Data Sheet

PTN3393
2-lane DisplayPort to VGA adapter IC
Rev. 4 — 10 June 2014
Product data sheet
1. General description
The PTN3393 is a DisplayPort to VGA adapter IC designed to connect a DisplayPort
source to a VGA sink. The PTN3393 integrates a DisplayPort receiver and a high-speed
triple video digital-to-analog converter that supports display resolutions from VGA to
WUXGA (see Table 5). The PTN3393 supports either one or two DisplayPort v1.1a lanes
operating at either 2.7 Gbit/s or 1.62 Gbit/s per lane. The PTN3393 has ‘Flash-over-AUX’
capability enabling simple firmware upgradability in the field.
The PTN3393 supports I2C-bus over AUX per DisplayPort v1.1a specification (Ref. 1),
and bridges the VESA DDC channel to the DisplayPort Interface.
The PTN3393 is designed for single supply and minimizes application costs. It can be
powered directly from the DisplayPort source side 3.3 V supply without a need for
additional core voltage regulator. The VGA output is powered down when there is no valid
DisplayPort source data being transmitted. The PTN3393 also aids in monitor detection
by performing load sensing and reporting sink connection status to the source.
2. Features and benefits
2.1 VESA-compliant DisplayPort v1.1a converter
 Main Link: 1-lane and 2-lane modes supported
 HBR (High Bit Rate) at 2.7 Gbit/s per lane
 RBR (Reduced Bit Rate) at 1.62 Gbit/s per lane
 BER (Bit Error Rate) better than 109
 Down-spreading SSC (Spread Spectrum Clocking) supported
 1 MHz AUX channel
 Supports native AUX CH syntax
 Supports I2C-bus over AUX CH syntax
 Hot Plug Detect (HPD) signal to the source
 Cost-effective design optimized for VGA application
2.2 DDC channel output
 Supports 100 kbit/s I2C-bus speed, declared in DPCD register
 Support of I2C-bus speed control by DisplayPort source via DPCD registers,
facilitating use of longer VGA cables
2
 I C Over Aux feature facilitates full support of MCCS, DDC-CI, and DDC protocols
(see Ref. 2)
PTN3393
NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
2.3 Analog video output






VSIS 1.2 compliance (Ref. 3) for all supported video output modes
Analog RGB current-source outputs
VSYNC and HSYNC outputs
Pixel clock up to 240 MHz
Triple 8-bit Digital-to-Analog Converter (DAC)
Direct drive of double terminated 75  load with standard 700 mV (peak-to-peak)
signals
2.4 General features
 Supports ‘Flash-over-AUX’ field upgradability
 Monitor presence detection. Connection/disconnection reported via HPD IRQ and
DPCD update.
 All display resolutions from VGA to WUXGA are supported1, including e.g.:
 WUXGA: 6 bits, 1920  1200, 60 Hz, 193 MHz pixel clock rate
 WUXGA: 1920  1200, 60 Hz, reduced blanking, 154 MHz pixel clock rate
 UXGA: 1600  1200, 60 Hz, 162 MHz pixel clock rate
 SXGA: 1280  1024, 60 Hz, 108 MHz pixel clock rate
 XGA: 1024  768, 60 Hz, 65 MHz pixel clock rate
 SVGA: 800  600, 60 Hz, 40 MHz pixel clock rate
 VGA: 640  480, 60 Hz, 25 MHz pixel clock rate
 Any resolution and refresh rates are supported up to 8 bit color
 Bits per color (bpc) supported1
 6, 8 bits supported
 10, 12, 16 bits supported by truncation to 8 MSBs
 All VGA colorimetry formats (RGB) supported
 Power modes
 Active-mode power consumption:
~600 mW at UXGA / 162 MHz pixel clock
~500 mW at SXGA / 108 MHz pixel clock
 ~40 mW at Low-power mode or before link training started
 On-board crystal oscillator for use with external 27 MHz crystal
 ESD protection: 7 kV ESD HBM JEDEC
 3.3 V  10 % power supply
 Commercial temperature range: 0 C to 85 C
 40-pin HVQFN, 6 mm  6 mm  0.85 mm (nominal); 0.5 mm pitch; lead-free package
1.
Except for color depth beyond 8 bits, display resolutions and refresh rates are only limited to those which a standard 2-lane
DisplayPort configuration is able to support.
PTN3393
Product data sheet
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2-lane DisplayPort to VGA adapter IC
3. Applications
 Dongle PC accessory
 Dongle connected to PC DisplayPort output and connected to RGB monitor via
VGA cable
 PTN3393 is powered by the DP_PWR pin on the DisplayPort connector
 Desktop and notebook computers
 Notebook docking stations
4. Ordering information
Table 1.
Ordering information
Type number
Topside mark
PTN3393BS[1]
PTN3393BS/FX[2]
Package
Name
Description
Version
PTN3393
HVQFN40
plastic thermal enhanced very thin quad flat package;
no leads; 40 terminals; 6  6  0.85 mm
SOT618-6
PTN3393
HVQFN40
plastic thermal enhanced very thin quad flat package;
no leads; 40 terminals; 6  6  0.85 mm
SOT618-6
[1]
PTN3393BS uses latest firmware version.
