MICROCHIP TC1173_13

TC1173
300mA CMOS LDO with Shutdown ERROR Output and Bypass
Features
General Description
•
•
•
•
•
The TC1173 is a precision output (typically ±0.5%)
CMOS low dropout regulator. Total supply current is
typically 50A at full load (20 to 60 times lower than in
bipolar regulators).
•
•
•
•
Extremely Low Supply Current for Longer Battery Life
Very Low Dropout Voltage
300mA Output Current
Standard or Custom Output Voltages
ERROR Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
Power Saving Shutdown Mode
Bypass Input for Ultra Quiet Operation
Over Current and Over Temperature Protection
Space-Saving MSOP Package Option
Applications
•
•
•
•
•
•
•
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
TC1173 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load) and internal feed-forward
compensation for fast response to step changes in
load. An error output (ERROR) is asserted when the
TC1173 is out-of-regulation (due to a low input voltage
or excessive output current). ERROR can be set as a
low battery warning or as a processor RESET signal
(with the addition of an external RC network). Supply
current is reduced to 0.05A (typical) and VOUT and
ERROR fall to zero when the shutdown input is low.
The TC1173 incorporates both over temperature and
over current protection. The TC1173 is stable with an
output capacitor of only 1F and has a maximum
output current of 300mA.
Typical Application
VOUT
Device Selection Table
Part Number
Package
Junction
Temp. Range
TC1173-xxVOA
8-Pin SOIC
-40°C to +125°C
TC1173-xxVUA
8-Pin MSOP
-40°C to +125°C
1
+
C1
1μF
2
VOUT
VIN
GND
NC
8
7
TC1173
3
4
NOTE: xx indicates output voltages
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
NC
Bypass
SHDN
ERROR
VIN
6
R3
1M
5
ERROR
CBYPASS
470pF
(Optional)
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Shutdown Control
(from Power Control Logic)
Package Type
8-Pin MSOP
8-Pin SOIC
VOUT
1
8
VIN
GND
NC
Bypass
2
7
6
NC
SHDN
5
ERROR
3
TC1173VUA
4
VOUT 1
GND 2
NC 3
Bypass 4
 2002-2012 Microchip Technology Inc.
8 VIN
TC1173VOA
7 NC
6 SHDN
5 ERROR
DS21362C-page 1
TC1173
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range...... -40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1173 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3F, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Parameter
Min
Typ
Max
Units
VIN
Symbol
Input Operating Voltage
2.7
—
6.0
V
IOUTMAX
Maximum Output Current
300
—
—
mA
VOUT
Output Voltage
—
VR – 2.5%
VR ±0.5%
—
—
VR + 2.5%
V
Test Conditions
Note 8
Note 1
VOUT/T
VOUT Temperature Coefficient
—
40
—
ppm/°C
VOUT/VIN
Line Regulation
—
0.05
0.35
%
(VR + 1V) VIN6V
IL = 0.1mA to IOUTMAX (Note 3)
Note 2
VOUT/VOUT
Load Regulation
—
0.5
2.0
%
VIN-VOUT
Dropout Voltage
—
—
—
20
80
240
30
160
480
mV
ISS1
Supply Current
—
50
90
A
SHDN = VIH,
ISS2
Shutdown Supply Current
—
0.05
0.5
A
SHDN = 0V
PSRR
Power Supply Rejection Ratio
—
60
—
dB
FRE 1kHz
IOUTSC
Output Short Circuit Current
—
550
650
mA
VOUT = 0V
VOUT/PD
Thermal Regulation
—
0.04
—
V/W
eN
Output Noise
—
260
—
nV/Hz
VIH
SHDN Input High Threshold
45
—
—
%VIN
VIL
SHDN Input Low Threshold
—
—
15
%VIN
IL = 0.1mA
IL = 100mA
IL = 300mA (Note 4)
Note 5
F = 1kHz, COUT = 1F,
RLOAD = 50
SHDN Input
ERROR Output
VMIN
Minimum Operating Voltage
1.0
—
—
V
VOL
Output Logic Low Voltage
—
—
400
mV
VTH
ERROR Threshold Voltage
—
0.95 x VR
—
V
ERROR Positive Hysteresis
—
50
—
mV
VOL
Note
1:
2:
3:
4:
5:
6:
7:
8:
1 mA Flows to ERROR
Note 7
VR is the user-programmed regulator output voltage setting.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
Hysteresis voltage is referenced by VR.
