UM10395 UBA2014 evaluation board Rev. 2 — 16 September 2010 User manual Document information Info Content Keywords UBA2014, evaluation board, TL, CFL Abstract This user manual describes the UBA2014 evaluation board, which is designed to be a flexible tool for demonstrating the many UBA2014 fluorescent tube driver applications. UM10395 NXP Semiconductors UBA2014 evaluation board Revision history Rev Date v.2 20100916 01 20091014 Description • • Illustrations amended to new standard Section 11 “Legal information” amended to include new items First issue Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 2 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 1. Introduction WARNING Lethal voltage and fire ignition hazard The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. This product shall never be operated unattended. This document describes the UBA2014 evaluation board. The board is designed to be a flexible tool that demonstrates the many different applications that are possible with the UBA2014 fluorescent tube driver. Please note that this board is not a complete ballast design for fluorescent tubes. The default setup is made such that a T5 HE 35W fluorescent lamp can be demonstrated. 2. Safety warnings The board is intended as an evaluation board to build different TL and or CFL applications. To optimize flexibility, almost no protection is built in (except for IC internal protection). The board does not conform with any safety norm. WARNINGS: • Do not supply voltages to the board without a daughter board correctly inserted. Failing to do so may damage the board. • Always operate with burner (lamp) connected to the board and connected to the resonant circuit. Failing to do so may damage the board. • Many parts contain dangerous high voltages. It is necessary to take relevant safety precautions before using this board. • Do not touch any part of the board during or shortly after operation of the board. UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 3 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 3. Board description The board consists of two separate Printed-Circuit Boards (PCBs). The main board with the resonant circuit and a small daughter board with the UBA2014 IC. 3.1 Daughter board The daughter board contains the UBA2014 IC with the preheat, sweep and oscillator capacitor, the VDD generation and some other low voltage components. The daughter PCB can be easily replaced in case of damage. Care should be taken that the board is inserted properly. Pin 11 has been removed from the daughter board to prevent the board being inserted incorrectly. 019aaa720 Fig 1. UM10395 User manual Daughter board All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 4 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 3.2 Main board The main board has all the other necessary circuit to make a Tubular Lamp (TL) or Compact Fluorescent Lamp (CFL) application. The board consists of the following: • • • • • • DC and AC input connector Dimming input 2 sockets for FETs 2 different transformers Area for experiments Connections for up to 4 burners. 019aaa721 Fig 2. UBA2014/21 main board with UBA2014 daughter board inserted UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 5 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 4. Schematics The schematics of the daughter board with the UBA2014 IC can be found in Figure 3. The settings for the oscillator and sweep are R1 = 33 kΩ (to pin IREF), C3 = 100 pF (to pin CF) and C1 = 330 nF (to pin CT). This will provide a minimum oscillator frequency of 40.5 kHz and a preheat time of 1.8 s. 1 C1 2 A1 330 nF/16 V 2 CSW 220 nF/16 V CF 1 1 C9 10 nF 2 1 R6 1 kΩ 2 C2 CT 1 C3 IREF 2 15 2 16 3 10 4 11 UBA2014 100 pF 1 R1 X1 1 Vref 2 33 