[2]
PTN3393BS/FX uses specific firmware version (‘X’ = 1, 2, 3, etc., and changes according to firmware version).
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
part number
Package
PTN3393BS[1]
PTN3393BSY
PTN3393BS/FX[2]
PTN3393BS/FXY
Packing method
Minimum
order
quantity
Temperature
HVQFN40 Reel 13” Q1/T1
*Standard mark SMD dry pack
4000
Tamb = 0 C to +85 C
HVQFN40 Reel 13” Q1/T1
*Standard mark SMD dry pack
4000
Tamb = 0 C to +85 C
[1]
PTN3393BS uses latest firmware version.
[2]
PTN3393BS/FX uses specific firmware version (‘X’ = 1, 2, 3, etc., and changes according to firmware version).
PTN3393
Product data sheet
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Rev. 4 — 10 June 2014
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PTN3393
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2-lane DisplayPort to VGA adapter IC
5. Functional diagram
PTN3393
10b/8b
DIFF CDR,
RCV S2P
lane 1
DE-SCRAM
Vbias
ISOCHRONOUS LINK
TIME
CONV.
VIDEO DAC SUBSYSTEM
R[7:0]
DAC
G[7:0]
MAIN
STREAM
B[7:0]
TIMING RECOVERY
DPCD
REGISTERS
DAC
DAC
MONITOR
PRESENCE
DETECT
INTERFACE DE-SKEWING
10b/8b
DIFF CDR,
RCV S2P
lane 0
RX PHY DIGITAL
DE-SCRAM
RX PHY
ANALOG
SUBSYSTEM
R
VGA
OUTPUT
G
B
H, V
sync
HSYNC
VSYNC
CONTROL
FLASH
MCU
Vbias
RCV
AUX
MANCHESTER
CODEC
AUX COMMAND
LEVEL MODULE
I2C-BUS
MASTER
SCL
SDA
DRV
RX ACLI
Vbias
RX DIGITAL SUBSYSTEM
002aah229
Fig 1.
Functional diagram
PTN3393
Product data sheet
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PTN3393
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2-lane DisplayPort to VGA adapter IC
6. Pinning information
31 RED
32 n.c.
33 OSC_IN
34 OSC_OUT
35 LDOCAP_DIG
36 VDDD33_CORE
37 S0
38 S1
40 S3
terminal 1
index area
39 S2
6.1 Pinning
VDDA33_AUX
1
30 RSET
LDOCPA_AUX
2
29 n.c.
AUX_P
3
28 GRN
AUX_N
4
27 VDDA33_DAC
RRX
5
ML0_P
6
ML0_N
7
24 VSYNC
n.c.
8
23 n.c.
ML1_P
9
25 HSYNC
22 SDA
SCL 20
TDI 19
TRST 18
TMS 17
TDO 16
TCK 15
21 VDDD33_IO
VDDA33_DP 14
HPD 13
CLK_O 12
GND(1)
RESET 11
ML1_N 10
26 BLU
PTN3393BS
002aah226
Transparent top view
Fig 2.
PTN3393
Product data sheet
Pin configuration for HVQFN40
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PTN3393
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2-lane DisplayPort to VGA adapter IC
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Type
Description
VDDD33_CORE
36
power
Digital core 3.3 V supply voltage
VDDA33_AUX
1
power
Analog AUX, bias and PLL 3.3 V supply
voltage
VDDA33_DP
14
power
Analog 3.3 V supply for DisplayPort receiver
module
VDDD33_IO
21
power
I/O 3.3 V supply voltage
VDDA33_DAC
27
power
Analog 3.3 V supply for DAC
LDOCAP_AUX
2
power
1.8 V AUX supply decoupling
LDOCAP_DIG
35
power
1.8 V digital core supply decoupling
ML0_P
6
self-biasing
differential input
DisplayPort main lane signal lane 0, positive
ML0_N
7
self-biasing
differential input
DisplayPort main lane signal lane 0,
negative
ML1_P
9
self-biasing
differential input
DisplayPort main lane signal lane 1, positive
ML1_N
10
self-biasing
differential input
DisplayPort main lane signal lane 1,
negative
AUX_P
3
self-biasing differential DisplayPort auxiliary channel signal, positive
input/output
AUX_N
4
self-biasing differential DisplayPort auxiliary channel signal,
input/output
negative
HPD
13
3.3 V TTL
single-ended output
Power
DisplayPort
Hot Plug Detect
RGB DAC outputs
BLU
26
analog output
‘blue’ current analog output
GRN
28
analog output
‘green’ current analog output
RED
31
analog output
‘red’ current analog output
RSET
30
analog input/output
DAC full-scale current control resistor.
Pull down to ground by an external
1.2 k  1 % resistor.
SCL
20
single-ended 5 V
open-drain DDC I/O
5 V sink-side DDC clock I/O. Pulled up by
external resistor to 5 V.
SDA
22
single-ended 5 V
open-drain DDC I/O
5 V sink-side DDC data I/O. Pulled up by
external resistor to 5 V.
