TC2054/2055/2186 50mA, 100mA, and 150mA CMOS LDOs with Shutdown and Error Output Features General Description • Very Low Supply Current (55µA Typ.) for Longer Battery Life • Very Low Dropout Voltage: 140mV (Typ.) @ 150mA • High Output Voltage Accuracy: ±0.4% (Typ) • Standard or Custom Output Voltages • Power-Saving Shutdown Mode • ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator • Fast Shutdown Reponse Time: 60µsec (Typ) • Over-Current Protection • Space-Saving 5-Pin SOT-23A Package • Pin Compatible Upgrades for Bipolar Regulators The TC2054, TC2055 and TC2186 are high accuracy (typically ±0.4%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for battery-operated systems, the devices’ total supply current is typically 55µA at full load (20 to 60 times lower than in bipolar regulators). Applications • • • • • • The devices’ key features include ultra low noise operation, very low dropout voltage - typically 45mV (TC2054); 90mV (TC2055); and 140mV (TC2186) at full load - and fast response to step changes in load. An error output (ERROR) is asserted when the devices are out-of-regulation (due to a low input voltage or excessive output current). Supply current is reduced to 0.5µA (max) and both VOUT and ERROR are disabled when the shutdown input is low. The devices also incorporate over-current protection. The TC2054, TC2055 and TC2186 are stable with a low esr ceramic output capacitor of 1µF and have a maximum output current of 50mA, 100mA and 150mA, respectively. This LDO Family also features a fast response time (60µsec typically) when released from shutdown. Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSMS / PHS Phones Pagers Typical Application Device Selection Table Part Number Package Junction Temp. Range TC2054-xxVCT 5-Pin SOT-23A* -40°C to +125°C TC2055-xxVCT 5-Pin SOT-23A* -40°C to +125°C TC2186-xxVCT 5-Pin SOT-23A* -40°C to +125°C Note: 1 VIN 2 3 5 4 VOUT 1µF Package Type ERROR 5 1µF GND *5-Pin SOT-23A is equivalent to EIAJ (SC-74A). VOUT VOUT VIN SHDN TC2054 TC2055 TC2186 1M ERROR 4 ERROR Shutdown Control (from Power Control Logic) TC2054 TC2055 TC2186 1 2 3 VIN GND SHDN 5-Pin SOT-23A* TOP VIEW 2002 Microchip Technology Inc. DS21663B-page 1 TC2054/2055/2186 1.0 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS* Input Voltage .........................................................6.5V Output Voltage................................(-0.3) to (VIN + 0.3) Operating Temperature .................. -40°C < TJ< 125°C *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods my affect device reliability. Storage Temperature.......................... -65°C to +150°C Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V TC2054/2055/2186 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VR + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V Note 1 IOUTMAX Maximum Output Current 50 100 150 — — — — — — mA TC2054 TC2055 TC2186 V Note 2 VOUT Output Voltage VR - 2.0% VR ± 0.4% VR + 2.0% TCVOUT VOUT Temperature Coefficient — — 20 40 — — ∆VOUT/ ∆VIN Line Regulation — 0.05 0.5 % (VR + 1V) < VIN < 6V ∆VOUT/ VOUT Load Regulation -1.5 -2.5 0.5 0.5 0.5 0.5 % TC2054;TC2055 TC2186 Note 4 VIN – VOUT Dropout Voltage, Note 5 — — — — 2 45 90 140 — 70 140 210 mV ppm/°C Note 3 TC2015; TC2185 TC2185 Note 5 IIN Supply Current — 55 80 µA SHDN = VIH, IL=0 IINSD Shutdown Supply Current — 0.05 0.5 µA SHDN = 0V FRE ≤ 120kHz PSRR Power Supply Rejection Ratio IOUTSC Output Short Circuit Current ∆VOUT∆PD IL = 0.1mA to IOUTMAX IL = 0.1mA to IOUTMAX IL = 100µA IL = 50mA IL = 100mA IL = 150mA — 50 — dB 160 300 — mA VOUT = 0V Thermal Regulation — 0.04 — V/W Note 6 eN Output Noise — 600 — nV / √Hz IL = IOUTMAX, F = 10kHz tR Response Time (from Shutdown Mode) — 60 — µsec VIN = 4V CIN = 1µF, COUT = 10µF IL = 0.1mA, Note 9 Note 1: 2: 3: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. 