The minimum VIN has to justify the conditions: VIN  VR + VDROPOUT and VIN  2.7V for IL = 0.1mA to IOUTMAX.
DS21362C-page 2
 2002-2012 Microchip Technology Inc.
TC1173
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin MSOP)
Symbol
Description
1
VOUT
Regulated voltage output.
2
GND
Ground terminal.
3
NC
No connect.
4
Bypass
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
5
ERROR
Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance
by approximately – 5%.
6
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05A (typical).
7
NC
No connect.
8
VIN
Unregulated supply input.
 2002-2012 Microchip Technology Inc.
DS21362C-page 3
TC1173
3.0
DETAILED DESCRIPTION
FIGURE 3-2:
The TC1173 is a fixed output, low drop-out regulator.
Unlike bipolar regulators, the TC1173’s supply current
does not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to IOUTMAX operating load current range, (an
important consideration in RTC and CMOS RAM
battery back-up applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above VIH, and shutdown (disabled)
when SHDN is at or below VIL. SHDN may be
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05A
(typical), VOUT falls to zero and ERROR is disabled.
FIGURE 3-1:
VOUT
TYPICAL APPLICATION
CIRCUIT
1
+
C1
1μF
2
VIN
VOUT
GND
NC
8
+
R3
1M
TC1173
3
4
NC
SHDN
Bypass
ERROR
Shutdown Control
(from Power Control Logic)
CBYPASS
470pF
(Optional)
3.1
C2
1μF
7
Battery
+
–
6
5
RESET or
Battery Low
C3
0.2μF
C3 required only if ERROR
is used as a processor RESET signal.
(see text)
ERROR Output
ERROR is driven low whenever VOUT falls out of
regulation by more than – 5% (typical). This condition
may be caused by low input voltage, output current
limiting, or thermal limiting. The ERROR threshold is
5% below rated VOUT regardless of the programmed
output voltage value (e.g., ERROR = VOL at 4.75V
(typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V
regulator). ERROR output operation is shown in
Figure 3-2.
ERROR OUTPUT
OPERATION
VOUT
HYSTERESIS (VH)
VTH
ERROR
VIH
VOL
3.2
Output Capacitor
A 1F (min) capacitor from VOUT to ground is
recommended. The output capacitor should have an
effective series resistance greater than 0.1 and less
than 5.0. A 1F capacitor should be connected from
VIN to GND if there is more than 10 inches of wire
between the regulator and the AC filter capacitor, or if a
battery is used as the power source. Aluminum
electrolytic or tantalum capacitor types can be used.
(Since many aluminum electrolytic capacitors freeze at
approximately -30°C, solid tantalums are recommended for applications operating below -25°C.)
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
3.3
Bypass Input
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected. Larger capacitor values may be
used, but results in a longer time period to rated output
voltage when power is initially applied.
Note that ERROR is active when VOUT is at or below
VTH, and inactive when VOUT is above VTH + VH.
As shown in Figure 3-1, ERROR can be used as a
battery low flag, or as a processor RESET signal (with
the addition of timing capacitor C3). R1 x C3 should be
chosen to maintain ERROR below VIH of the processor
RESET input for at least 200 msec to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
VOUT, VIN or any other voltage less than (VIN + 0.3V).
DS21362C-page 4
 2002-2012 Microchip Technology Inc.
TC1173
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
4.2
Power Dissipation
EQUATION 4-2:
PDMAX = (TJMAX – TAMAX)
JA
Where all terms are previously defined.