HSYNC
25
single-ended 3.3 V
TTL output
horizontal sync signal to monitor
VSYNC
24
single-ended 3.3 V
TTL output
vertical sync signal to monitor
DDC
Monitor-side sync
PTN3393
Product data sheet
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PTN3393
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2-lane DisplayPort to VGA adapter IC
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
TCK
15
input
JTAG clock input
TDO
16
output
JTAG data output
TMS
17
input
JTAG mode select input
TRST
18
input
JTAG reset (active LOW) input
TDI
19
input
JTAG data input
37
input
Open (internal pull-down) = logic 0
JTAG
Miscellaneous
S0
Implement VGA-side monitor detect
according to VESA DisplayPort Standard
v1.1a, sections 7 and 8.
HIGH (external pull-up) = logic 1
Set HPD HIGH upon VGA monitor
detection; set HPD LOW upon VGA
monitor detachment.
S1
38
input
reserved; leave open-circuit (default internal
pull-down)
S2
39
input
Open (internal pull-down) = logic 0 to set
default I2C-bus speed to 50 kbit/s.
HIGH (external pull-up) = logic 1, to set
default I2C-bus speed to 10 kbit/s.
This pin may be left open-circuit (internal
pull-down) or tied to VDD according to the
desired default I2C-bus speed. See more
explanation about S2 pin setting and DPCD
register 00109h.
S3
40
input
reserved; leave open-circuit (default internal
pull-down)
RESET
11
input
Hardware reset input (active LOW); internal
pull-up. A capacitor must be connected
between this pin and ground. A 1 F
capacitor is recommended.
CLK_O
12
output
DisplayPort receiver test clock output
OSC_IN
33
input
crystal oscillator input
OSC_OUT
34
output
crystal oscillator output
RRX
5
input
Receiver termination resistance control. A
12 k resistor must be connected between
this pin and LDOCAP_AUX (pin 2).
n.c.
8, 23,
29, 32
-
not connected
GND[1]
-
power
central supply ground connection
(exposed die pad)
[1]
PTN3393
Product data sheet
HVQFN40 package die supply ground is connected to exposed center pad. Exposed center pad must be
connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level
performance, the exposed pad must be soldered to the board using a corresponding thermal pad on the
board and for proper heat conduction through the board, thermal vias must be incorporated in the PCB in
the thermal pad region.
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Rev. 4 — 10 June 2014
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PTN3393
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2-lane DisplayPort to VGA adapter IC
7. Functional description
Referring to Figure 1 “Functional diagram”, the PTN3393 converts the DisplayPort
AC-coupled high-speed differential signaling protocol into a VESA VSIS 1.2 compliant
analog VGA signaling. The PTN3393 integrates a DisplayPort receiver (according to
VESA DisplayPort v1.1a specification, Ref. 1) and a high-speed triple 8-bit video
digital-to-analog converter that supports display resolution from VGA to WUXGA (see
Table 5 “Display resolution and pixel clock rate[1]”), up to a pixel clock rate of 240 MHz.
The PTN3393 supports one or two DisplayPort v1.1a Main Link lanes operating at either
in 2.7 Gbit/s or 1.62 Gbit/s per lane. The PTN3393 can drive up to 100 feet of analog
video cable.
The DisplayPort receiver comprises the following functional blocks:
•
•
•
•
•
•
Main Link
AUX CH (Auxiliary Channel)
DPCD (DisplayPort Configuration Data)
Monitor detection
EDID handling
Video DAC
The RGB video data with corresponding synchronization references is extracted from the
main stream video data. Main stream video attribute information is also extracted. This
information is inserted once per video frame during the vertical blanking period by the
DisplayPort source. The attributes describe the main video stream format in terms of
geometry, timing, and color format. The original clock and video stream are derived from
these main link data.
The PTN3393 internal DPCD registers can be accessed by the source via the auxiliary
channel. The monitor’s DDC control bus may also be controlled via the auxiliary channel.
A bridging conversion block translates the input DisplayPort auxiliary channel signals from
the source side to the DDC signals on the sink side. The PTN3393 passes through
sink-side status change (for example, hot-plug events) to the source side, through HPD
interrupts and DPCD registers.
7.1 DisplayPort Main Link
The DisplayPort main link consists of doubly terminated, AC-coupled differential pair. The
50  internally calibrated termination resistors are integrated inside PTN3393.
The PTN3393 supports HBR at 2.7 Gbit/s and RBR at 1.62 Gbit/s per lane.
7.2 DisplayPort auxiliary channel
The AUX CH is a half-duplex, bidirectional channel between DisplayPort transmitter and
receiver. It consists of one differential pair transporting self-clocked data at 1 Mbit/s. The
PTN3393 integrates the AUX CH replier (or slave), and responds to transactions initiated
by the DisplayPort source AUX CH requester (or master).
The AUX CH uses the Manchester-II code for the self-clocked transmission of signals;
every ‘zero’ is represented by LOW-to-HIGH transition, and ‘one’ represented by
HIGH-to-LOW transition, in the middle of the bit time.
PTN3393
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PTN3393
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2-lane DisplayPort to VGA adapter IC
7.3 DPCD registers
DPCD registers that are part of the VESA DisplayPort v1.1a are described in detail in
Ref. 1. The following paragraphs only describe the specific implementation by PTN3393.
