TC1173 300mA CMOS LDO with Shutdown ERROR Output and Bypass Features General Description • • • • • The TC1173 is a precision output (typically ±0.5%) CMOS low dropout regulator. Total supply current is typically 50A at full load (20 to 60 times lower than in bipolar regulators). • • • • Extremely Low Supply Current for Longer Battery Life Very Low Dropout Voltage 300mA Output Current Standard or Custom Output Voltages ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator Power Saving Shutdown Mode Bypass Input for Ultra Quiet Operation Over Current and Over Temperature Protection Space-Saving MSOP Package Option Applications • • • • • • • Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers TC1173 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load) and internal feed-forward compensation for fast response to step changes in load. An error output (ERROR) is asserted when the TC1173 is out-of-regulation (due to a low input voltage or excessive output current). ERROR can be set as a low battery warning or as a processor RESET signal (with the addition of an external RC network). Supply current is reduced to 0.05A (typical) and VOUT and ERROR fall to zero when the shutdown input is low. The TC1173 incorporates both over temperature and over current protection. The TC1173 is stable with an output capacitor of only 1F and has a maximum output current of 300mA. Typical Application VOUT Device Selection Table Part Number Package Junction Temp. Range TC1173-xxVOA 8-Pin SOIC -40°C to +125°C TC1173-xxVUA 8-Pin MSOP -40°C to +125°C 1 + C1 1μF 2 VOUT VIN GND NC 8 7 TC1173 3 4 NOTE: xx indicates output voltages Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0. NC Bypass SHDN ERROR VIN 6 R3 1M 5 ERROR CBYPASS 470pF (Optional) Other output voltages are available. Please contact Microchip Technology Inc. for details. Shutdown Control (from Power Control Logic) Package Type 8-Pin MSOP 8-Pin SOIC VOUT 1 8 VIN GND NC Bypass 2 7 6 NC SHDN 5 ERROR 3 TC1173VUA 4 VOUT 1 GND 2 NC 3 Bypass 4 2002-2012 Microchip Technology Inc. 8 VIN TC1173VOA 7 NC 6 SHDN 5 ERROR DS21362C-page 1 TC1173 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature..........................-65°C to +150°C Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1173 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3F, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameter Min Typ Max Units VIN Symbol Input Operating Voltage 2.7 — 6.0 V IOUTMAX Maximum Output Current 300 — — mA VOUT Output Voltage — VR – 2.5% VR ±0.5% — — VR + 2.5% V Test Conditions Note 8 Note 1 VOUT/T VOUT Temperature Coefficient — 40 — ppm/°C VOUT/VIN Line Regulation — 0.05 0.35 % (VR + 1V) VIN6V IL = 0.1mA to IOUTMAX (Note 3) Note 2 VOUT/VOUT Load Regulation — 0.5 2.0 % VIN-VOUT Dropout Voltage — — — 20 80 240 30 160 480 mV ISS1 Supply Current — 50 90 A SHDN = VIH, ISS2 Shutdown Supply Current — 0.05 0.5 A SHDN = 0V PSRR Power Supply Rejection Ratio — 60 — dB FRE 1kHz IOUTSC Output Short Circuit Current — 550 650 mA VOUT = 0V VOUT/PD Thermal Regulation — 0.04 — V/W eN Output Noise — 260 — nV/Hz VIH SHDN Input High Threshold 45 — — %VIN VIL SHDN Input Low Threshold — — 15 %VIN IL = 0.1mA IL = 100mA IL = 300mA (Note 4) Note 5 F = 1kHz, COUT = 1F, RLOAD = 50 SHDN Input ERROR Output VMIN Minimum Operating Voltage 1.0 — — V VOL Output Logic Low Voltage — — 400 mV VTH ERROR Threshold Voltage — 0.95 x VR — V ERROR Positive Hysteresis — 50 — mV VOL Note 1: 2: 3: 4: 5: 6: 7: 8: 1 mA Flows to ERROR Note 7 VR is the user-programmed regulator output voltage setting. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. Hysteresis voltage is referenced by VR. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX. DS21362C-page 2 2002-2012 Microchip Technology Inc. TC1173 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin SOIC) (8-Pin MSOP) Symbol Description 1 VOUT Regulated voltage output. 2 GND Ground terminal. 3 NC No connect. 4 Bypass Reference bypass input. Connecting a 470pF to this input further reduces output noise. 5 ERROR Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance by approximately – 5%. 6 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05A (typical). 7 NC No connect. 8 VIN Unregulated supply input. 