kΩ VREF VDD GND 14 CSP CSN GH GL 8 C4 1 GL 2 100 nF LVS 13 12 GH FVDD 6 7 CSN SH 9 5 CSN CSP Vref LVS SH GH PCS Vbrg GL CSP PCS PCS 1 2 3 4 5 6 7 8 9 10 11 12 VDD ACM header 12 1 R2 240 kΩ 1 2 1 1 R3 240 kΩ 2 Vbrg 1 C8 1 μF/ 25 V 2 V1 BAS29 V2 6.8 V 2 2 1 DNP C5 2 1 1 V3 12 V 2 C7 5.6 nF/ 50 V 2 1 C6 2 1 1 nF/500 V V4 6.8 V 2 1 2 V5 2 PCS 33 kΩ 13.6 V 1 R7 BAS29 1 R4 2.2 Ω 2 2 R5 10 kΩ 1 1 C10 56 nF/ 50 V 2 1 C11 100 nF 2 019aaa273 Fig 3. Daughter board with UBA2014 circuit (version R1B) UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 6 of 25 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors UM10395 User manual VDC 1 R20 2 X78 TP X79 TP X80 TP X81 TP X82 TP X83 TP X84 TP X85 TP X86 TP 1 CSN 1 1 CSP 2 1 Vref 3 1 LVS 4 1 SH 5 1 GH 6 1 PCS 7 1 Vbrg 8 1 GL 9 Rev. 2 — 16 September 2010 All information provided in this document is subject to legal disclaimers. 1 X87 TP GH 1 X88 TP X120 TP 1 PCS_2021 13 R1 1 R35 56 kΩ 2 GL 1 R3 33 Ω 12 1 2 1 R36 56 kΩ placed in header D X14 2 LVS PCS_2021 1 R37 2 1 R38 2 0Ω 5.6 kΩ 1 2 2 ground connections for oscilloscope probes 1 R6 1Ω 2W 1 1 1 2 1 R8 1Ω 2W 2 2 Y7 jumper 2 1 header 2 R9 1Ω 2W 2 1 T1 12 10 C4 1 2 1 33 nF/100 V 9 1 1 7 C5 1 2 1 33 nF/100 V 760 870 401 Y6 jumper 2 R4 X90 TP X92 TP X94 TP X96 TP 1 0Ω C6 4.7 nF 2000 V C19 470 nF 63 V X33 header 3 Y8 jumper X34 2 R32 100 kΩ 1 V16 1N4937 header 2 1 1 1 2 X32 2 2 PCS X104 X105 X106 X107 X102 X108 X103 X109 TP TP TP TP TP TP TP TP 1 1 2 R39 1.2 kΩ 8.2 kΩ R31 1 kΩ 1 R5 1 1 S socket 3 2 1 1 V6 2SK3569 G 3 1 2 R2 0Ω 1 X115 header 2 47 kΩ 2 68 nF/400 V 6 connector position 11 glue sealed to prevent erroneous insertion of daughter board 1 2 1 47 kΩ C1 2 Y5 jumper SH socket 13 1 Cdc X114 header 2 S socket 3 43 kΩ 1 V3 2SK3569 G 3 2 43 kΩ placed in header D X2 1 2 33 Ω 11 VDD 1 R22 2 1 R23 2 1 R24 2 1 R25 2 X89 10 1 Vbrg 220 kΩ connection for daughter board Y9 jumper 1 1 2 C18 2.2 nF 100 V 1 2 2 CSN C11 10 nF 100 V 3 1 1 2 R7 1 kΩ C12 1 nF 100 V lamp current sense circuit 2 1 1 2 V11 1 1N4937 C17 680 nF 50 V R10 33 Ω 2W 2 LCS 2 X39 2 1 V12 1N4937 2 1 3 019aaa254 Fig 4. Main board half-bridge and resonant circuit - (version R1C) UM10395 7 of 25 © NXP B.V. 2010. All rights reserved. UBA2014 evaluation board header 3 Y10 jumper UM10395 NXP Semiconductors UBA2014 evaluation board VDC In = 400 V X1 V1 1 2 1 2 1N4937 VDC 2 MKDS 2.5/2-5.08 2 VAC In = 230 V 50 Hz X3 C16 47 μF/ 350 V V2 GBU8K 2 F1 4 2 1 1.5 mH 1 2 2 C3 47 nF/ 305 Vac 2 MKDS 2.5/2-5.08 1 1 1 C2 47 nF/ 305 Vac R29 75 kΩ 1 3 2 2 F2 C15 47 μF/ 350 V Y12 Cover 2A 1 2 R33 75 kΩ L1 Fuseholder 5x20 1 R27 75 kΩ 1 1 2 R34 75 kΩ 1 019aaa253 Fig 5. Main board input section External dimming voltage 0 V to 10 V 1 R40 2 X68 1 1 R18 2 2 33 kΩ VDD 75 kΩ CSP 1 1 R19 11 kΩ MKDS 2.5/2-5.08 2 1 V15 DNP 2 C14 10 nF/ 100 V 2 019aaa252 Fig 6. Main board dimming input X117 header 2 Y11 jumper 1 2 SH X67 TP X69 TP X73 TP X75 TP X77 TP X91 TP Fig 7. 1 1 X69 1 X73 1 X75 1 1 1 T2 X67 X77 X91 2 mH 2.5 mH 3 mH 3.5 mH 4 mH 2 10 9 15 μH X70 1 X72 1 X74 1 X76 1 X70 TP X72 TP 3 8 4 7 5 15 μH X74 TP X76 TP 6 DNP 019aaa274 Main board transformer T2/T3 UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 8 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board X110 header 2 1 X111 header 2 2 1 X112 header 2 2 1 2 X113 header 2 1 2 Y1 jumper Y2 jumper Y3 jumper Y4 jumper LAMP 4 1 1 1 X90 TP X6 TP X92 TP X9 TP X94 TP X96 TP 1 X15 TP SH 1 1 X18 TP 1 X22 TP 1 X25 TP 1 X28 TP 1 X17 TP X19 TP X23 TP EXPERIMENTING AREA 1 X11 TP X13 TP X29 TP 1 1 2 1 3 1 X8 4 MKDS 2.2/4-5.08 LAMP 3 X20 TP X24 TP X27 TP X26 TP 1 X30 TP 1 1 1 2 1 3 1 X21 4 MKDS 2.2/4-5.08 X31 TP SH 1 X36 TP 1 X43 TP 1 X44 TP 1 X47 TP 1 X37 TP X38 TP X40 TP X41 TP X45 TP X48 TP X50 TP SH 1 X53 TP X57 TP X60 