The PTN3393 DisplayPort receiver capability and status information about the link are
reported by DisplayPort Configuration Data (DPCD) registers, when a DisplayPort source
issues a read command on the AUX CH. The DisplayPort source device can also write to
the link configuration field of DPCD to configure and initialize the link. The DPCD is
DisplayPort v1.1a compliant.
It is the responsibility of the host to only issue commands within the capability of the
PTN3393 as defined in the ‘Receiver Capability Field’ in order to prevent undefined
behavior. PTN3393 specific DPCD registers are listed in Table 4.
PTN3393
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PTN3393
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2-lane DisplayPort to VGA adapter IC
7.3.1 PTN3393 specific DPCD register settings
Table 4.
DPCD
register [1]
PTN3393 specific DPCD registers
Description
Power-on
Reset value
Read/write
over AUX CH
Receiver Capability Field
0000Bh
RECEIVE_PORT1_CAP_1. ReceiverPort1 Capability_1.
00h
read only
0000Ch
I2C-bus
8Fh
read only
00h
read only
60h
read only
37h
read only
33h
read only
00504h
33h
read only
00505h
39h
read only
00506h
32h
read only
00507h
4Eh
read only
speed control capabilities bit map. The bit values in this register
are assigned to I2C-bus speeds as follows:
Bits 7:0
0000 0001b = 1 kbit/s; supported by PTN3393
0000 0010b = 3 kbit/s; supported by PTN3393
0000 0100b = 10 kbit/s; supported by PTN3393
0000 1000b = 100 kbit/s; supported by PTN3393
0001 0000b = 400 kbit/s; not supported by PTN3393
0010 0000b = 1 Mbit/s; not supported by PTN3393
0100 0000b = reserved
1000 0000b = 50 kbit/s; supported by PTN3393BS/F3
1000 0000b = reserved in PTN3393BS/F1, PTN3393BS/F2
Automated testing subfield (optional)
00218h to
0027Fh
Not supported.
Branch device-specific field
00500h
BRANCH_IEEE_OUI 7:0
Branch vendor 24-bit IEEE OUI.
NXP OUI = 00
00501h
BRANCH_IEEE_OUI 15:8
NXP OUI = 60
00502h
BRANCH_IEEE_OUI 23:16
NXP OUI = 37
00503h
ID string = 3392N2
00508h
32h
read only
00509h
Hardware revision level v1.2
12h
read only
0050Ah,
Major revision level (example: v1.38),
01h,
read only
0050Bh
Minor revision level (example: v1.38)
26h
0050Ch to
005FFh
RESERVED
[1]
read only
Byte fields that are not explicitly listed are by definition reserved (‘RES’) and their default value is 0h.
PTN3393
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PTN3393
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2-lane DisplayPort to VGA adapter IC
7.3.2 I2C over AUX CH registers
7.3.2.1
I2C-bus speed control register (read only, 0000Ch)
Bit or bits are set to indicate I2C-bus speed control capabilities.
DisplayPort source reads register 0000Ch and sets the I2C-bus speed according to the
DPCD register 00109h setting. The PTN3393 then adapts its I2C-bus bit rate to the speed
set by the DisplayPort source.
7.3.2.2
I2C-bus speed control/status register (read/write, 00109h)
Bit values in this register are assigned to I2C-bus speeds.
Prior to software writing to this register, PTN3393 defaults to the I2C-bus speed (either
50 kbit/s or 10 kbit/s) selected by the S2 pin (Table 3).
On read, the PTN3393 returns a value set to indicate the speed currently in use.
On write, software provides a mask to limit the speeds to be enabled:
• The PTN3393 uses the slowest speed enabled by the mask and the PTN3393 speed
capabilities.
• If the result of the mask with the speed capabilities is 0000 0000b, then the PTN3393
keeps the S2 setting I2C-bus speed that it is using before the software write (that is,
no change).
Some specific examples are listed below for clarification purposes:
• If the source writes 1111 1111b, the PTN3393 uses the lowest speed of 1 kbit/s.
• If the source writes 0000 1100b, the PTN3393 uses the lower of 10 kbit/s and
100 kbit/s, that is, 10 kbit/s.
• If the source writes 0011 0000b, the PTN3393 would stay using the same I2C-bus
speed that it is using before the software write (that is, no change).
For DDC communication, the PTN3393 generates defer responses to the source while the
I2C-bus transfer is taking place as specified in the DisplayPort standard v1.1a. Note that
when the I2C-bus bit rate is set to 1 kbit/s, each bit takes 1 ms. One byte including
I2C_ACK takes 9 ms. Given this, the DisplayPort source should expect over
20 I2C_DEFER’s when requesting to read a byte over I2C-bus at the slowest rate.
PTN3393
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PTN3393
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2-lane DisplayPort to VGA adapter IC
7.4 Monitor detection
The PTN3393 assumes 75  double termination, as shown in Figure 6. The load sensing
circuit of the PTN3393 senses a 37.5  or 75  termination respectively, when the
monitor is connected or disconnected. The load-sensing circuit is active during the vertical
blanking period (never during the horizontal retrace period), so that there is no
disturbance to the screen image caused by the load-sensing circuit.
