of demo board OM5809 Datarate Gb/s IC type number Type 2.5 TZA3014 Single amplifier 2.5 TZA3019A Dual amplifier 2.5 TZA3019B Dual amplifier 2.5 TZA3019C Dual amplifier Remark 1x LOS output, 1x RSSI output and mute function 2x RSSI outputs 1x LOS output and 1x RSSI output 2x LOS outputs The application note consists of the following sections: 1. Getting started (Block schematic, test possibilities) 2. General (used acronyms, PCB cross section) 3. Schematics, descriptions 4. Measurements 5. Bill of materials 6. Layout and component placement 5 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package THIS PAGE IS INTENTIONALLY LEFT BLANK 6 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01023 TABLE OF CONTENTS 1. Getting started . . . . . . . . . . 1.1 Block diagram . . . . . . 1.2 Overview . . . . . . . . . 1.3 OM5809 Demo board. . . 1.3.1 What to check? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2. General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.1 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.2 Cross section of multi layer PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3. Schematics. . . . . . . . . . . . . . . . . . . 3.1 TZA3014 . . . . . . . . . . . . . . . . 3.1.1 TZA3014 general . . . . . . 3.1.2 Power supply . . . . . . . . 3.1.3 Input & output . . . . . . . . 3.1.4 LOS and RSSI . . . . . . . 3.1.5 S1 settings . . . . . . . . . 3.1.6 S3 settings . . . . . . . . . 3.1.7 Mute . . . . . . . . . . . . . 3.2 Option “A” with TZA3019 . . . . . . . . 3.2.1 Option A: General . . . . . . 3.2.2 Power supply . . . . . . . . 3.2.3 Inputs & outputs . . . . . . . 3.2.4 S1 settings . . . . . . . . . 3.2.5 RSSI1 and RSSI2 . . . . . . 3.3 Option “B” with TZA3019 . . . . . . . . 3.3.1 Option B: General . . . . . . 3.3.2 Description of the application 3.3.3 Power supply . . . . . . . . 3.3.4 Inputs & outputs . . . . . . . 3.3.5 S1 settings . . . . . . . . . 3.3.6 LOS1 and RSSI2 . . . . . . 3.4 Option “C” with TZA3019 . . . . . . . . 3.4.1 Option C: General . . . . . . 3.4.2 Power supply . . . . . . . . 3.4.3 Inputs & outputs . . . . . . . 3.4.4 S1 settings . . . . . . . . . 3.4.5 LOS1 and LOS2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 20 21 21 21 21 21 21 21 22 23 23 23 23 23 24 25 25 25 25 25 25 26 27 27 27 27 27 4. Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Measurement of testboard with semirigid connections . . . 4.2 Measurement of OM5809 demoboard . . . . . . . . . . . 4.3 Crosstalk on demoboard OM5809 between Ch1 and Ch2 . 4.4 Output waveforms measured on OM5809 demoboard . . . 4.5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.1 TZA3019, output: 200 mV. . . . . . . . . . . . 4.5.2 TZA3019, output: 800 mV. . . . . . . . . . . . 4.6 Eye pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 30 31 32 33 34 34 34 35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13 14 15 15 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 4.6.1 4.6.2 Application Note AN01023 Input signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Output signal 800 mV pp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5. Bill of materials . . . . . . . . 5.1 TZA3014 . . . . . . . . 5.2 TZA3019 “A” option . . . 5.3 TZA3019 “B” option . . . 5.4 TZA3019 “C” option. . . 5.5 Layout considerations . 5.6 Thermal considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 37 38 40 42 43 43 6. Layouts. . . . . . . . . . . . . . . . . . . . . . . . 6.1 Silk screen (top) . . . . . . . . . . . . . . . 6.2 Top layer component placement . . . . . . . 6.3 Top layer copper, inverted . . . . . . . . . . 6.4 First inner layer copper, inverted . . . . . . . 6.5 Second inner layer copper, inverted . . . . . 6.6 Bottom layer copper, inverted . . . . . . . . 6.7 Bottom component placement (bottom view) . 6.8 Silk screen (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 45 46 47 48 49 50 51 52 8 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01023 LIST OF TABLES TABLE 1 TABLE 2 TABLE 3 TABLE 4 TABLE 5 TABLE 6 TABLE 7 TABLE 8 TABLE 9 TABLE 10 TABLE 11 TABLE 12 Options of demo board OM5809 . . . . . . . . . . . . . . . . . . . . . . . . . Demo board options for TZA3014 & TZA3019 described in this application note Other demo board for TZA3014 & TZA3019 . . . . . . . . . . . . . . . . . . . Settings of switch S1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Settings of switch S2 and S3 . . . . . . . . . . . . . . . . . . . . . . . . . . . Settings of switch S1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Settings of switch S1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Settings of switch S2 and S3 . . . . . . . . . . . . . . . . . . . . . . . . . . . Bill of materials TZA3014, sorted by reference . . . . . . . . . . . . . . . . . . Bill of materials TZA3019A, sorted by reference . . . . . . . . . . . . . . . . . Bill of materials TZA3019B, sorted by reference . . . . . . . . . . . . . . . . . Bill of materials TZA3019C, sorted by reference . . . . . . . . . . . . . . . . . 