TP X63 TP 1 1 1 1 1 Fig 8. LAMP 2 X35 TP X52 TP X54 TP X58 TP EXPERIMENTING AREA 1 X61 TP X64 TP X46 TP X49 TP 1 1 1 2 1 3 1 X42 4 MKDS 2.2/4-5.08 LAMP 1 X55 TP X59 TP X62 TP X65 TP 1 1 1 2 1 3 1 X66 TP X56 4 MKDS 2.2/4-5.08 019aaa255 Main board lamp connectors and experimenting area UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 9 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 5. Connectors 5.1 Power supply connectors The board can be supplied by either a high voltage DC or a mains AC input. For most applications the high voltage DC input should be used. In the final product, a Power Factor Correction (PFC) of choice may be used to replace the high voltage DC supply. For some applications (such as CFL applications) the rectified mains is sufficient. In these cases a mains input of 230 V AC may be used. Table 1. DC high voltage input connector X1 Connector Signal Comment X1-1 + + 400 V (DC) in X1-2 GND ground Table 2. AC input connector X3 Connector Signal Comment X3-1 ~ mains 230 V (AC) X3-2 ~ mains 230 V (AC) 5.2 Dimming input The UBA2014 has dimming functionality. An input with a voltage divider has been provided so that a 0 V to 10 V signal can be used. If no voltage is supplied to the dimming input, the lamp operates at approximately 50 % of its nominal power. Please note that there is no galvanic isolation between the dimming input and the rest of the circuit, it is therefore advisable to use a mains isolation transformer to separate the board ground from the mains. If required, a Zener diode (V15) can be used as protection against input voltages that are too high. Table 3. Dimming input connector X68 Connector Signal Comment X68-1 + 0 V to 10 V dimming input (max 10 V) X68-2 GND ground 5.3 Lamp connectors There are connections for four lamps on the board. In the following tables, the connectors are listed together with the names of the test points connected to them. Table 4. UM10395 User manual Lamp 1 (X56) TP Comment X55 connection for filament 1 X59 connection for filament 1 X62 connection for filament 2 X65 connection for filament 2 All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 10 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board Table 5. Lamp 2 (X42) TP Comment X38 connection for filament 1 X41 connection for filament 1 X46 connection for filament 2 X49 connection for filament 2 Table 6. Lamp 3 (X21) TP Comment X20 connection for filament 1 X24 connection for filament 1 X27 connection for filament 2 X30 connection for filament 2 Table 7. Lamp 4 (X8) TP Comment X6 connection for filament 1 X9 connection for filament 1 X11 connection for filament 2 X13 connection for filament 2 5.4 Test points Eight ground pins are distributed over the board so that (oscilloscope) probes can be grounded without the need for long grounding wires. Table 8. Ground test points TP Color Signal X102 black GND X103 black GND X104 black GND X105 black GND X106 black GND X107 black GND X108 black GND X109 black GND Remark: A test pin is available for each pin of the daughter board. Table 9. UM10395 User manual Daughter board connections TP Name Comment X78 CSN negative input for the average current sensor [1] X79 CSP positive input for the average current sensor [1] X80 Vref reference voltage output [2] X81 LVS lamp voltage sensor input [1] X82 SH source for the high-side switch All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 11 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board Table 9. Daughter board connections …continued TP Name Comment X83 GH gate output for the high-side switch X84 PCS preheat current sensor input [1] (also connected to LVS via V5, R7/C11, R5/C10) X85 Vbrg connection to VDC via R20 (220 kΩ) X86 GL gate output for the low-side switch X87 GND ground X88 VDD low voltage supply X120 PCS_2021 preheat current sense for the UBA2021 daughter board [1] For UBA2014 daughter board. [2] From UBA2014 daughter board. 