Upon detection of an RGB monitor being connected, the PTN3393 dynamically updates
DPCD register 00200h and 00204h, to indicate the presence of a sink device being
connected (see Section 7.3). After updating the DPCD register 00200h, the PTN3393
generates an IRQ request on HPD.
The PTN3393 implements two different ways to handle the HPD signal. The HPD
behavior is governed by the S0 pin’s value after the reset and initialization sequence is
completed (see Figure 3).
• If S0 is tied LOW, HPD is driven HIGH irrespective of whether a VGA monitor is
detected.
• If S0 pin is tied HIGH, HPD is only driven HIGH when a monitor is detected.
S0 = LOW
S0 = HIGH
Power-up
Power-up
HPD = 0;
initialize
HPD = 0;
initialize
HPD = 1
monitor
detected?
yes
SINK_COUNT = 1
no
yes
no
SINK_COUNT = 0
monitor
detected?
SINK_COUNT = 0
HPD = 0
SINK_COUNT = 1
HPD = 1
monitor
detected
changed?
no
no
monitor
detected
changed?
yes
yes
generate IRQ_HPD pulse
002aaf365
Fig 3.
Pin S0 behavior
PTN3393
Product data sheet
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PTN3393
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2-lane DisplayPort to VGA adapter IC
7.4.1 S0 = logic 0
If S0 is left open-circuit (internal pull-down) (DisplayPort v1.1a compliant behavior),
PTN3393 behaves as stated in VESA DisplayPort v1.1a, sections 7 and 8. PTN3393 will
keep HPD LOW during its internal initialization sequence after power-up. It then updates
DPCD register SINK_COUNT to the expected value, depending if a VGA monitor is
detected or not, and then asserts HPD HIGH whatever is the value of SINK_COUNT
register. Each time PTN3393 detects a change in the VGA monitor connection status, it
updates the SINK_COUNT register accordingly, sets
DOWNSTREAM_PORT_STATUS_CHANGED register bit to 1 and generates IRQ_HPD
pulse to signal the source about the status change. Refer to Figure 3, S0 = LOW
flowchart.
7.4.2 S0 = logic 1
If S1 is tied to HIGH with external pull-up (best interoperability behavior), the PTN3393 will
keep HPD LOW during its internal initialization sequence after power-up. It then waits for
a VGA monitor to be connected downstream before asserting HPD HIGH to force source
waiting for a VGA monitor before starting protocol negotiations. If a VGA monitor is
disconnected during normal operations, PTN3393 asserts HPD LOW so that the source
considers that no sink device is connected anymore. Refer to Figure 3, S0 = HIGH
flowchart.
7.5 EDID handling
Figure 4 shows a DisplayPort-to-analog video converter (or dongle) situated between the
DisplayPort source and a VGA monitor. The PTN3393 converts a DP I2C Over AUX
request to I2C on the monitor's DDC bus. The monitor's EDID read data is then returned to
the DP source via an I2C Over AUX response issued by the PTN3393.
It is the responsibility of the source to choose only video modes which are declared in the
EDID and to adjust the DisplayPort link capabilities (link rate and lane count) to provide
the necessary video bandwidth. The PTN3393 does not cache or modify the EDID to
match the capabilities of the DisplayPort link data.
If the DisplayPort source drives display modes that are not specified in the EDID mode
list, the PTN3393 does not detect such conditions, and displays at its output what it is
presented by the DisplayPort source.
sink device
DisplayPort to VGA adapter IC
source device
DP Tx
box-to-box
DisplayPort
DP Rx
with DPCD
VIDEO DAC
box-to-box
legacy
VGA DISPLAY
WITH EDID
002aae039
Fig 4.
PTN3393
Product data sheet
DisplayPort to VGA adapter IC (dongle) sits between the DisplayPort source and a
VGA monitor with EDID
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Rev. 4 — 10 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
13 of 30
PTN3393
NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
7.6 Triple 8-bit video DACs and VGA outputs
The triple 8-bit video DACs output a 700 mV (peak-to-peak) analog video output signal
into 37.5  load, as is the case of a doubly terminated 75  cable. The DAC is capable of
supporting the maximum pixel rate supported by a two-lane DP link (240 MHz).
The PTN3393 generates the RGB video timing and synchronization signals, RGB signals
are then sent to the DACs for conversion to analog signals.
7.6.1 DAC reference resistor
An external reference resistor must be connected between pin RSET and analog ground.
This resistor sets the reference current which determines the analog output level, and is
specified as 1.2 k with a 1 % tolerance. This value allows a 0.7 V (peak-to-peak) output
into a 37.5  load, such as a double-terminated 75  coaxial cable.
8. Power-up and reset
PTN3393 has built-in power-on reset circuitry which automatically sequences the part
through reset and initialization.
For proper behavior, a capacitor should be connected from the RESET_N pin to ground to
slow down the internal reset pulse; 1 F capacitance is recommended.
Before link is established, the PTN3393 holds VSYNC and HSYNC signals LOW and
blanks the RGB signals.
