MICROCHIP TC1263_13

TC1263
500 mA, Fixed-Output, CMOS LDO with Shutdown
Features
Description
•
•
•
•
•
•
•
The TC1263 is a fixed-output, high-accuracy (typically
±0.5%) CMOS low dropout regulator. Designed
specifically for battery-operated systems, the TC1263’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80 µA at full load (20 to 60 times lower than
in bipolar regulators).
Very Low Dropout Voltage
500 mA Output Current
High-Output Voltage Accuracy
Standard or Custom Output Voltages
Overcurrent and Overtemperature Protection
SHDN Input for Active Power Management
ERROR Output Can Be Used as a Low Battery
Detector (SOIC only)
Applications
•
•
•
•
•
•
•
TC1263 key features include ultra low noise operation,
very low dropout voltage (typically 350 mV at full load)
and fast response to step changes in load.
The TC1263 incorporates both overtemperature and
overcurrent protection. The TC1263 is stable with an
output capacitor of only 1 µF and has a maximum
output current of 500 mA. It is available in 8-Pin SOIC,
5-Pin TO-220 and 5-Pin DDPAK packages.
Battery-Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
Package Type
5-Pin TO-220
5-Pin DDPAK
Front View
VOUT
VIN
+
TC1263
SHDN
TC1263
C1
1 µF
1 2 3 4 5
1 2 3 4 5
SHDN
BYP
SHDN
GND
VIN
VOUT
GND
TC1263
VOUT
BYP
SHDN
GND
VIN
VOUT
VIN
Tab is GND
Tab is GND
Typical Application
8-Pin SOIC
VOUT
1
GND
2
8
VIN
7
NC
TC1263
 2002-2012 Microchip Technology Inc.
NC
3
6
SHDN
BYPASS
4
5
ERROR
DS21374D-page 1
TC1263
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage .........................................................6.5V
Output Voltage................ (GND – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 7)
Voltage (max.) on Any Pin: (GND – 0.3V) to (VIN + 0.3V)
Operating Temperature Range.... -40°C < TJ < +125°C
Storage Temperature..........................-65°C to +150°C
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, (Note 1), IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Input Operating Voltage
Maximum Output Current
Output Voltage
Sym
Min
Typ
Max
Units
VIN
2.7
—
6.0
V
IOUTMAX
500
—
—
mA
VOUT
VR – 2.5%
VOUT/T
—
40
—
Line Regulation
VOUT/VIN
—
0.05
0.35
%
Load Regulation (Note 4)
VOUT/VOUT
–0.01
0.002
+0.01
%/mA
Dropout Voltage (Note 5)
VIN-VOUT
mV
VOUT Temperature Coefficient
Supply Current
VR ± 0.5% VR + 2.5%
V
Conditions
Note 2
Note 1
ppm/°C Note 3
(VR + 1V) VIN6V
IL = 0.1 mA to IOUTMAX
—
20
30
—
60
130
IL = 100 µA
IL = 100 mA
—
200
390
IL = 300 mA
—
350
650
IL = 500 mA
IDD
—
80
130
µA
SHDN = VIH, IL = 0
Shutdown Supply Current
ISHDN
—
0.05
1
µA
SHDN = 0V
Power Supply Rejection Ratio
PSRR
—
64
—
db
F 1 kHz
Output Short Circuit Current
IOUTSC
—
1200
1400
mA
VOUT = 0V
VOUT/PD
—
0.04
—
V/W
Note 6
eN
—
260
—
Thermal Regulation
Output Noise
Note 1:
2:
3:
4:
5:
6:
7:
nV/Hz IL = IOUTMAX, F = 10 kHZ
VR is the regulator output voltage setting.
The minimum VIN has to justify the conditions: VIN  VR + VDROPOUT and VIN  2.7V for IL = 0.1 mA to IOUTMAX.
6
 V OUTMAX – V OUTMIN  – 10
TCV OUT = -----------------------------------------------------------------------V OUT  T
Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.0V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
DS21374D-page 2
 2002-2012 Microchip Technology Inc.