5.5 Transformer T1 Transformer T1 is used In the default setup, and it is connected with jumpers to lamp connector 4 (X8). The transformer specifications are listed in Section 6.1. Table 10. Default connection transformer T1 Header Comment X110 insert to connect T1 to filament 1, lamp 4 X111 insert to connect T1 to filament 1, lamp 4 X112 insert to connect T1 to filament 2, lamp 4 X113 insert to connect T1 to filament 2, lamp 4 X114 insert to connect SH to transformer T1 X115 insert to connect T1 to resonant capacitor C6 (4.7 nF; 2000 V) 5.6 FET Two NMOST FETs should be placed in X2 and X14. The supplied NMOSTs are Toshiba 2SK3569 (VDS = 600 V; ID = 10 A; RDSon = 0.54 Ω). When using different NMOS types, the values of gate resistors R1 and R3 (default 33 Ω) can be changed. 5.7 Current sense selection There are two ways to use current sensing. Sensing of the half-bridge current or sensing of the lamp current. Table 11. UM10395 User manual Current sensing selection X33 Pins 1 to 2 Pins 2 to 3 half-bridge shorted open lamp current open shorted All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 12 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 5.7.1 Half-bridge current sensing Pins 1 and 2 of jumper X33 should be shorted in order to connect the sense resistor network in the half-bridge to the CSN pin of the UBA2014. With jumpers X32 and X34, different values of the sense resistor can be selected. In this case, X39 should be shorted between pins 2 and 3 in order to connect the lamp to ground. Table 12. Current sensing selection X32 X34 Resistance (Ω) short short 0.5 short open 1.0 open short 1.5 open open 2.0 5.7.2 Lamp current sensing Pins 2 and 3 of jumper X33 should be shorted to connect the lamp current sense network to the CSN pin. X39 should be shorted between pins 1 and 2 to connect the lamp to the sensing circuit. 5.8 Using transformer T3 To use the flexible transformer T3, jumper X117 should be inserted. This connects SH to pin 1 of the transformer. Table 13 shows the different inductance values that can be made with this transformer. The specifications of the transformer are listed in Section 6.2. Table 13. Transformer T3 primary connections Connection Inductance X69 2.0 mH X73 2.5 mH X75 3.0 mH X77 3.5 mH X91 4.0 mH Two secondary connections are available for filament (pre-)heating, as shown in Table 14 Table 14. Transformer T3 secondary connections Connection Inductance X70 to X72 15 μH X74 to X76 15 μH Transformer T3 has a double footprint that enables the use of different types of transformers. The transformers are named “T2” and “T3” on the schematic drawings. UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 13 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 6. Transformer specifications 6.1 Transformer T1 6.1.1 Schematic diagram • Manufacturer: Würth Elektronik • Part number: 760870401 12 N3 1 10 N1 9 6 N2 7 019aaa277 Fig 9. Transformer T1 schematic diagram 6.1.2 Electrical properties Table 15. Electrical characteristics of transformer T1 Properties Test conditions Value Unit Tolerance mH ±5 % Inductance N1 50 kHz/0.1 V L0 2.9 Turns ratio N1 to N3 N1: N2: N3 TR 26.1 : 1 : 1 DC-resistance N1 at 20 °C RDC1 2.7 ? maximum DC-resistance N2 at 20 °C RDC2 180 m? maximum ±3 % DC-resistance N3 at 20 °C RDC3 180 m? maximum Saturation current N1 dL / L = 20 % ISAT 1.6 A typical Leakage inductance N1 200 kHz/0.1 V other windings shorted LS 350 μH maximum Coupling capacitance 20 kHz/1 V all windings CWW 11.0 pF typical Hipot test 3 mA, 1s all windings HV 1.2 kV 6.1.3 Core and bobbin