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 14 14 23 23 25 27 27 37 38 40 42 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package THIS PAGE IS INTENTIONALLY LEFT BLANK 10 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01023 LIST OF FIGURES Fig.1 Fig.2 Fig.3 Fig.4 Fig.5 Fig.6 Fig.7 Fig.8 Fig.9 Fig.10 OM5809 demo board block diagram . . . . . . . . . . . . . . . . . OM5809 demo board . . . . . . . . . . . . . . . . . . . . . . . . . Cross section of multi layer PCB . . . . . . . . . . . . . . . . . . . Schematic of OM5809 demo board with all options, positive supply . Schematic of OM5809 demo board with TZA3014 . . . . . . . . . . Schematic of OM5809 demo board with TZA3019A . . . . . . . . . Schematic of OM5809 demo board with TZA3019B . . . . . . . . . Schematic of OM5809 demo board with TZA3019C . . . . . . . . . Measurement setup of gain transfer characteristic . . . . . . . . . . Measurement setup of output waveforms . . . . . . . . . . . . . . 11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 15 18 19 20 22 24 26 29 33 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package THIS PAGE IS INTENTIONALLY LEFT BLANK 12 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 1. 1.1 Application Note AN01023 Getting started Block diagram Power connection, decoupling & over voltage protection TZA3014 VCC1A Local decoupling Local decoupling LOSTH1 VCC1B TTL LOS1 SMB RSSI1 INV1 S1 1 2 output level adjustment LEVEL1 IN1 SMA SMA SMA OUT1 SMA A1 VREF IN2 SMA SMA S2 2 1 A2 VREF SMA SMA OUT2 output level LEVEL2 adjustment INV2 RSSI2 SMB TTL LOS2 LOSTH2 Local VCC2A decoupling TZA3019 Fig.1 OM5809 demo board block diagram 13 Local decoupling VCC2B Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 1.2 Application Note AN01023 Overview Table 2 shows the options of demo board OM5809 described in this application note. TABLE 2 Demo board options for TZA3014 & TZA3019 described in this application note Demo board No. IC type Package Supply Remark Application note OM5809 TZA3014 HBCC32 +3.3 Volt single limiter 1x RSSI & 1x LOS AN01023 OM5809 TZA3019A HBCC32 +3.3 Volt dual limiter 2x RSSI AN01023 OM5809 TZA3019B HBCC32 +3.3 Volt dual limiter 1x RSSI & 1x LOS AN01023 OM5809 TZA3019C HBCC32 +3.3 Volt dual limiter 2 LOS AN01023 Table 3 shows the options of demo board OM5808. This demo board is described in a separate application note. TABLE 3 Other demo board for TZA3014 & TZA3019 Demo board No. IC type Package Supply OM5808 TZA3014 HBCC32 -3.3 Volt OM5808 TZA3019A HBCC32 -3.3 Volt OM5808 TZA3019B HBCC32 -3.3 Volt OM5808 TZA3019C HBCC32 -3.3 Volt 14 Remark single limiter 1x RSSI & 1x LOS dual limiter 2x RSSI dual limiter 1x RSSI & 1x LOS dual limiter 2 LOS Application note AN01022 AN01022 AN01022 AN01022 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 1.3 Application Note AN01023 OM5809 Demo board Power 3.3 Volt OM5809 OUT1 IN1 Solder jumpers INQ1 OUTQ1 IN2 OUT2 INQ2 OUTQ2 Option check box TZA3014 TZA3019 A B C Fig.2 OM5809 demo board 1.3.1 What to check? • First check the ”option check box” on the demo board for the IC type and application. • Connecting the power: check the polarity of the power supply, adjust current limit to 400mA. Although the demo board is protected against over voltage and wrong polarity, the supply current has to be limited. • Check if solder jumper J1 & J2 are configured as follows: TZA3014: default the mute function is used, R5 has to be connected to VCC using J1. Solder jumper J2 is left open (S1-1 is switched off and S3 must be switched on). TZA3019A: both solder jumpers J1 & J2 are left open. TZA3019B: default the “auto switch” function is used, R5 has to be connected to VCC using J1. Solder jumper J2 is left open (S1-1 and S1-2 are switched off). TZA3019C: Default the LEDs, D6 and D1, are used to observe the LOS outputs. The LEDs have to be connected to VCC using J1 and J2. 