TC1263
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, (Note 1), IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
SHDN Input High Threshold
VIH
45
—
—
%VIN
SHDN Input Low Threshold
VIL
—
—
15
%VIN
Conditions
SHDN Input
ERROR Output (SOIC Only)
Minimum Operating Voltage
VMIN
1.0
—
—
V
Output Logic Low Voltage
VOL
—
—
400
mV
ERROR Threshold Voltage
VTH
—
0.95 x VR
—
V
ERROR Positive Hysteresis
VHYS
—
50
—
mV
Note 1:
2:
3:
4:
5:
6:
7:
1 mA Flows to ERROR
VR is the regulator output voltage setting.
The minimum VIN has to justify the conditions: VIN  VR + VDROPOUT and VIN  2.7V for IL = 0.1 mA to IOUTMAX.
6
 V OUTMAX – V OUTMIN  – 10
TCV OUT = -----------------------------------------------------------------------V OUT  T
Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.0V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 5L-DDPAK
JA
—
57
—
°C/W
Thermal Resistance, 5L-TO-220
JA
—
71
—
°C/W
Thermal Resistance, 8L-SOIC
JA
—
163
—
°C/W
Conditions
Temperature Ranges
Note 1
Thermal Package Resistances
Note 1:
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).
 2002-2012 Microchip Technology Inc.
DS21374D-page 3
TC1263
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0.020
150
0.018
135
0.016
120
0.014
105
0.012
90
IDD (μA)
LINE REGULATION (%)
Note: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
0.010
0.008
45
0.004
30
0.002
15
0°C
25°C
70°C
85°C
5V
60
0.006
0.000
-40°C
2.5V
75
0
-40°C
125°C
Line Regulation vs.
NOISE (μV/√Hz)
10.0
RLOAD = 50Ω
COUT = 1μF
1.0
0.1
0.0
0.01
0.01
1
10
100
FIGURE 2-4:
25°C
125°C
85°C
0.40
70°C
25°C
0.30
0°C
0.20
-40°C
0.10
0.00
1000
Output Noise vs. Frequency.
0
FIGURE 2-5:
ILOAD.
0.0100
100
200
300
ILOAD (mA)
0.50
DROPOUT VOLT AGE (V)
LOAD REGULATION (%/mA)
0.0080
0.0070
0.0060
0.0040
1mA to 500mA
2.5V
0.0030
0.0020
1mA to 500mA
5V
0.40
85°C
0.30
70°C
25°C
0.20
0°C
0.10
-40°C
0.00
0°C
25°C
70°C
85°C
125°C
DS21374D-page 4
Load Regulation vs.
0
100
200
300
400
500
ILOAD (mA)
TEMPERATURE (°C)
FIGURE 2-3:
Temperature.
500
125°C
0.0010
0.0100
-40°C
400
2.5V Dropout Voltage vs.
0.0090
0.0050
85°C 125°C
IDD vs. Temperature.
FREQUENCY (kHz)
FIGURE 2-2:
70°C
0.50
DROPOUT VOLT AGE (V)
FIGURE 2-1:
Temperature.
0°C
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 2-6:
ILOAD.
5.0V Dropout Voltage vs.
 2002-2012 Microchip Technology Inc.
TC1263
Note: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
2.70
IL = 0.1mA
2.50
2.10
VOUT (V)
VOUT (V)
2.30
IL = 300mA
IL = 500mA
5.20
5.10
5.00
4.90
4.80
4.70
4.60
4.50
1.90
4.40
4.30
1.70
4.20
4.10
4.00
-40°C
1.50
-40°C
0°C
25°C
70°C
85°C 125°C
TEMPERATURE (°C)
FIGURE 2-7:
2.5V VOUT vs. Temperature.
 2002-2012 Microchip Technology Inc.
IL = 0.1mA
IL = 300mA
IL = 500mA
0°C
25°C
70°C
85°C
125°C
TEMPERATURE (°C)
FIGURE 2-8:
5.0V VOUT vs. Temperature.
DS21374D-page 5
TC1263
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
Pin No.
(5-Pin DDPAK)
(5-Pin TO-220)
Symbol
1
5
VOUT
Regulated voltage output
2
3
GND
Ground terminal
3
—
NC
4
1
BYPASS
Reference bypass input
5
—
ERROR
Out-of-Regulation Flag (open-drain output).