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
= 3.0V ± 10%
VINMAX
VOUTMIN = 2.7V ± 0.5%
ILOADMAX = 250mA
TJMAX
= 125°C
TAMAX
= 55°C
JA
= 200°C/W
8-Pin MSOP Package
EQUATION 4-1:
PD  (VINMAX – VOUTMIN)ILOADMAX
Where:
PD
VINMAX
VOUTMIN
ILOADMAX
= Worst case actual power dissipation
= Maximum voltage on VIN
= Minimum regulator output voltage
= Maximum output (load) current
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(JA). The 8-Pin SOIC package has a JA of approximately 160°C/Watt, while the 8-Pin MSOP package
has a JA of approximately 200°C/Watt.
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD  (VINMAX – VOUTMIN)ILOADMAX
= [(3.0 x 1.1) – (2.7 x .995)]250 x 10–3
= 155mW
Maximum allowable power dissipation:
PDMAX = (TJMAX – TAMAX)
JA
= (125 – 55)
200
= 350mW
In this example, the TC1173 dissipates a maximum of
155mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 250mW into Equation 4-1, from
which VINMAX = 4.1V.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower JA and therefore
increase the maximum allowable power dissipation
limit.
 2002-2012 Microchip Technology Inc.
DS21362C-page 5
TC1173
5.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
2.00
10.0
RLOAD = 50Ω
COUT = 1μF
NOISE (μV/√HZ)
0.006
0.004
0.002
1.80
LOAD REGULATION (%)
LINE REGULATION (%)
0.010
0.008
Load Regulation
Output Noise
Line Regulation
0.012
1.0
0.1
0.000
1.60
1.40
1.20
1.00
0.80
0.60
1 to 100mA
0.40
-0.002
1 to 50mA
0.20
0.0
0.01
-0.004
-40° -20° 0° 20° 40° 60° 80° 100° 120°
0.01
TEMPERATURE (°C)
10
1
100
0.00
-40° -20° 0° 20° 40° 60° 80° 100° 120°
1000
TEMPERATURE (°C)
FREQUENCY (kHz)
Supply Current
VOUT vs. Temperature
0.40
0.35
DROPOUT VOLTAGE (V)
90.0
80.0
70.0
60.0
50.0
3.075
125°C
85°C
C
0.30
70°C
0.25
VIN = 4V
ILOAD = 100μA
CLOAD = 3.3μF
3.025
VOUT (V)
100.0
SUPPLY CURRENT (μA)
1 to 300mA
25°C
0.20
0°C
C
0.15
2.975
0.10
-40°C
0.05
40.0
-40° -20° 0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
DS21362C-page 6
0.00
0
50
100
150
200
LOAD CURRENT (mA)
250
300
2.925
-40° -20° 0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
 2002-2012 Microchip Technology Inc.
TC1173
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
 2002-2012 Microchip Technology Inc.
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
DS21362C-page 7
TC1173
6.3
Package Dimensions
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin MSOP
PIN 1
.122 (3.10)
.114 (2.90)
.197 (5.00)
.189 (4.80)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.008 (0.20)
.005 (0.13)
6° MAX.
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
DS21362C-page 8
 2002-2012 Microchip Technology Inc.
TC1173
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin SOIC
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.020 (0.51) .010 (0.25)
.013 (0.33) .004 (0.10)
.010 (0.25)
.007 (0.18)
8° MAX..
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
 2002-2012 Microchip Technology Inc.
DS21362C-page 9
TC1173
REVISION HISTORY
Revision C (November 2012)
Added a note to each package outline drawing.
DS21362C-page 10
 2002-2012 Microchip Technology Inc.
TC1173
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002-2012 Microchip Technology Inc.
DS21362C-page11
TC1173
NOTES:
DS21362C-page12
 2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
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FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
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SQTP is a service mark of Microchip Technology Incorporated
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GestIC and ULPP are registered trademarks of Microchip
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All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767375
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2002-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
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DS21362C-page 13
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Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21362C-page 14
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
10/26/12
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