15 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package THIS PAGE IS INTENTIONALLY LEFT BLANK 16 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 2. General 2.1 Acronyms • 2.5 Gbps 2,488,320 kbps • 2.5 GHz 2,488,320 kHz • 2G5 2.5 GHz • Cu Copper • GND Ground • HBCC Plastic, exposed diepad Bump Chip Carrier • HTQFP Plastic, exposed diepad Thin Quad Flat Package • IC Integrated Circuit • LOS Loss Of Signal • LOSTH Loss threshold • MUX Multiplexer • PCB Printed Circuit Board • Pxxx Identification label for pins, buses and connectors • ..Q indication for inverted signal • RSSI Receive Signal Strength Indicator • SDH Synchronous Digital Hierarchy • SMA RF connector 50 ohm system impedance • SMB Small outline DC connectors • SMD Surface Mounted Device • SONET Synchronous Optical Networks • STM 16 Synchronous Transport Module no. 16 • TZA Type number indication 17 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 2.2 Application Note AN01023 Cross section of multi layer PCB TOP Units: µm Material: FR4, Er = 4.3 Microstrip: 50 Ohm Signal: microstrip single (not coupled): width = 800 microstrip differential (coupled, odd mode): width = 400, Clearance = 200 Layer 1 GND, Signal 17 Cu 450 Layer 2 GND 35 Cu 700 Layer 3 35 Cu GND 450 17 Cu Layer 4 GND, Signal BOTTOM Fig.3 Cross section of multi layer PCB 18 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 3. Application Note AN01023 Schematics For reading convenience the schematics are printed opposite of the description, therefore some information will be duplicated. P11 1 2 3 NC GND 3.3V LOS1 L12 C41 10nF BD8.9_3_3-4S2 C1 100uF 6.3V Z1 5V1 VCC=3.3V BZX79C P10 LOS1 VCC R5 C12 J1 56k 100nF VCC D6 VCC GREEN 8 7 6 5 RSSI2 1 2 3 4 S1 P9 RSSI2 R10 1 2 3 4 J2 56k VCC LOS1 D1 RED C4 L9 GND 25 LOS2/RSSI2 26 S2 30 2 IN1 LOS1/RSSI1 27 10nF INV2 28 1 VCC C22 INV1 29 BLM11P300S 10nF P5 C5 10nF L8 BLM11P300S C19 GND 32 P6 10nF R24 0 S1 31 VCC R22 0 24 VCC C43 10nF P3 OUT1 23 3 IN1Q OUT1Q 22 4 VCC VCC 21 IC1 VCC C44 10nF P4 TZA3019 / TZA3014 5 VCC VCC 20 6 IN2 OUT2 19 C45 10nF 7 IN2Q 16 GND 15 TEST 14 VREF 13 LEVEL2 C20 10nF 12 LEVEL1 L11 BLM11P300S C2 BLM11P300S C3 10nF 10nF R23 RSSI2 0 R1 0 C29 10nF S3 S2 NC R3 0 R13 100k NC R2 0 R17 33k R18 33k R14 100k R15 100k R16 100k L13 VCC P2 17 VCC L10 VCC NC P7 8 VCC 11 LOSTH2 10nF C46 10nF OUT2Q 18 10 LOSTH1 C21 9 GND P8 P1 BLM11P300S C47 10nF Fig.4 Schematic of OM5809 demo board with all options, positive supply 19 VCC Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 3.1 Application Note AN01023 TZA3014 P11 NC GND 3.3V 1 2 3 L12 C41 10nF VCC=3.3V VCC BD8.9_3_3-4S2 C1 100uF 6.3V Z1 5V1 BZX79C C12 100nF P10 LOS P9 RSSI R5 56k VCC D6 R22 0 J1 VCC GREEN Solder joint for “mute” function 8 7 6 5 1 2 3 4 S1 1 2 3 4 C4 C22 10nF GND 25 RSSI 26 LOS 27 28 30 INV1 29 1 VCC S1 31 C19 10nF 24 VCC OUT1Q 22 3 IN1Q 4 VCC VCC 21 IC1 TZA3014 19 7 18 16 17 15 13 14 VREF 6 12 LEVEL1 20 11 5 8 S3 NC R17 33k decision level adjustment R13 100k R15 output level adjustment 100k L13 VCC BLM11P300S C47 10nF Fig.5 Schematic of OM5809 demo board with TZA3014 20 VCC C43 10nF OUT1 23 2 IN1 10 LOSTH1 P5 BLM11P300S 9 P6 BLM11P300S GND 32 VCC C5 10nF L8 10nF L9 C44 10nF P3 P4 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 3.1.1 Application Note AN01023 TZA3014 general The TZA3014 is a 2.5 Gb/s postamplifier with a digital Loss Of Signal detector and a Received Signal Strength Indicator. 3.1.2 Power supply P11-1: not connected, P11-2: GND, P11-3: 3.3 Volt. C1, C41, L12 and C12 are decoupling networks for the power supply. Z1 is added to protect the circuit against over voltage. C4 & L9 and C5 & L8 are local decoupling networks. C47 & L13 is a decoupling network to obtain a clean supply for the output level and decision level adjustment. 3.1.3 Input & output The TZA3014 has a differential input which is AC coupled (C19 and C22). The input signal should be connected to the SMA connectors P5 & P6. The output of the TZA3014 is differential and is AC coupled (C43 and C44), the output should be connected to SMA connectors P3 and P4. With R15 (LEVEL1) the output level can be adjusted. 3.1.4 LOS and RSSI On the TZA3014, the digital Loss Of Signal output (LOS) is available on pin 27. The Received Signal Strength Indicator (RSSI) is available on pin 26. These outputs can be observed at SMB connectors P10 (LOS) and P9 (RSSI). LOS: if the input signal level is below the threshold level, LOS1 (pin 27) will be high. When D6 is connected to VCC, using solder jumper J1, the green LED will extinguish. If the LED is not used, resistor R5 has to be connected to VCC (J1) as load for pin 27. 3.1.5 S1 settings When the mute function is used, switch S1-1 has to be switched off, if S1-1 is switched on the TZA3014 is muted permanently. With switch S1-3 it is possible to invert output1. 3.1.6 S3 settings With switch S3 the Loss Of Signal detector and the Received Signal Strength Indicator can be switched in active or in power down mode. If S3 is switched to active mode, the decision level of the input level detector can be adjusted by resistor network R13 + R17. Note: when the LOS and RSSI outputs are not used (S3 switched off), R22 has to be removed otherwise the TZA3014 is muted permanently. 