6
2
SHDN
7
—
NC
No connect
8
4
VIN
Unregulated supply input
3.1
Description
No connect
Shutdown control input
Regulated Output Voltage (VOUT)
VOUT is a regulated voltage output.
3.2
Ground (GND)
3.4
Out-of-Regulation Flag (ERROR)
Out-of-Regulation Flag (open-drain output). ERROR
goes low when VOUT is out-of-tolerance by
approximately – 5%.
Ground terminal.
3.5
3.3
Shutdown control input. The regulator is fully enabled
when a logic-high is applied to SHDN. The regulator
enters shutdown when a logic-low is applied to this
input. During shutdown, output voltage falls to zero and
supply current is reduced to 0.05 µA (typical).
Reference Bypass (BYPASS)
Reference bypass input. Connect a 470 pF to the
BYPASS input to further reduce output noise.
3.6
Shutdown Control (SHDN)
Unregulated Supply (VIN)
VIN is an unregulated supply input.
DS21374D-page 6
 2002-2012 Microchip Technology Inc.
TC1263
4.0
DETAILED DESCRIPTION
4.2
The TC1263 is a precision, fixed-output LDO. Unlike
bipolar regulators, the TC1263’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0 mA to ILOADMAX load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 4-1 shows a typical application circuit.
ERROR Output
ERROR is driven low whenever VOUT falls out of
regulation by more than – 5% (typ.). This condition may
be caused by low input voltage, output current limiting
or thermal limiting. The ERROR threshold is 5% below
rated VOUT, regardless of the programmed output
voltage value (e.g., ERROR = VOL at 4.75V (typ.) for a
5.0V regulator and 2.85V (typ.) for a 3.0V regulator).
ERROR output operation is shown in Figure 4-2.
Note that ERROR is active when VOUT is at or below
VTH, and inactive when VOUT is above VTH + VHYS.
+
+
1 µF
C1
Battery
VOUT
VIN
TC1263
+
1 µF
C2
VOUT
GND
V+
SHDN
ERROR
Shutdown Control
(to CMOS Logic or Tie
to VIN, if unused)
C3 Required Only
if ERROR is used as a
Processor RESET Signal
(See Text)
R1
1M
+
0.2 µF
C3
BATTLOW
or RESET
As shown in Figure 4-1, ERROR can be used as a
battery-low flag or as a processor RESET signal (with
the addition of timing capacitor C3). R1 x C3 should be
chosen to maintain ERROR below VIH of the processor
RESET input for at least 200 ms to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
VOUT, VIN or any other voltage less than (VIN + 0.3V).
VOUT
VTH
FIGURE 4-1:
4.1
Typical Application Circuit.
Output Capacitor
A 1 µF (min.) capacitor from VOUT to ground is
required. The output capacitor should have an Effective
Series Eesistance (ESR) greater than 0.1 and less
than 5. A 1 µF capacitor should be connected from
VIN to GND if there is either more than 10 inches of wire
between the regulator and the AC filter capacitor or a
battery is used as the power source. Aluminum
electrolytic or tantalum capacitor types can be used.
Since many aluminum electrolytic capacitors freeze at
approximately
-30°C,
solid
tantalums
are
recommended for applications operating below -25°C.
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors, and by employing passive filtering
techniques.
 2002-2012 Microchip Technology Inc.
Hysteresis (VHYS)
ERROR
VOH
VOL
FIGURE 4-2:
ERROR Output Operation.
DS21374D-page 7
TC1263
5.0
THERMAL CONSIDERATIONS
5.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when the die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
5.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage and output current. The following equation is used to calculate
worst-case actual power dissipation:
EQUATION 5-1:
P D =  V INMAX – VOUTMIN I LOADMAX
Where:
PD = Worst-case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
The
maximum
allowable
power
dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (JA).
PDMAX
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
JA)
2500 sq mm 2500 sq mm 2500 sq mm
25°C/W
1000 sq mm 2500 sq mm 2500 sq mm
27°C/W
125 sq mm
35°C/W
2500 sq mm 2500 sq mm
* Tab of device attached to top-side copper
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX
=
3.3V ± 10%
VOUTMIN
=
2.7V ± 0.5%
ILOADMAX
=
275 mA
TJMAX
=
125°C
TAMAX
=
95°C
JA
=
60° C/W (SOIC)
Find:
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
THERMAL RESISTANCE
GUIDELINES FOR TC1263 IN
8-PIN SOIC PACKAGE
Copper
Area
(Backside)
Board
Area
–3
P D = 260 mW
Table 5-1 and Table 5-2 show various values of JA for
the TC1263 package types.