6 TCVOUT = 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Hysteresis voltage is referenced by VR. Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. 5: 6: 7: 8: 9: ( V OU TMAX – VOUTMIN ) × 10 ----------------------------------------------------------------------------------------V × ∆T OUT DS21663B-page 2 2002 Microchip Technology Inc. TC2054/2055/2186 Electrical Characteristics: VIN = VR + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions SHDN Input VIH SHDN Input High Threshold 60 — — %VIN VIN = 2.5V to 6.0V VIL SHDN Input Low Threshold — — 15 %VIN VIN = 2.5V to 6.0V 1.0 — — V ERROR OUTPUT VINMIN Minimum VIN Operating Voltage VOL Output Logic Low Voltage — — 400 mV VTH ERROR Threshold Voltage — 0.95 x VR — V VHYS ERROR Positive Hysteresis — 50 — mV tDELAY VOUT to ERROR Delay — 2 — msec RERROR Resistance from ERROR to GND — 126 — Ω Note 1 mA Flows to ERROR See Figure 4-2 Note 8 VOUT from VR = 3V to 2.8V VDD = 2.5V, VOUT = 2.5V 1: 2: 3: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. TCVOUT = 6 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Hysteresis voltage is referenced by VR. Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. 5: 6: 7: 8: 9: 2.0 VOUT ≥ 2.7V (V –V ) × 10 OU TMAX OUTMIN ----------------------------------------------------------------------------------------V OUT × ∆ T PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin Number PIN FUNCTION TABLE Symbol 1 VIN 2 GND 3 SHDN 4 ERROR 5 VOUT 2002 Microchip Technology Inc. Description Unregulated supply input. Ground terminal. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero, ERROR is open circuited and supply current is reduced to 0.5µA (max). Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance by approximately -5%. Regulated voltage output. DS21663B-page 3 TC2054/2055/2186 3.0 DETAILED DESCRIPTION FIGURE 3-2: The TC2054, TC2055 and TC2186 are precision fixed output voltage regulators. (If an adjustable version is desired, please see the TC1070, TC1071 or TC1187 data sheets.) Unlike bipolar regulators, the TC2054, TC2055 and TC2186 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to maximum output current operating load range. VOUT Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above V IH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05µA (typical), V OUT falls to zero volts, and ERROR is open-circuited. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT BATTERY VOUT VOUT VIN 1µF 1µF C1 GND TC2054 TC2055 TC2186 V+ SHDN Shutdown Control (to CMOS Logic or Tie to VIN if unused) 3.1 ERROR C2 Required Only if ERROR is used as a Processor RESET Signal (See Text) R1 1M 0.2µF C2 ERROR OUTPUT OPERATION HYSTERESIS (VHYS) VTH ERROR VIH VOL 3.2 Output Capacitor A 1µF (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance of 0.01Ω. to 5Ω for VOUT = 2.5V, and 0.05Ω. to 5Ω for VOUT < 2.5V. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Ceramic, tantalum and aluminum electrolytic capacitors can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. BATTLOW or RESET ERROR Open Drain Output ERROR is driven low whenever VOUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output voltage value (e.g. ERROR = VOL at 4.75V (typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active when V OUT falls to VTH, and inactive when VOUT rises above VTH by VHYS. As shown in Figure 3-1, ERROR can be used as a battery low flag or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200msec to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). The ERROR pin sink current is self-limiting to approximately 18mA. DS21663B-page 4 2002 Microchip Technology Inc. TC2054/2055/2186 4.0 THERMAL CONSIDERATIONS 4.1 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: The following equation is used to calculate worst case power dissipation: VINMAX = 3.0V ±5% VOUTMIN = 2.7V – 2.5% ILOADMAX = 40mA TAMAX = 55°C EQUATION 4-1: PD ≈ (VIN – V OUTMIN)ILOADMAX Find 1. Actual power dissapation : 2. Maximum allowable dissapation Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Actual power dissipation: PD Maximum output (load) current ≈ (VINMAX – V OUTMIN)ILOADMAX = [(3.0 x 1.05) – (2.7 x .975)]40 x 10–3 = 20.7mW The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125 °C) and the thermal resistance from junction-to-air (θJA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt when mounted on a typical two layer FR4 dielectric copper clad PC board. Maximum allowable power dissipation: PD ( 125 – 55 ) --------------------------220 EQUATION 4-2: PD MAX ( TJ – TA ) M AX MAX = ------------------------------------θ JA MAX TJ – TA M AX MAX = ---------------------------------θ JA Where all terms are previously defined = 318mW In this example, the TC2054 dissipates a maximum of only 20.7mW; far below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. 4.2 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and, therefore, increase the maximum allowable power dissipation limit. 2002 Microchip Technology Inc. DS21663B-page 5 TC2054/2055/2186 5.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 5-1: 0 POWER SUPPLY REJECTION RATIO FIGURE 5-4: 0 VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V IOUT = 100µA COUT = 1mF Ceramic VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V IOUT = 150mA COUT = 10µF Ceramic -20 PSRR (dB) -20 PSRR (dB) POWER SUPPLY REJECTION RATIO -40 -60 -40 -60 -80 -80 -100 -100 10 100 1k 10k 100k 10 1M 100 1k FIGURE 5-2: 0 FIGURE 5-5: POWER SUPPLY REJECTION RATIO 0 VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V IOUT = 150mA COUT = 1µF Ceramic 100k 1M POWER SUPPLY REJECTION RATIO VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V IOUT = 150mA COUT = 10µF Tantalum -20 PSRR (dB) -20 PSRR (dB) 10k f (Hz) f (Hz) -40 -60 -40 -60 -80 -80 -100 -100 10 100 1k 10k 100k 10 1M 100 1k FIGURE 5-3: 10k 100k 1M f (Hz) f (Hz) FIGURE 5-6: OUTPUT NOISE DROPOUT VOLTAGE VS. ILOAD 0.160 10 VOUT = 1.8V 0.140 0.120 0.100 DOV (V) Noise (mV/√Hz) 1 COUT = 1µF 0.1 T = 25˚C T = 130˚C 0.080 T = -45˚C 0.060 0.01 0.040 0.020 0.001 0.000 0.01 0.1 1 10 Frequency (KHz) DS21663B-page 6 100 1000 0 100 50 150 ILOAD (mA) 2002 Microchip Technology Inc. TC2054/2055/2186 TYPICAL CHARACTERISTICS (CONT) FIGURE 5-7: FIGURE 5-10: OUTPUT VOLTAGE VS. OUTPUT CURRENT IDD VS. TEMPERATURE 65.00 1.9 VOUT = 1.8V 63.00 1.88 1.86 1.84 59.00 VOUT (V) IDD (mA) 61.00 VIN = 2.8V 1.82 VIN = 2.8V 1.8 1.78 57.00 1.76 55.00 1.74 1.72 53.00 -45 5 55 105 1.7 155 0 Temp (˚C) 15 30 45 60 75 90 105 120 135 150 ILOAD (mA) FIGURE 5-8: OUTPUT VOLTAGE VS. TEMPERATURE FIGURE 5-11: OUTPUT VOLTAGE VS. SUPPLY VOLTAGE 2.9 VOUT = 2.8V IOUT = 0.1mA 2.85 2.9 VIN = 6.5V 2.85 VOUT = 2.8V IOUT = 0.1mA Temp = +130˚C 2.8 VIN = 3.8V 2.75 