3.1.7 Mute The TZA3014 has a mute function. The LOS output (pin 27) has to be connected to S1 (pin 31) via R22. When the input signal is below the LOSTH1, the LOS output (pin27) will be high which forces S1 (pin 31) to be high. When S1 (pin 31) is high the TZA3014 is muted. Note: when the mute function is used, switch S1-1 has to be switched off and the LOS and RSSI (S3) must be in active mode. 21 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Option “A” with TZA3019 P11 NC GND 3.3V 1 2 3 L12 C41 10nF VCC=3.3V C12 C1 100uF 6.3V Z1 5V1 BZX79C P10 RSSI1 VCC BD8.9_3_3-4S2 100nF VCC P9 RSSI2 8 7 6 5 1 2 3 4 S1 1 2 3 4 C4 P5 C22 10nF GND 25 RSSI2 26 RSSI1 27 INV2 28 1 VCC INV1 29 C19 10nF S2 30 BLM11P300S S1 31 P6 BLM11P300S GND 32 VCC C5 10nF L8 10nF L9 VCC C43 10nF 24 VCC C44 10nF P3 P4 OUT1 23 2 IN1 OUT1Q 22 3 IN1Q 4 VCC VCC 21 IC1 TZA3019A 6 IN2 OUT2 19 16 GND 15 TEST 17 VCC C46 10nF L10 L11 BLM11P300S C2 NC VCC 14 VREF C20 10nF 13 LEVEL2 8 VCC C45 10nF OUT2Q 18 12 LEVEL1 7 IN2Q C21 10nF 11 LOSTH2 P7 VCC 20 10 LOSTH1 P8 5 VCC 9 GND 3.2 Application Note AN01023 BLM11P300S C3 10nF 10nF S3 NC R3 0 S2 NC R2 0 R15 100k R16 100k L13 VCC BLM11P300S C47 10nF output level adjustment Fig.6 Schematic of OM5809 demo board with TZA3019A 22 VCC P1 P2 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 3.2.1 Application Note AN01023 Option A: General The TZA3019 is a 2.5 Gb/s dual postamplifier. Option “A” has two Received Signal Strength Indicators. 3.2.2 Power supply P11-1: not connected, P11-2: GND, P11-3: 3.3 Volt C1, C41, L12 and C12 are decoupling networks for the power supply. Z1 is added to protect the circuit against over voltage. C4 & L9, C5 & L8, C2 & L10 and C3 & L11 are local decoupling networks. C47 & L13 is a decoupling network to obtain a clean supply for the output level and decision level adjustment. 3.2.3 Inputs & outputs The TZA3019A has two differential inputs which are AC coupled (C19, C22, C21 and C20). The input signals should be connected to the SMA connectors P5 & P6 and P7 & P8. The two outputs of the TZA3019A are differential and they are also AC coupled (C43, C44, C45 and C46), the outputs should be connected to SMA connectors P3 & P4 and P1 & P2. With R15 (LEVEL1) and R16 (LEVEL2) the output level of each output can be adjusted. 3.2.4 S1 settings By setting S1 the output configuration can be chosen. For each output, the input can be selected (S1-1 & S1-2). It is also possible to invert the outputs (S1-3 & S1-4). Table 4 gives an overview of the possible S1 settings. TABLE 4 S1-1 off on 3.2.5 Settings of switch S1 OUT1 S1-2 OUT2 input 1 off input 2 input 2 on input 1 S1-3 off on OUT1 OUT1 OUT1Q S1-4 off on OUT2 OUT2 OUT2Q RSSI1 and RSSI2 Option “A” has two Received Signal Strength Indicators. RSSI1 at pin 27 and RSSI2 at pin 26. These outputs can be observed at SMB connectors P10 (RSSI1) and P9 (RSSI2). With S2 and S3 is it possible to set the Received Signal Strength Indicator in active or power down mode, this is shown in table 5. If pin 10 & 11 are connected to GND or left open, RSSI will be in power down mode. If pin 10 & 11 are above GND, RSSI 1 & 2 are active. TABLE 5 S2 off on Settings of switch S2 and S3 LOS1 S3 LOS2 power down off power down active on active 23 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 3.3 Application Note AN01023 Option “B” with TZA3019 P11 NC GND 3.3V 1 2 3 L12 C41 VCC BD8.9_3_3-4S2 10nF Z1 5V1 VCC=3.3V BZX79C LOS1 C12 C1 100uF 6.3V P10 LOS1 100nF VCC R5 5 6 7 8 56k VCC 1 2 3 4 S1 J1 Solder joint for “auto switch” function RSSI2 1 2 3 4 P9 RSSI2 LOS1 R22 0 C4 L9 P5 C22 10nF GND 25 RSSI2 26 LOS1 27 INV2 28 1 VCC INV1 29 10nF S2 30 BLM11P300S C19 S1 31 P6 C5 10nF L8 BLM11P300S GND 32 VCC R24 0 10nF VCC C43 10nF 24 VCC C44 10nF P3 P4 OUT1 23 2 IN1 OUT1Q 22 3 IN1Q 4 VCC VCC 21 IC1 TZA3019B 6 IN2 OUT2 19 VCC 16 GND 15 TEST 14 VREF 13 LEVEL2 17 VCC C46 10nF L11 L10 BLM11P300S C2 NC 10nF 12 LEVEL1 8 VCC C20 C45 10nF OUT2Q 18 11 LOSTH2 7 IN2Q C21 10nF 10 LOSTH1 P7 VCC 20 9 GND P8 5 VCC BLM11P300S C3 10nF 10nF R23 R1 0 RSSI2 0 C29 10nF R15 100k R16 100k output level adjustment L13 VCC BLM11P300S C47 10nF Fig.7 Schematic of OM5809 demo board with TZA3019B 24 VCC P1 P2 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 3.3.1 Application Note AN01023 Option B: General The TZA3019 is a 2.5 Gb/s dual postamplifier. Option “B” has one digital Loss Of Signal detector and one Received Signal Strength Indicator. In this application the strongest input signal will be switched to output1 and the weakest to output2. 