Copper
Area
(Topside)*
Copper
Area
(Topside)*
P D =  3.3  1.1  –  2.7  .995  275  10
T JMAX – T AMAX
= ------------------------------------- JA
PD = Worst-case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
TABLE 5-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1263 IN
5-PIN DDPAK/TO-220
PACKAGE
P D   VINMAX – V OUTMIN I LOADMAX
EQUATION 5-2:
Where:
TABLE 5-2:
Thermal
Resistance
JA)
2500 sq mm 2500 sq mm 2500 sq mm
60°C/W
1000 sq mm 2500 sq mm 2500 sq mm
60°C/W
225 sq mm
2500 sq mm 2500 sq mm
68°C/W
100 sq mm
2500 sq mm 2500 sq mm
74°C/W
Maximum allowable power dissipation:
T JMAX – T AMAX
P DMAX = ------------------------------------- JA
 125 – 95 
P DMAX = ------------------------60
P DMAX = 500 mW
In this example, the TC1263 dissipates a maximum of
260 mW below the allowable limit of 500 mW. In a
similar manner, Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 500 mW into Equation 5-1, from
which VINMAX = 4.6V.
* Pin 2 is ground. Device is mounted on top-side.
DS21374D-page 8
 2002-2012 Microchip Technology Inc.
TC1263
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
5-Lead DDPAK
XXXXXXXXX
XXXXXXXXX
YYWWNNN
TC1263
3.3VET
0430256
5-Lead TO-220
XXXXXXXXX
XXXXXXXXX
YYWWNNN
XXXXXXXX
XXXXYYWW
NNN
e3
*
Note:
Example:
TC12633.3VATX
0430256
8-Lead SOIC (150 mil)
Legend: XX...X
Y
YY
WW
NNN
Example:
Example:
1263-3.3
VOA0430
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2002-2012 Microchip Technology Inc.
DS21374D-page 9
TC1263
5-Lead Plastic (ET) (DDPAK)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
L3
D2
D
D1
1
BOTTOM VIEW
e
b
TOP VIEW
θ1
(5X)
c2
A
θ
A1
c
L
Units
Dimension Limits
Number of Pins
Pitch
Overall Height
Standoff §
Overall Width
Exposed Pad Width
Molded Package Length
Overall Length
Exposed Pad Length
Lead Thickness
Pad Thickness
Lead Width
Foot Length
Pad Length
Foot Angle
Mold Draft Angle
MIN
e
A
A1
E
E1
D
D1
D2
c
c2
b
L
L3
θ
θ1
.170
.000
.385
.330
.549
.014
.045
.026
.068
.045
-3°
INCHES*
NOM
5
.067 BSC
.177
.005
.398
.256 REF
.350
.577
.303 REF
.020
-.032
.089
----
MAX
.183
.010
.410
.370
.605
.026
.055
.037
.110
.067
8°
7°
MILLIMETERS
NOM
5
1.70 BSC
4.32
4.50
0.00
0.13
9.78
10.11
6.50 REF
8.38
8.89
13.94
14.66
7.75 REF
0.36
0.51
1.14
-0.66
0.81
1.73
2.26
1.14
---3°
--
MIN
MAX
4.65
0.25
10.41
9.40
15.37
0.66
1.40
0.94
2.79
1.70
8°
7°
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-252
Drawing No. C04-012
DS21374D-page 10
 2002-2012 Microchip Technology Inc.