2002-2012 Microchip Technology Inc. DS21362C-page 3 TC1173 3.0 DETAILED DESCRIPTION FIGURE 3-2: The TC1173 is a fixed output, low drop-out regulator. Unlike bipolar regulators, the TC1173’s supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05A (typical), VOUT falls to zero and ERROR is disabled. FIGURE 3-1: VOUT TYPICAL APPLICATION CIRCUIT 1 + C1 1μF 2 VIN VOUT GND NC 8 + R3 1M TC1173 3 4 NC SHDN Bypass ERROR Shutdown Control (from Power Control Logic) CBYPASS 470pF (Optional) 3.1 C2 1μF 7 Battery + – 6 5 RESET or Battery Low C3 0.2μF C3 required only if ERROR is used as a processor RESET signal. (see text) ERROR Output ERROR is driven low whenever VOUT falls out of regulation by more than – 5% (typical). This condition may be caused by low input voltage, output current limiting, or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output voltage value (e.g., ERROR = VOL at 4.75V (typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 3-2. ERROR OUTPUT OPERATION VOUT HYSTERESIS (VH) VTH ERROR VIH VOL 3.2 Output Capacitor A 1F (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 3.3 Bypass Input A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. Note that ERROR is active when VOUT is at or below VTH, and inactive when VOUT is above VTH + VH. As shown in Figure 3-1, ERROR can be used as a battery low flag, or as a processor RESET signal (with the addition of timing capacitor C3). R1 x C3 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 msec to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). DS21362C-page 4 2002-2012 Microchip Technology Inc. TC1173 4.0 THERMAL CONSIDERATIONS 4.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. 4.2 Power Dissipation EQUATION 4-2: PDMAX = (TJMAX – TAMAX) JA Where all terms are previously defined. Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: = 3.0V ± 10% VINMAX VOUTMIN = 2.7V ± 0.5% ILOADMAX = 250mA TJMAX = 125°C TAMAX = 55°C JA = 200°C/W 8-Pin MSOP Package EQUATION 4-1: PD (VINMAX – VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). The 8-Pin SOIC package has a JA of approximately 160°C/Watt, while the 8-Pin MSOP package has a JA of approximately 200°C/Watt. Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.1) – (2.7 x .995)]250 x 10–3 = 155mW Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) JA = (125 – 55) 200 = 350mW In this example, the TC1173 dissipates a maximum of 155mW; below the allowable limit of 350mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 250mW into Equation 4-1, from which VINMAX = 4.1V. 4.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit. 2002-2012 Microchip Technology Inc. DS21362C-page 5 TC1173 5.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 2.00 10.0 RLOAD = 50Ω COUT = 1μF NOISE (μV/√HZ) 0.006 0.004 0.002 1.80 LOAD REGULATION (%) LINE REGULATION (%) 0.010 0.008 Load Regulation Output Noise Line Regulation 0.012 1.0 0.1 0.000 1.60 1.40 1.20 1.00 0.80 0.60 1 to 100mA 0.40 -0.002 1 to 50mA 0.20 0.0 0.01 -0.004 -40° -20° 0° 20° 40° 60° 80° 100° 120° 0.01 TEMPERATURE (°C) 10 1 100 0.00 -40° -20° 0° 20° 40° 60° 80° 100° 120° 1000 TEMPERATURE (°C) FREQUENCY (kHz) Supply Current VOUT vs. Temperature 0.40 0.35 DROPOUT VOLTAGE (V) 90.0 80.0 70.0 60.0 50.0 3.075 125°C 85°C C 0.30 70°C 0.25 VIN = 4V ILOAD = 100μA CLOAD = 3.3μF 3.025 VOUT (V) 100.0 SUPPLY CURRENT (μA) 1 to 300mA 25°C 0.20 0°C C 0.15 2.975 0.10 -40°C 0.05 40.0 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C) DS21362C-page 6 0.00 0 50 100 150 200 LOAD CURRENT (mA) 250 300 2.925 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C) 2002-2012 Microchip Technology Inc. TC1173 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin MSOP Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) 2002-2012 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in DS21362C-page 7 TC1173 6.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05) .008 (0.20) .005 (0.13) 6° MAX. .028 (0.70) .016 (0.40) Dimensions: inches (mm) DS21362C-page 8 2002-2012 Microchip Technology Inc. TC1173 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8° MAX.. .050 (1.27) .016 (0.40) Dimensions: inches (mm) 2002-2012 Microchip Technology Inc. DS21362C-page 9 TC1173 REVISION HISTORY Revision C (November 2012) Added a note to each package outline drawing. DS21362C-page 10 2002-2012 Microchip Technology Inc. TC1173 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002-2012 Microchip Technology Inc. DS21362C-page11 TC1173 NOTES: DS21362C-page12 2002-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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