3.3.2 Description of the application When the “auto switch” function is used, the RSSI of input2 must be in active mode and R5 must be connected to VCC using solder jumper J1. The signal strength of input2 sets the LOSTH1 of input1. When the input signal of IN1 is above the threshold level, LOS1 (pin 27) will be low. This forces S1 & S2 (pin 31 & 30) to be low. Now OUT1 is connected to IN1 and OUT2 is connected to IN2. If the input signal of IN1 is below the threshold level LOS1 (pin 27) will be high. Now S1 & S2 (pin 31 & 30) are forced to be high, OUT1 will be connected to IN2 and OUT2 will be connected to IN1. 3.3.3 Power supply P11-1: not connected, P11-2: GND, P11-3: 3.3 volt. C1, C41, L12 and C12 are decoupling networks for the power supply. Z1 is added to protect the circuit against over voltage. C4 & L9, C5 & L8, C2 & L10 and C3 & L11 are local decoupling networks. C47 & L13 is a decoupling network to obtain a clean supply for the output level and decision level adjustment. 3.3.4 Inputs & outputs The TZA3019B has two differential inputs which are AC coupled (C19, C22, C21 and C20). The input signals should be connected to the SMA connectors P5 & P6 and P7 & P8. The two outputs of the TZA3019B are differential and they are also AC coupled (C43, C44, C45 and C46), the outputs should be connected to SMA connectors P3 & P4 and P1 & P2. With R15 (LEVEL1) and R16 (LEVEL2) the output level of each output can be adjusted. 3.3.5 S1 settings By setting S1 the output configuration can be chosen. For each output, the input can be selected (S1-1 & S1-2). It is also possible to invert the outputs (S1-3 & S1-4). Table 6 gives an overview of the possible S1 settings. TABLE 6 S1-1 off on Settings of switch S1 OUT1 S1-2 OUT2 input 1 off input 2 input 2 on input 1 S1-3 off on OUT1 OUT1 OUT1Q S1-4 off on OUT2 OUT2 OUT2Q Note: when the “auto switch” function is used S1-1 and S1-2 must be switched off. 3.3.6 LOS1 and RSSI2 Option “B” has one digital Loss Of Signal output and one Received Signal Strength Indicator. LOS1 at pin 27 and RSSI2 at pin 26. These outputs can be observed at SMB connectors P10 (LOS1) and P9 (RSSI2). If pin 11 is connected to GND or left open the Received Signal Strength Indicator will be in power down mode. If pin 11 is above GND, the RSSI is active. In this application the input (pin11) is biased with R1. 25 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Option “C” with TZA3019 P11 NC GND 3.3V P10 LOS1 1 2 3 R5 L12 C41 10nF BZX79C VCC D6 C12 C1 100uF 6.3V Z1 5V1 VCC=3.3V J1 56k VCC BD8.9_3_3-4S2 Solder joint for 100nF VCC LED or R5 GREEN P9 LOSI2 8 7 6 5 1 2 3 4 R10 Solder joint for LED or R10 J2 56k S1 VCC D1 1 2 3 4 RED C5 10nF L8 C4 10nF L9 P5 C22 10nF GND 25 LOS2 26 LOS1 27 INV2 28 1 VCC S2 30 C19 10nF INV1 29 BLM11P300S S1 31 P6 BLM11P300S GND 32 VCC VCC C43 10nF 24 VCC C44 10nF P3 P4 OUT1 23 2 IN1 OUT1Q 22 3 IN1Q 4 VCC VCC 21 IC1 TZA3019C 6 IN2 OUT2 19 7 IN2Q 10nF 16 GND 15 TEST 14 VREF 13 LEVEL2 8 VCC C20 C45 10nF OUT2Q 18 12 LEVEL1 C21 10nF 11 LOSTH2 17 VCC C46 10nF L10 VCC L11 BLM11P300S C2 NC P7 VCC 20 10 LOSTH1 P8 5 VCC 9 GND 3.4 Application Note AN01023 10nF NC R13 100k NC R18 33k R17 33k decision level adjustment 10nF S2 S3 BLM11P300S C3 R14 100k R16 R15 100k 100k output level adjustment L13 VCC BLM11P300S C47 10nF Fig.8 Schematic of OM5809 demo board with TZA3019C 26 VCC P1 P2 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 3.4.1 Application Note AN01023 Option C: General The TZA3019 is a 2.5 Gb/s dual postamplifier. Option “C” has two digital Loss Of Signal detectors. 3.4.2 Power supply P11-1: not connected, P11-2: GND, P11-3: 3.3 Volt. C1, C41, L12 and C12 are decoupling networks for the power supply. Z1 is added to protect the circuit against over voltage. C4 & L9, C5 & L8, C2 & L10 and C3 & L11 are local decoupling networks. C47 & L13 is a decoupling network to obtain a clean supply for the output level and decision level adjustment. 3.4.3 Inputs & outputs The TZA3019C has two differential inputs which are AC coupled (C19, C22, C21 and C20). The input signals should be connected to the SMA connectors P5 & P6 and P7 & P8. The two outputs of the TZA3019C are differential and they are also AC coupled (C43, C44, C45 and C46), the outputs should be connected to SMA connectors P3 & P4 and P1 & P2. With R15 (LEVEL1) and R16 (LEVEL2) the output level of each output can be adjusted. 