TC1263
5-Lead Plastic Transistor Outline (AT) (TO-220)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
L
H1
Q
b
e3
e1
E
e
ØP
EJECTOR PIN
a (5X)
C1
A
J1
F
D
Units
Dimension Limits
e
Lead Pitch
Overall Lead Centers
Space Between Leads
Overall Height
Overall Width
Overall Length
Flag Length
Flag Thickness
Through Hole Center
Through Hole Diameter
Lead Length
Base to Bottom of Lead
Lead Thickness
Lead Width
Mold Draft Angle
e1
e3
A
E
D
H1
F
Q
P
L
J1
C1
b
a
INCHES*
MAX
MIN
.060
.072
.263
.273
.030
.040
.190
.160
.385
.415
.560
.590
.234
.258
.045
.055
.103
.113
.146
.156
.560
.540
.090
.115
.022
.014
.025
.040
3°
7°
MILLIMETERS
MIN
MAX
1.52
1.83
6.68
6.93
0.76
1.02
4.83
4.06
9.78
10.54
14.22
14.99
5.94
6.55
1.14
1.40
2.62
2.87
3.71
3.96
13.72
14.22
2.29
2.92
0.36
0.56
0.64
1.02
3°
7°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-220
Drawing No. C04-036
 2002-2012 Microchip Technology Inc.
DS21374D-page 11
TC1263
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1

h
45
c
A2
A


L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L

c
B


MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21374D-page 12
 2002-2012 Microchip Technology Inc.
TC1263
APPENDIX A:
REVISION HISTORY
Revision D (November 2012)
Added a note to each package outline drawing.
Revision C (January 2005)
The following is the list of modifications:
1.
2.
Changes to DC Characteristics table
Added Appendix A: Revision History.
Revision B (May 2002)
No information for this revision.
Revision A (March 2002)
Original data sheet release.
 2002-2012 Microchip Technology Inc.
DS21374D-page 13
TC1263
NOTES:
DS21374D-page 14
 2002-2012 Microchip Technology Inc.
TC1263
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X.X
X
XX
XX
Device
Voltage
Option
Temperature
Range
Package
Tape and
Reel
Device
Voltage Option:*
a)
b)
c)
d)
e)
TC1263-2.5VAT
TC1263-2.8VAT
TC1263-3.0VAT
TC1263-3.3VAT
TC1263-5.0VAT
2.5V LDO, TO-220-5 pkg.
2.8V LDO, TO-220-5 pkg.
3.0V LDO, TO-220-5 pkg.
3.3V LDO, TO-220-5 pkg.
5.0V LDO, TO-220-5 pkg.
a)
TC1263-2.5VETTR 1.8V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1263-2.8VETTR 2.5V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1263-3.0VETTR 3.0V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1263-3.3VETTR 3.3V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1263 Fixed Output CMOS LDO with Shutdown
2.5
2.8
3.0
3.3
5.0
=
=
=
=
=
2.5V
2.8V
3.0V
3.3V
5.0V
* Other output voltages are available. Please contact your
local Microchip sales office for details.
Temperature Range: V
Package
Examples:
= -40°C to +125°C
AT
=
ET
=
ETTR =
OA
=
OATR =
Plastic (TO-220), 5-Lead
Plastic Transistor Outline (DDPAK), 5-Lead
Plastic Transistor Outline (DDPAK), 5-Lead,
Tape and Reel
Plastic SOIC, (150 mil Body), 8-lead
Plastic SOIC, (150 mil Body), 8-lead,
Tape and Reel
b)
c)
d)
a)
b)
c)
d)
e)
f)
g)
h)
i)
 2002-2012 Microchip Technology Inc.
TC1263-2.5VOA
1.8V LDO, SOIC-8 pkg.
TC1263-2.5VOATR 1.8V LDO, SOIC-8 pkg.,
Tape and Reel
TC1263-2.8VOA
2.5V LDO, SOIC-8 pkg.
TC1263-2.8VOATR 2.5V LDO, SOIC-8 pkg.,
Tape and Reel
TC1263-3.0VOA
3.0V LDO, SOIC-8 pkg.
TC1263-3.0VOATR 3.0V LDO, SOIC-8 pkg.,
Tape and Reel
TC1263-3.3VOA
3.3V LDO, SOIC-8 pkg.
TC1263-3.3VOATR 3.3V LDO, SOIC-8 pkg.,
Tape and Reel
TC1263-5.0VOA
5.0V LDO, SOIC-8 pkg.
DS21374D-page 15
TC1263
NOTES:
DS21374D-page 16
 2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767795
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2002-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21374D-page 17
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21374D-page 18
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/27/12
 2002-2012 Microchip Technology Inc.