T1 • Core: RM-8 (Ferroxcube RM/I or equivalent) • Core material: 3F3, N87 or equivalent • Bobbin: RM-8 (12 pin, vertical type) UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 14 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 11 10 12 1 3 2 21.59 mm (max) 8 9 7 6 4 5 21.59 mm (max) 17.27 mm (max) 019aaa251 Fig 10. Pin out and dimensions of Transformer T1 6.2 Transformer T3 6.2.1 Schematic diagram • Manufacturer: Würth Elektronik • Part number: 760870402 10 1 2 3 4 5 N1 N7 N2 9 N3 8 N4 N6 N5 6 7 019aaa278 Fig 11. Transformer T3 schematic diagram Table 16. Electrical characteristics for transformer T3 Properties Test conditions Value Unit Tolerance Inductance N1 to N5 50 kHz/0.1 V Turns ratio N1 to N5 N1: N2: N3: N4: N5: N6: N7 L0 4.0 mH TR 12 : 1.33 : 1.25 : 1.17 : 1.17 : 1 : 1 DC-resistance N1 to N5 at 20 °C RDC1-5 1.85 ? ±20 % DC-resistance N6 at 20 °C RDC6 135 m? ±20 % DC-resistance N7 at 20°C ±5 % ±3 % RDC7 140 m? ±20 % Saturation current N1 to N5 dL / L = 20 % ISAT 1.0 A typical Leakage inductance N1 to N5 200 kHz/0.1 V other windings shorted LS 275 μH typical Coupling capacitance 20 kHz/1 V all windings CWW 30.0 pF typical Hipot test 3 mA, 1 s all windings HV 3.0 kV UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 15 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 6.2.2 Core and bobbin T3 10 1 31.5 mm (max) 6 5 31.5 mm (max) 21 mm (max) 019aaa279 Fig 12. Transformer T3 • • • • Core: E30/15/7 Core material: ferrite Air gap in center leg: 1100 μm Bobbin: CSH-E30/7-1S-10P 7. Application example 7.1 Default application T5 HE 35 W The default settings of the board are for a T5 HE 35 W burner. Table 17. Default settings Jumper Position Comment X32 shorted half-bridge sense resistor 1 Ω (used for PCS) X34 open - X33 1 to 2 open, 2 to 3 shorted use lamp current sensing X114 shorted connect transformer T1 X115 shorted - X39 1 to 2 shorted, 2 to 3 open connect lamp to lamp current sense circuit X110, X111, X112, X113 shorted connect to lamp 4 X117 open do not connect transformer T3 Table 18. External connections for T5 HE 35 W Jumper Position Comment X1 VDC 400 V (DC) X68 external dimming 10 V for full power X8 burner T5 HE 35 W burner When no external dimming voltage is supplied, the lamp power is 20 W. UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 16 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 8. Bill of Materials (BOM) Table 19. BOM daughter board Reference Value Component A1 UBA2014T NXP C1 330 n /16 V capacitor ceramic X7R, 16 V, 10 % C2 220 nF/16 V capacitor ceramic X7R, 16 V, 10 % C3 100 pF capacitor ceramic C0G, 50 V, 5 % C4, C11 100 nF capacitor ceramic X7R, 50 V, 10 % C5 not mounted C6 1 nF/500 V capacitor ceramic 500 V NP0 5 % C7 5.6 nF/50 V capacitor ceramic 50 V X7R 10 % C8 1 μF/25 V capacitor ceramic X7R 25 V 10 % C9 10 nF capacitor ceramic X7R, 50 V, 10 % C10 56 nF/50 V capacitor ceramic 50 V X7R 10 % R1, R7 33 kΩ resistor 1 % 0.125 W 100 ppm RC12H R2, R3 240 kΩ resistor 1 % 0.125 W 100 ppm RC12H R4 2.2 Ω resistor 1 % 0.125 W 0 to + 500 ppm RC12H R5 10 kΩ resistor 1 % 0.125 W 100 ppm RC12H R6 1 kΩ resistor 1 % 0.125 W 100 ppm RC12H V1, V5 BAS29 NXP, diode, 50 ns 90 V 250 mA V3 BZX84C12V NXP, Zener, 250 mW, 5 % [Y2t/Y2p/Y2W] V2, V4 BZX84-B6V8 NXP, Zener, 250 mW, 2 % [Z61 or R6] Table 20. BOM Main board Reference Value Component C1 68 nF/400 V capacitor, MKP Class X2, 20 % C2, C3, C4, C5 47 nF/305 V (AC) capacitor, MKP Class X2, 20 % C4, C5 33 nF/100 V capacitor, MKT 100 V (DC), 5 % C6 4.7 nF/2000 V capacitor MKP radial potted, 5 % C11, C14 10 nF/100 V capacitor ceramic disc X7R, 10 % C12 1 nF/100 V capacitor ceramic disc X7R, 10 % C15, C16 4.7 μF/450 V cap. elco rad 450 V 105C 20 % C17 680 nF/50 V capacitor ceramic disc X7R, 10 % C18 2.2 nF/100 V capacitor ceramic disc X7R, 10 % C19 470 nF/63 V capacitor, MKT 63 V (DC), 5 % F1 fuse holder 5 mm x 20 mm fuse holder for 5 mm x 20 mm F2 2A fuse 5 mm x 20 mm time lag L1 1.5 mH inductor choke current rating = 850 mA, R = 580 mΩ R1, R3 33 Ω resistor 1 % 0.6 W 50 ppm MRS25 R2, R4 0Ω zero ohm link, current rating = 25 A at 25 °C R5 8.2 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R6, R8, R9 1.2 Ω resistor power 5 % 2 W 100 ppm/°C MFP UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 17 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board Table 20. BOM Main board …continued Reference Value Component R7 1 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R10 33.2 Ω resistor Power 5 % 2 W 450 ppm/°C Carbon Film R18 33 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R19 11 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R20 220 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R22, R23 43 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R24, R25 47 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R27, R29, R33, R34 75 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R31 1 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R32 100 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R35, R36 56 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R37 0Ω Zero ohm link Im = 25 A at 25 °C R38 5.6 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R39 1.2 kΩ resistor 1 % 0.6 W 50 ppm MRS25 R40 75 kΩ resistor 1 % 0.6 W 50 ppm MRS25 T1 760870401 Würth Elektronik: part number 760870401 T3 760870402 Würth Elektronik: part number 760870402 V1, V11, V12, V16 1N4937 diode, fast-recovery, 600 V, 1 A V2 GBU8K bridge 800 V 8 A TH V3, V6 2SK3569 FET MOS N-ch 600 V, 10 A 0,54E V15 not mounted X1, X3, X68 MKDS 2,5/2-5,08 terminal block (screw) 2-p, p = 2e, 2.5 mm2 X2, X14 Socket 3 socket straight p = 2.54 mm, h = 7 mm X8, X21, X42, X56 MKDS 2,5/4-5,08 terminal block (screw) 4-p, p = 2e, 2.5 mm2 UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 18 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 9. Layout 7022.000.00022 019aaa275 019aaa276 Top view Bottom view Fig 13. UBA2014 daughter board layout V1 C2 C1 C3 V3 C7 C6 3 R1 C5 1 R6 C10 R5 R7 V2 C8 V5 2 V4 R3 1 C9 3 C11 1 X1 3 3 3 R2 1 2 019aaa292 Top view C4 A1 R4 019aaa296 Bottom view Fig 14. UBA2014 daughter board silk screen UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 19 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board TOP SIDE 3322 029 91481 UBA2014EB R1C 019aaa295 Fig 15. UBA2014/21 main board PCB layout top UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 20 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board BOTTOM SIDE B 019aaa293 Fig 16. UBA2014/21 main board PCB layout bottom UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 21 of 25 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx X66 T2 1 GND SH X117 10 10 1 1 9 9 2 2 15 μH X73 X62 X53 X54 X59 X52 X55 8 8 3 3 7 7 4 4 HALF BRIDGE SH X91 3.5 mH 4 mH X77 X42 6 6 5 5 1 1 X109 d X48 X49 X44 X45 X46 X40 X43 X41 X36 X37 X38 LAMP 2 GND s X2 UBA20 (14/21) Daughter Board 1 1 R5 R32 CSP X89 X78 X80 X79 X35 SH X31 X104 X21 GND C12 1 R6 X28 X29 X30 X25 X26 X27 X22 X23 X24 X18 X19 X20 LAMP 3 V12 R10 R7 X32 C17 1 X1 WWW.NXP.COM UBA20 (14/21) DEMO BOARD V1.2 GND X33 C18 R31 VREF X82 C11 X81 LVS SH X83 GH GL GND R36 VCC C15 PCS X86 X85 s PCS 2021 X14 R33 X87 VBRG R3 R20 X120 X88 d X84 g Low Side FET CSN 230 VAC 50 Hz 1 R35 V11 LAMP CURRENT SENSE 8 R40 ANALOG DIM IN 0 - 10 V C14 GND 7 TRAFO 1 X114 6 R4 X39 X107 1 5 X108 X17 SH SH X8 V16 R8 X115 R9 GND C5 11 X96 12 2 X94 C4 C1 R18 R37 22 of 25 © NXP B.V. 2010. All rights reserved. GND GND X112 X9 R22 R2 X92 R24 X111 1 C6 X110 X90 High Voltages