3.4.4 S1 settings By setting S1 the output configuration can be chosen. For each output, the input can be selected (S1-1 & S1-2). It is also possible to invert the outputs (S1-3 & S1-4). Table 7 gives an overview of the possible S1 settings. TABLE 7 S1-1 off on 3.4.5 Settings of switch S1 OUT1 S1-2 OUT2 input1 off input2 input2 on input1 S1-3 off on OUT1 OUT1 OUT1Q S1-4 off on OUT2 OUT2 OUT2Q LOS1 and LOS2 Option “C” has two digital Loss Of Signal outputs. LOS1 at pin 27 and LOS2 at pin 26. These outputs can be observed at SMB connectors P10 (LOS1) and P9 (LOS2). When the input signal level of IN1 is below the threshold level (LOSTH1), the LOS1 output will be high (pin 27) and D6 will extinguish. When the input signal level of IN2 is below the threshold level (LOSTH2), the LOS2 output will be high (pin 26) and D1 will extinguish. The LEDs, D1 and D6, have to be connected to VCC using solder jumpers J1 & J2. If the LEDs are not used, the resistors R5 & R10 have to be connected to VCC (J1 & J2). With S2 and S3 is it possible to set the Loss Of Signal detectors in active or power down mode this is shown in table 8. The decision level of the input level detectors can be adjusted by resistor networks R13 + R17 (LOSTH1) and R14 + R18 (LOSTH2). TABLE 8 S2 off on Settings of switch S2 and S3 LOS1 S3 LOS2 power down off power down active on active 27 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package THIS PAGE IS INTENTIONALLY LEFT BLANK 28 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 4. Application Note AN01023 Measurements Network Analyser HP 87530 Port1 Port2 IN1 IN1Q OUT1 OUT1Q 50 Ohm 50 Ohm DUT OM5809 with TZA3019 50 Ohm 50 Ohm OUT2 OUT2Q IN2 IN2Q 50 Ohm 50 Ohm Fig.9 Measurement setup of gain transfer characteristic 29 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 4.1 CH1 Application Note AN01023 Measurement of testboard with semirigid connections S 21 &M log MAG 3 dB/ 22 Dec 1999 12:32:10 REF 14.59 dB 2_:-16.427 dB 1 676.937 501 MHz REF= A 1_:-13.448 dB 0 Hz Cor B 1 2 START 50.000 000 MHz STOP 5 000.000 000 MHz Input: 50 mV A: output 800 mV B: output 200 mV 30 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 4.2 CH1 Application Note AN01023 Measurement of OM5809 demoboard S 21 &M log MAG 3 dB/ 22 Dec 1999 13:27:46 REF 15.74 dB 2_:-16.652 dB 1 592.278 224 MHz REF= A 1_:-13.676 dB 0 Hz Cor MARKER 2-ofs 1.592278224 GHz B 1 2 START 50.000 000 MHz STOP 5 000.000 000 MHz Input: 50 mV A: output 800 mV B: output 200 mV 31 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 4.3 CH1 Application Note AN01023 Crosstalk on demoboard OM5809 between Ch1 and Ch2 S 21 &M log MAG 10 dB/ 23 Dec 1999 12:57:34 REF 15.68 dB 2_:-62.634 dB 1 599.936 922 MHz * REF= Ch1 1_:-80.621 dB 0 Hz Cor 2 Ch2 1 START 50.000 000 MHz STOP 5 000.000 000 MHz • The same setup as shown in figure 9 was used to measure the crosstalk on the demoboard between channel1 and channel2. • S1-1 was set in “on” position to measure the output of channel2. 32 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 4.4 Application Note AN01023 Output waveforms measured on OM5809 demoboard Pattern generator ADVANTEST D3186 20 dB 20 dB Trigger IN1 IN1Q Communication Analyser HP83480A OUT1 OUT1Q DUT OM5809 with TZA3019 50 Ohm 50 Ohm OUT2 OUT2Q IN2 IN2Q 50 Ohm 50 Ohm Fig.10 Measurement setup of output waveforms 33 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 4.5 Waveforms 4.5.1 TZA3019, output: 200 mV 4.5.2 TZA3019, output: 800 mV Note: HP70841B pattern generator was used for these measurements. 34 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 4.6 Eye pattern 4.6.1 Input signal 4.6.2 Output signal 800 mV pp 35 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package THIS PAGE IS INTENTIONALLY LEFT BLANK 36 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 5. Bill of materials 5.1 TZA3014 TABLE 9 Bill of materials TZA3014, sorted by reference REF Part number Comp Series Vendor C1 B45196H1107M9 100u B45196 SIEMENS C4 2222-916-16736 10n X7R PHILIPS C5 2222-916-16736 10n X7R PHILIPS C12 2222-786-16749 100n X7R PHILIPS C19 2222-916-16736 10n X7R PHILIPS C22 2222-916-16736 10n X7R PHILIPS C41 2222-916-16736 10n X7R PHILIPS C43 2222-916-16736 10n X7R PHILIPS C44 2222-916-16736 10n X7R PHILIPS C47 2222-916-16736 10n X7R PHILIPS D6 HLMP6400-011 GREEN Diffused_Lens FARNELL IC1 PN-TZA3014 TZA3014 IC_Universal PHILIPS L8 BLM11P300S BLM11P300S CBD muRata L9 BLM11P300S BLM11P300S CBD muRata L12 4330-030-36301 BD8.933-4S2 CBD PHILIPS L13 BLM11P300S BLM11P300S CBD muRata P3 142-0701-851 SMA_sqr COAX EF.Johnson P4 142-0701-851 SMA_sqr COAX EF.Johnson P5 142-0701-851 SMA_sqr COAX EF.Johnson P6 142-0701-851 SMA_sqr COAX EF.Johnson P9 R114426 SMB_str COAX RADIALL P10 R114426 SMB_str COAX RADIALL P11 3833-1-0-303 MKS3830_3p MKS3830 STOCKO R5 2322-702-60563 56k RC21 PHILIPS R17 2322-702-60333 33k RC21 PHILIPS R13 3006P-7-104BRN 100k 3006P BOURNS R15 3006P-7-104BRN 100k 3006P BOURNS R22 2322-702-96001 0 RC21 PHILIPS S1 2422-120-00551 DIP-SW_4 print_switch HONYWELL S3 09-03-201-02 SPDT print_switch SPOERLE Z1 9331-177-20153 BZX79C BZX79C PHILIPS 8222-411-48331 PR48331 PS-SLE 37 