While the PTN3393 performs initialization,
• The HPD signal is driven LOW, to indicate to the DisplayPort source that the
PTN3393 is not ready for link communication
• The RED, GRN, BLU and complementary outputs (RED_N, GRN_N, BLU_N) are
disabled
• The VSYNC and HSYNC outputs are driven LOW
PTN3393
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 10 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
14 of 30
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1
2
CNEG
CPOS
C15
0.01 μF
2 1
2
3
2
RSET
n.c.
GRN
VDDA33_DAC
BLU
HSYNC
VSYNC
n.c.
DDC_SDA
VDDD33_IO
L2
47 Ω at
100 MHz
1
L3
47 nH
J2
RED_RTN
n.c.
RED
GREEN_RTN
SDA
GREEN
BLUE_RTN
HS
BLUE
VDD(5V)
VS
n.c.
GND1
SCL
GND2
2
1
L4
47 nH
2
1
L5
47 nH
2
R6
1 36 Ω 2
2
1
R7
36 Ω
1
2
1
C23
3.3 pF
2
1
2
R11
1 75 Ω 2
R10
1 75 Ω 2
1
R9
1 75 Ω 2
C21
3.3 pF
6
11
1
7
12
2
8
13
3
9
14
4
10
15
5
GND3
16
17 GND4
C25
3.3 pF
2
R8
1.2 kΩ
VGA_CONN
SDA
SCL
R22
1 1.2 kΩ 2
VDD_5V
1
C29
10 pF
2
R24
1.2 kΩ
1
2
1
2
1
VDD_3V3
C33
0.1 μF
C26
1 μF
C9
10 μF
6.3 V
VDD_CONN_5V
2
1
1
C39
20 pF
C35
0.1 μF
1
3
2
2
1
2
REG710 GND
2
D1
BAT54
11
12
13
14
15
16
17
18
19
20
PTN3393
2
1
VDD_3V3
1
30
29
28
27
26
25
24
23
22
21
3
OUT
C7
2.2 μF
2 1
1
1
1
2
3
4
5
6
7
8
9
10
DIE PAD
1
R20
100 kΩ
2
R19
2 1 MΩ 1
2
C38
20 pF
RESETN
VDD_3V3
R18
2 1 MΩ 1
4
Y1
27 MHz
2
40
39
38
37
36
35
34
33
32
31
VDDA33_AUX
LDOCAP_AUX
AUX_P
AUX_N
PRX
ML0_P
ML0_N
n.c.
ML1_P
ML1_N
C18
1 2
0.1 μF
C19
1 2
0.1 μF
R17
2 1 MΩ 1
2
R16
2 1 MΩ 1
L6
47 Ω at
100 MHz
C40
2.2 μF
RST_N
CLK_O
HPD
VDDA33_DP
TCK
TDO
TMS
TRST
TDI
DDC_SCL
R5
12 kΩ
2
C37
0.01 μF
2
1
2
U2
1
1
2
S3
2
1
S2
S1
S0
VDDD33_CORE
LDOCAP_DIG
OSC_OUT
OSC_IN
n.c.
RED
1
2
1
1
C14
0.1 μF
C8
2.2 μF
1
C30
10 pF
002aah581
Fig 5.
Application diagram
PTN3393
15 of 30
© NXP Semiconductors N.V. 2014. All rights reserved.
C17
0.01 μF
1
VDD_3V3
1
C3
0.01 μF
SHDN
VDD_5V
6
5
2-lane DisplayPort to VGA adapter IC
LANE0p
GND1
LANE0n
LANE1p
GND2
LANE1n
LANE2p
GND3
LANE2n
LANE3p
GND4
LANE3n
GND_DOWN1
GND_DOWN2
AUXp
GND5
AUXn
HPD
RTN
DP_PWR
C32
10 μF
6.3 V
Rev. 4 — 10 June 2014
All information provided in this document is subject to legal disclaimers.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
DP CONN
2
VDD_3V3
C16
2.2 μF
2
1
J1
GD_C1
21
GD_C2
22
GD_C3
23
GD_C4
24
C2
2.2 μF
2
2
1
VDD_3V3
VDDA_3V3_AUX
L1
47 Ω at 100 MHz
1
2
4
IN
C4
0.01 μF
VDD_CONN_5V
NXP Semiconductors
VDD_3V3
C6
2.2 μF
9. Application design-in information
PTN3393
Product data sheet
U1
C1
0.22 μF
2 1
PTN3393
NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
9.1 Display resolution
Table 5 lists some example display resolutions and clock rates that PTN3393 supports.
(Refer to Footnote 1 on page 2.)
Table 5.