2.7 VOUT (V) VOUT (V) 2.75 2.8 VIN = 6.0V 2.65 Temp = +25˚C Temp = -45˚C 2.7 2.65 2.6 2.6 2.55 2.55 2.5 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 145 2.5 3.5 Temperature (˚C) 4 4.5 5 5.5 6 6.5 7 VIN (V) FIGURE 5-9: OUTPUT VOLTAGE VS. TEMPERATURE FIGURE 5-12: OUTPUT VOLTAGE VS. SUPPLY VOLTAGE 1.9 VOUT = 1.8V IOUT = 0.1mA 1.88 1.9 1.86 1.84 VIN = 6.0V 1.86 VIN = 6.5V 1.82 1.84 1.8 VOUT (V) VOUT (V) VOUT = 1.8V IOUT = 0.1mA 1.88 1.78 VIN = 2.8V 1.76 Temp = +130˚C 1.82 1.8 1.78 Temp = +25˚C Temp = -45˚C 1.74 1.76 1.72 1.74 1.7 1.72 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 145 1.7 Temperature (˚C) 2.7 3.2 3.7 4.2 4.7 5.2 5.7 6.2 6.7 VIN (V) 2002 Microchip Technology Inc. DS21663B-page 7 TC2054/2055/2186 TYPICAL CHARACTERISTICS (CONT) FIGURE 5-13: LOAD TRANSIENT RESPONSE FIGURE 5-16: LOAD TRANSIENT RESPONSE V IN = 3.8V VOUT = 2.8V C IN = 1 µF Ceramic V IN = 3.0V VOUT = 2.8V C IN = 1µF Ceramic C OUT= 1 µF Ceramic Frequency = 1 KHz C OUT= 10µF Ceramic Frequency = 10KHz V OUT 100mV/DIV V OUT 100mV / DIV Load Current Load Current 150mA Load 100µA FIGURE 5-14: LOAD TRANSIENT RESPONSE IN DROPOUT MODE 150mA Load 100µA FIGURE 5-17: SHUTDOWN DELAY V IN = 4.0V VOUT = 3.0V C OUT = 10µF C BYP = 0.01µF I OUT = 100µA Load Transient Response in Dropout Mode VOUT 100mV/DIV V SHDN 150mA VIN = 3.105V VOUT = 3.006V CIN = 1µF Ceramic COUT = 1µF Ceramic RLOAD = 20Ω V OUT 100µA FIGURE 5-18: SHUTDOWN WAKE-UP TIME FIGURE 5-15: LINE TRANSIENT RESPONSE V SHDN VOUT = 2.8V C OUT= 1µF Ceramic C BYP = 470pF I OUT= 100µA 50mV / DIV V OUT V OUT 2V / DIV Input Voltage 6V 4V V IN = 4.0V VOUT = 3.0V C OUT = 10µF C BYP = 0.01µF I OUT = 100µA DS21663B-page 8 2002 Microchip Technology Inc. TC2054/2055/2186 TYPICAL CHARACTERISTICS (CONT) FIGURE 5-19: VOUT TO ERROR DELAY RPULLUP = 100kΩ IOUT = 0.3mA VIN 1V/Div 3.42V 2.8V VOUT 1V/Div 3.0V 2.8V VERROR 2V/Div 0V 2002 Microchip Technology Inc. DS21663B-page 9 TC2054/2055/2186 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Pin SOT-23A 1 & 2 = part number code + temperature range and voltage (V) TC2054 Code TC2055 Code TC2186 Code 1.8 SA TA VA 2.5 SB TB VB 2.7 SC TC VC 2.8 SD TD VD 2.85 SE TE VE 3.0 SF TF VF 3.3 SG TG VG 3 represents year and 2-month period code 4 represents lot ID number 6.2 Taping Information Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) Reverse Reel Component Orientation RT Suffix Device (Mark Upside Down) Carrier Tape, Number of Components Per Reel and Reel Size Package 5-Pin SOT-23A DS21663B-page 10 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8 mm 4 mm 3000 7 in 2002 Microchip Technology Inc. TC2054/2055/2186 6.3 Package Dimensions SOT-23A-5 .075 (1.90) REF. .071 (1.80) .059 (1.50) .122 (3.10) .098 (2.50) .020 (0.50) .012 (0.30) PIN 1 .037 (0.95) REF. .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .010 (0.25) .004 (0.09) 10° MAX. .024 (0.60) .004 (0.10) Dimensions: inches (mm) 2002 Microchip Technology Inc. DS21663B-page 11 TC2054/2055/2186 NOTES: DS21663B-page 12 2002 Microchip Technology Inc. TC2054/2055/2186 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21663B-page 13 TC2054/2055/2186 NOTES: DS21663B-page 14 2002 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. 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B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 San Jose Hong Kong Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 New York Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 *DS21663B* DS21663B-page 16 03/01/02 2002 Microchip Technology Inc.