Application Note AN01023 Tolerance 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% Rating 6.3V 25V 25V 16V 25V 25V 25V 25V 25V 25V 5% 5% 10% 10% 0.063W 0.063W 0.75W 0.75W 5V1 Geom B45_d C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 SMDLED SOT560AA1 BLM11 BLM11 CBD8.9 BLM11 SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMB_str SMB_str 3830_3p R0603 R0603 BO3006P BO3006P R0603 SWITCH_4 Low Prof. SOD27 BOARD Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 5.2 Application Note AN01023 TZA3019 “A” option TABLE 10 Bill of materials TZA3019A, sorted by reference REF Part number Comp Series Vendor C1 B45196H1107M9 100u B45196 SIEMENS C2 2222-916-16736 10n X7R PHILIPS C3 2222-916-16736 10n X7R PHILIPS C4 2222-916-16736 10n X7R PHILIPS C5 2222-916-16736 10n X7R PHILIPS C12 2222-786-16749 100n X7R PHILIPS C19 2222-916-16736 10n X7R PHILIPS C20 2222-916-16736 10n X7R PHILIPS C21 2222-916-16736 10n X7R PHILIPS C22 2222-916-16736 10n X7R PHILIPS C41 2222-916-16736 10n X7R PHILIPS C43 2222-916-16736 10n X7R PHILIPS C44 2222-916-16736 10n X7R PHILIPS C45 2222-916-16736 10n X7R PHILIPS C46 2222-916-16736 10n X7R PHILIPS C47 2222-916-16736 10n X7R PHILIPS IC1 PN-TZA3019A TZA3019A IC_Universal PHILIPS L8 BLM11P300S BLM11P300S CBD muRata L9 BLM11P300S BLM11P300S CBD muRata L10 BLM11P300S BLM11P300S CBD muRata L11 BLM11P300S BLM11P300S CBD muRata L12 4330-030-36301 BD8.933-4S2 CBD PHILIPS L13 BLM11P300S BLM11P300S CBD muRata P1 142-0701-851 SMA_sqr COAX EF.Johnson P2 142-0701-851 SMA_sqr COAX EF.Johnson P3 142-0701-851 SMA_sqr COAX EF.Johnson P4 142-0701-851 SMA_sqr COAX EF.Johnson P5 142-0701-851 SMA_sqr COAX EF.Johnson P6 142-0701-851 SMA_sqr COAX EF.Johnson P7 142-0701-851 SMA_sqr COAX EF.Johnson P8 142-0701-851 SMA_sqr COAX EF.Johnson P9 R114426 SMB_str COAX RADIALL P10 R114426 SMB_str COAX RADIALL P11 3833-1-0-303 MKS3830_3p MKS3830 STOCKO R2 2322-702-96001 0 RC21 PHILIPS R3 2322-702-96001 0 RC21 PHILIPS R15 3006P-7-104BRN 100k 3006P BOURNS 38 Tolerance 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% Rating 6.3V 25V 25V 25V 25V 16V 25V 25V 25V 25V 25V 25V 25V 25V 25V 25V 10% 0.063W 0.063W 0.75W Geom B45_d C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 SOT560AA1 BLM11 BLM11 BLM11 BLM11 CBD8.9 BLM11 SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMB_str SMB_str 3830_3p R0603 R0603 BO3006P Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package TABLE 10 Bill of materials TZA3019A, sorted by reference REF Part number Comp Series Vendor R16 3006P-7-104BRN 100k 3006P BOURNS S1 2422-120-00551 DIP-SW_4 print_switch HONYWELL S2 09-03201-02 SPDT print_switch SPOERLE S3 09-03201-02 SPDT print_switch SPOERLE Z1 9331-177-20153 BZX79C BZX79C PHILIPS 8222-411-48331 PR48331 PS-SLE 39 Tolerance 10% Application Note AN01023 Rating 0.75W 5V1 Geom BO3006P SWITCH_4 Low prof. Low prof. SOD27 BOARD Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 5.3 Application Note AN01023 TZA3019 “B” option TABLE 11 Bill of materials TZA3019B, sorted by reference REF Part number Comp Series Vendor C1 B45196H1107M9 100u B45196 SIEMENS C2 2222-916-16736 10n X7R PHILIPS C3 2222-916-16736 10n X7R PHILIPS C4 2222-916-16736 10n X7R PHILIPS C5 2222-916-16736 10n X7R PHILIPS C12 2222-786-16749 100n X7R PHILIPS C19 2222-916-16736 10n X7R PHILIPS C20 2222-916-16736 10n X7R PHILIPS C21 2222-916-16736 10n X7R PHILIPS C22 2222-916-16736 10n X7R PHILIPS C41 2222-916-16736 10n X7R PHILIPS C43 2222-916-16736 10n X7R PHILIPS C44 2222-916-16736 10n X7R PHILIPS C45 2222-916-16736 10n X7R PHILIPS C46 2222-916-16736 10n X7R PHILIPS C47 2222-916-16736 10n X7R PHILIPS IC1 PN-TZA3019B TZA3019B IC_Universal PHILIPS L8 BLM11P300S BLM11P300S CBD muRata L9 BLM11P300S BLM11P300S CBD muRata L10 BLM11P300S BLM11P300S CBD muRata L11 BLM11P300S BLM11P300S CBD muRata L12 4330-030-36301 BD8.933-4S2 CBD PHILIPS L13 BLM11P300S BLM11P300S CBD muRata P1 142-0701-851 SMA_sqr COAX EF.Johnson P2 142-0701-851 SMA_sqr COAX EF.Johnson P3 142-0701-851 SMA_sqr COAX EF.Johnson P4 142-0701-851 SMA_sqr COAX EF.Johnson P5 142-0701-851 SMA_sqr COAX EF.Johnson P6 142-0701-851 SMA_sqr COAX EF.Johnson P7 142-0701-851 SMA_sqr COAX EF.Johnson P8 142-0701-851 SMA_sqr COAX EF.Johnson P9 R114426 SMB_str COAX RADIALL P10 R114426 SMB_str COAX RADIALL P11 3833-1-0-303 MKS3830_3p MKS3830 STOCKO R1 2322-702-96001 0 RC21 PHILIPS R5 2322-702-60563 56k RC21 PHILIPS R15 3006P-7-104BRN 100k 3006P BOURNS 40 Tolerance 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% Rating 6.3V 25V 25V 25V 25V 16V 25V 25V 25V 25V 25V 25V 25V 25V 25V 25V 5% 10% 0.063W 0.063W 0.75W Geom B45_d C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 SOT560AA1 BLM11 BLM11 BLM11 BLM11 CBD8.9 BLM11 SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMB_str SMB_str 3830_3p R0603 R0603 BO3006P Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package TABLE 11 Bill of materials TZA3019B, sorted by reference REF Part number Comp Series Vendor R16 3006P-7-104BRN 100k 3006P BOURNS R22 2322-702-96001 0 RC21 PHILIPS R23 2322-702-96001 0 RC21 PHILIPS R24 2322-702-96001 0 RC21 PHILIPS S1 2422-120-00551 DIP-SW_4 print_switch HONYWELL Z1 9331-177-20153 BZX79C BZX79C PHILIPS 8222-411-48331 PR48331 PS-SLE 41 Application Note AN01023 Tolerance Rating 10% 0.75W 0.063W 0.063W 0.063W 5V1 Geom BO3006P R0603 R0603 R0603 SWITCH_4 SOD27 BOARD Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 5.4 Application Note AN01023 TZA3019 “C” option TABLE 12 Bill of materials TZA3019C, sorted by reference REF Part number Comp Series Vendor C1 B45196H1107M9 100u B45196 SIEMENS C2 2222-916-16736 10n X7R PHILIPS C3 2222-916-16736 10n X7R PHILIPS C4 2222-916-16736 10n X7R PHILIPS C5 2222-916-16736 10n X7R PHILIPS C12 2222-786-16749 100n X7R PHILIPS C19 2222-916-16736 10n X7R PHILIPS C20 2222-916-16736 10n X7R PHILIPS C21 2222-916-16736 10n X7R PHILIPS C22 2222-916-16736 10n X7R PHILIPS C43 2222-916-16736 10n X7R PHILIPS C44 2222-916-16736 10n X7R PHILIPS C45 2222-916-16736 10n X7R PHILIPS C46 2222-916-16736 10n X7R PHILIPS C47 2222-916-16736 10n X7R PHILIPS D1 HLMP6500-011 RED Diffused_Lens FARNELL D6 HLMP6400-011 GREEN Diffused_Lens FARNELL IC1 PN-TZA3019C TZA3019C IC_Universal PHILIPS L8 BLM11P300S BLM11P300S CBD muRata L9 BLM11P300S BLM11P300S CBD muRata L10 BLM11P300S BLM11P300S CBD muRata L11 BLM11P300S BLM11P300S CBD muRata L12 4330-030-36301 BD8.933-4S2 CBD PHILIPS L13 BLM11P300S BLM11P300S CBD muRata P1 142-0701-851 SMA_sqr COAX EF.Johnson P2 142-0701-851 SMA_sqr COAX EF.Johnson P3 142-0701-851 SMA_sqr COAX EF.Johnson P4 142-0701-851 SMA_sqr COAX EF.Johnson P5 142-0701-851 SMA_sqr COAX EF.Johnson P6 142-0701-851 SMA_sqr COAX EF.Johnson P7 142-0701-851 SMA_sqr COAX EF.Johnson P8 142-0701-851 SMA_sqr COAX EF.Johnson P9 R114426 SMB_str COAX RADIALL P10 R114426 SMB_str COAX RADIALL P11 3833-1-0-303 MKS3830_3p MKS3830 STOCKO R5 2322-702-60563 56k RC21 PHILIPS R10 2322-702-60563 56k RC21 PHILIPS 42 Tolerance 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% Rating 6.3V 25V 25V 25V 25V 16V 25V 25V 25V 25V 25V 25V 25V 25V 25V 5% 5% 0.063W 0.063W Geom B45_d C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 SMDLED SMDLED SOT560AA1 BLM11 BLM11 BLM11 BLM11 CBD8.9 BLM11 SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMB_str SMB_str 3830_3p R0603 R0603 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package TABLE 12 Bill of materials TZA3019C, sorted by reference REF Part number Comp Series Vendor R13 3006P-7-104BRN 100k 3006P BOURNS R14 3006P-7-104BRN 100k 3006P BOURNS R15 3006P-7-104BRN 100k 3006P BOURNS R16 3006P-7-104BRN 100k 3006P BOURNS R17 2322-702-60333 33k RC21 PHILIPS R18 2322-702-60333 33k RC21 PHILIPS S1 2422-120-00551 DIP-SW_4 print_switch HONYWELL S2 09-03201-02 SPDT print_switch SPOERLE S3 09-03201-02 SPDT print_switch SPOERLE Z1 9331-177-20153 BZX79C BZX79C PHILIPS 8222-411-48331 PR48331 PS-SLE 5.5 Tolerance 10% 10% 10% 10% 5% 5% Application Note AN01023 Rating 0.75W 0.75W 0.75W 0.75W 0.063W 0.063W 5V1 Geom BO3006P BO3006P BO3006P BO3006P R0603 R0603 SWITCH_4 Low prof. Low prof. SOD27 BOARD Layout considerations • Decoupling networks - power supply decoupling - local decoupling, close to the IC • 50 Ohm impedance, for input and output transmission lines • Clearance between transmission line and ground plane for impedance matching 5.6 Thermal considerations Radiator inside board at first inner layer and bottom layer. The location of the components and via’s were chosen to optimize a heat flow from the radiators. 43 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package THIS PAGE IS INTENTIONALLY LEFT BLANK 44 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 6. 6.1 Layouts Silk screen (top) 45 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 6.2 Top layer component placement 46 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 6.3 Top layer copper, inverted 47 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 6.4 First inner layer copper, inverted 48 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 6.5 Second inner layer copper, inverted 49 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 6.6 Bottom layer copper, inverted 50 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 6.7 Bottom component placement (bottom view) 51 Application Note AN01023 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package 6.8 Silk screen (bottom view) Pagina nummer tekst 52 Application Note AN01023