Display resolution and pixel clock rate[1]
Display
type
Active video
Total frame
VGA
640
480
800
525
24
59.94
25.175
0.76
Industry standard
SVGA
800
600
1056
628
24
60.317
40.000
1.20
VESA guidelines
XGA
1024
768
1344
806
24
60.004
65.000
1.95
VESA guidelines
XGA+
1152
864
1600
900
24
75
108.000
3.24
VESA standard
HD
1360
768
1792
795
24
60.015
85.500
2.56
VESA standard
HD/WXGA
1366
768
1792
798
24
59.79
85.501
2.57
VESA standard
HD/WXGA
1280
720
1650
750
24
60
74.250
2.23
CEA standard
WXGA
1280
800
1680
831
24
59.81
83.500
2.50
CVT
Horizontal Vertical Horizontal Vertical
total (pixel) total (line)
Bits
per
pixel
Vertical
Pixel
frequency clock
(Hz)
(MHz)
Data
Standard type
rate
(Gbit/s)
WXGA
1280
800
1696
838
24
74.934
106.500
3.19
CVT
WXGA
1280
800
1712
843
24
84.88
122.500
3.68
CVT
SXGA
1280
960
1800
1000
24
60
108.000
3.24
VESA standard
SXGA
1280
1024
1688
1066
24
60.02
108.000
3.24
VESA standard
SXGA
1280
1024
1688
1066
24
75.025
135.001
4.05
VESA standard
SXGA
1280
1024
1728
1072
24
85.024
157.500
4.72
VESA standard
SXGA+
1400
1050
1864
1089
24
59.978
121.749
3.65
CVT
WXGA+
1440
900
1904
934
24
59.887
106.499
3.19
CVT
HD+
1600
900
1800
1000
24
60
108.000
3.24
VESA standard
UXGA
1600
1200
2160
1250
24
60
162.000
4.86
VESA standard
UXGA
1600
1200
2160
1250
24
65
175.500
5.27
VESA standard
WSXGA+
1680
1050
2240
1089
24
59.954
146.249
4.39
CVT
FHD
1920
1080
2200
1125
24
60
148.500
4.46
CEA standard
WUXGA
1920
1200
2592
1245
18
59.885
193.251
4.35
CVT
WUXGA
1920
1200
2080
1235
24
59.95
154.000
4.62
CVT RB
1920
1440
2600
1500
18
60
234.000
5.27
CVT RB
QWXGA
2048
1152
2250
1200
24
60
162.000
4.86
VESA standard
QXGA
2048
1536
2144
1555
24
49.266
164.249
4.93
CVT
[1]
Contact NXP team for other monitor timings not listed in this table.
The available bandwidth over a 2-lane HBR DisplayPort v1.1a link limits pixel clock rate
support to:
• 240 MHz at 6 bpc
• 180 MHz at 8 bpc
PTN3393
Product data sheet
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Rev. 4 — 10 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PTN3393
NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
9.2 Power supply filter
All supply pins can be tied to a single 3.3 V power source. Sufficient decoupling
capacitance to ground should be connected from each VDD pin directly to ground to filter
supply noise. (Refer to Figure 5 “Application diagram”.)
9.3 DAC terminations
double-ended
termination
EMI filter
RED, GRN, BLU
DAC
75 Ω
VGA cable
PCB
RED_N, GRN_N, BLU_N
75 Ω
75 Ω
DONGLE
MONITOR
002aae044
Fig 6.
Recommended DAC terminations for PTN3393
We recommend the DAC outputs to use 75  double termination. Figure 6 shows an
example of VGA dongle application. A 75  termination is used to terminate inside the
dongle, and another 75  termination is typically used inside the RGB monitor. The load
sensing mechanism assumes this double termination.
10. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDDA
analog supply voltage
VDDD
digital supply voltage
VI
input voltage
Tstg
storage temperature
VESD
Conditions
3.3 V CMOS inputs
electrostatic discharge voltage
Min
Max
Unit
0.3
+3.8
V
0.3
+4.6
V
0.3
VDD + 0.5
V
65
+150
C
HBM
[1]
-
7000
V
CDM
[2]
-
1000
V
[1]
Human Body Model: ANSI/ESDA/JEDEC JDS-001-2012 (Revision of ANSI/ESDA/JEDEC JS-001-2011), ESDA/JEDEC Joint standard
for ESD sensitivity testing, Human Body Model - Component level; Electrostatic Discharge Association, Rome, NY, USA; JEDEC Solid
State Technology Association, Arlington, VA, USA.
[2]
Charged Device Model: JESD22-C101E December 2009 (Revision of JESD22-C101D, October 2008), standard for ESD sensitivity
testing, Charged Device Model - Component level; JEDEC Solid State Technology Association, Arlington, VA, USA.
PTN3393
Product data sheet
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Rev. 4 — 10 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
17 of 30
PTN3393
NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
11. Recommended operating conditions
Table 7.
Operating conditions
Symbol
Parameter
VDDA
Conditions
Min
Typ
Max
Unit
analog supply voltage
3.0
3.3
3.6
V
VDDD
digital supply voltage
3.0
3.3
3.6
V
VI
input voltage
3.3 V CMOS inputs
0
3.3
3.6
V
SDA and SCL inputs with respect
to ground
0
5
5.5
V
-
0
-
V
average input voltage
Rext(RSET)
external resistance on pin RSET between RSET (pin 22) and GND
-
1.2  1 %
-
k
Tamb
ambient temperature
0
-
85
C
[1]
DC value at
ML_LANE0+, ML_LANE0,
ML_LANE1+, ML_LANE1,
AUX_CH+, AUX_CH inputs
[1]
VI(AV)
commercial grade
Input signals to these pins must be AC-coupled.
12. Characteristics
12.1 Current consumption, power dissipation and thermal characteristics
Table 8.