On This Board ! X6 1 R23 R25 019aaa294 Fig 17. UBA2014/21 main board silk screen top UM10395 R38 X103 X11 1 R39 X102 X113 1 1 X103 LAMP 4 X13 X15 UBA2014 evaluation board 1 V15 R19 X106 1 VDC_IN = 400 V X105 1 V1 PREHEAT CURRENT SENSE T1 X34 1 1 Rev. 2 — 16 September 2010 All information provided in this document is subject to legal disclaimers. X47 R1 g High Side FET F1 X50 GND X3 WW/YY X58 X75 2 A/T C2 X68 X57 LAMP 1 X76 3 mH C16 X65 X74 2.5 mH R29 X61 X72 2 mH R27 X60 X56 15 μH X69 R34 X64 X70 T3 X67 C3 EXPERIMENTING AREA X63 1 V2 NXP Semiconductors UM10395 User manual L1 UM10395 NXP Semiconductors UBA2014 evaluation board 10. Glossary CFL — Compact Fluorescent Lamp FET — Field-Effect Transistor NMOST — Negative channel Metal–Oxide–Semiconductor Transistor TL — Tubular Lamp UM10395 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 23 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 11. Legal information 11.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 11.2 Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. UM10395 User manual NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. Safety of high-voltage evaluation products — The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel that is qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. The product does not comply with IEC 60950 based national or regional safety standards. NXP Semiconductors does not accept any liability for damages incurred due to inappropriate use of this product or related to non-insulated high voltages. Any use of this product is at customer’s own risk and liability. The customer shall fully indemnify and hold harmless NXP Semiconductors from any liability, damages and claims resulting from the use of the product. 11.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 2 — 16 September 2010 © NXP B.V. 2010. All rights reserved. 24 of 25 UM10395 NXP Semiconductors UBA2014 evaluation board 12. Contents 1 2 3 3.1 3.2 4 5 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.7.1 5.7.2 5.8 6 6.1 6.1.1 6.1.2 6.1.3 6.2 6.2.1 6.2.2 7 7.1 8 9 10 11 11.1 11.2 11.3 12 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Safety warnings . . . . . . . . . . . . . . . . . . . . . . . . . 3 Board description . . . . . . . . . . . . . . . . . . . . . . . 4 Daughter board. . . . . . . . . . . . . . . . . . . . . . . . . 4 Main board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Power supply connectors . . . . . . . . . . . . . . . . 10 Dimming input. . . . . . . . . . . . . . . . . . . . . . . . . 10 Lamp connectors . . . . . . . . . . . . . . . . . . . . . . 10 Test points. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 12 FET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Current sense selection . . . . . . . . . . . . . . . . . 12 Half-bridge current sensing . . . . . . . . . . . . . . 13 Lamp current sensing . . . . . . . . . . . . . . . . . . . 13 Using transformer T3 . . . . . . . . . . . . . . . . . . . 13 Transformer specifications . . . . . . . . . . . . . . . 14 Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 14 Schematic diagram . . . . . . . . . . . . . . . . . . . . . 14 Electrical properties . . . . . . . . . . . . . . . . . . . . 14 Core and bobbin T1 . . . . . . . . . . . . . . . . . . . . 14 Transformer T3 . . . . . . . . . . . . . . . . . . . . . . . . 15 Schematic diagram . . . . . . . . . . . . . . . . . . . . . 15 Core and bobbin T3 . . . . . . . . . . . . . . . . . . . . 16 Application example . . . . . . . . . . . . . . . . . . . . 16 Default application T5 HE 35 W . . . . . . . . . . . 16 Bill of Materials (BOM). . . . . . . . . . . . . . . . . . . 17 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 16 September 2010 Document identifier: UM10395