Current consumption, power dissipation and thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IDD
supply current
normal operation,
UXGA / 162 MHz pixel clock
-
180
-
mA
IDD(stb)
standby supply current
Standby mode
-
12
-
mA
P
power dissipation
normal operation,
UXGA / 162 MHz pixel clock
-
600
-
mW
Rth(j-a)
thermal resistance from junction
to ambient
in free air for SOT619-1
-
35
-
K/W
RPU
pull-up resistance
RESET_N pin; 0 V  VI  VDD
44
66
95
k
Rpd
pull-down resistance
S0 to S3 pins; 0 V  VI  VDD
44
66
95
k
PTN3393
Product data sheet
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PTN3393
NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
12.2 DisplayPort receiver main link
Table 9.
DisplayPort receiver main link characteristics
Symbol
Min
Typ
Max
Unit
for high bit rate
(2.7 Gbit/s per lane)
[1]
-
370
-
ps
for low bit rate
(1.62 Gbit/s per lane)
[1]
-
617
-
ps
[2]
0.0
-
0.5
%
for high bit rate
[3]
120
-
-
mV
for reduced bit rate
[3]
40
-
-
mV
[4]
0.51
-
-
UI
[4][5]
0.25
-
-
UI
[4]
0.47
-
-
UI
for reduced bit rate
[4][5]
0.22
-
-
UI
tRX_EYE_m-mJT_CHP time between jitter median and for high bit rate
maximum median deviation
for reduced bit rate
(package pins)
[4]
-
-
0.265
UI
[4][5]
-
-
0.39
UI
RX DC common mode voltage
[6]
0
-
2.0
V
RX short-circuit current limit
[7]
-
-
50
mA
differential skew time
[8]
-
-
5200
ps
for high bit rate
[9]
-
-
100
ps
for reduced bit rate
[9]
-
-
300
ps
20
-
-
MHz
UI
Parameter
Conditions
unit interval
fDOWN_SPREAD
link clock down spreading
VRX_DIFFp-p
differential input peak-to-peak
voltage
tRX_EYE_CONN
tRX_EYE_CHIP
VRX_DC_CM
IRX_SHORT
tsk(dif)
receiver eye time at RX-side
connector pins
receiver eye time at RX
package pins
at RX package pins
for high bit rate
for reduced bit rate
for high bit rate
inter-pair; lane-to-lane skew
at RX package pins
lane intra-pair skew at RX
package pins;
fRX_TRACKING_BW
[10]
jitter tracking bandwidth
[1]
Range is nominal 350 ppm. DisplayPort link RX does not require local crystal for link clock generation.
[2]
Up to 0.5 % down spread is supported. Modulation frequency range of 30 kHz to 33 kHz must be supported.
[3]
Informative; refer to Figure 7 for definition of differential voltage.
[4]
tRX_EYE_m-mJT_CHP specifies the total allowable Deterministic Jitter (DJ).
[5]
1  tRX_EYE_CONN specifies the allowable Total Jitter (TJ).
[6]
Common mode voltage is equal to Vbias_RX voltage.
[7]
Total drive current of the input bias circuit when it is shorted to its ground.
[8]
Maximum skew limit between different RX lanes of a DisplayPort link.
[9]
Maximum skew limit between D+ and D of the same lane.
[10] Minimum CDR tracking bandwidth at the receiver when the input is repetition of D10.2 symbols without scrambling.
PTN3393
Product data sheet
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Rev. 4 — 10 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
19 of 30
PTN3393
NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
VD+
VDIFF_PRE
VCM
VDIFF
VD−
002aaf363
pre-emphasis = 20Log(VDIFF_PRE / VDIFF)
Fig 7.
Definitions of pre-emphasis and differential voltage
12.3 DisplayPort receiver AUX CH
Table 10.
DisplayPort receiver AUX CH characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
s
UI
unit interval
0.4
0.5
0.6
NPRECHARGE_PULSES
number of precharge pulses
[2]
10
-
16
tAUX_BUS_PARK
AUX CH bus park time
[3]
10
-
-
ns
cycle-to-cycle jitter time
transmitting device
[4]
-
-
0.04
UI
receiving device
[5]
-
-
0.05
UI
transmitting device
[6]
0.39
-
1.38
V
receiving device
[6]
0.32
-
1.36
V

tjit(cc)
VAUX_DIFFp-p
RAUX_TERM(DC)
AUX
AUX differential peak-to-peak
voltage
AUX CH termination DC resistance informative
-
100
-
VAUX_DC_CM
AUX DC common-mode voltage
[7]
0
-
2.0
V
VAUX_TURN_CM
AUX turnaround common-mode
voltage
[8]
-
-
0.4
V
IAUX_SHORT
AUX short-circuit current limit
[9]
-
-
90
mA
75
-
200
nF
CAUX
[10]
AUX AC coupling capacitor
[1]
Results in the bit rate of 1 Mbit/s including the overhead of Manchester II coding.
[2]
Each pulse is a ‘0’ in Manchester II code.
[3]
Period after the AUX CH STOP condition for which the bus is parked.
[4]
Maximum allowable UI variation within a single transaction at connector pins of a transmitting device. Equal to 24 ns maximum. The
transmitting device is a source device for a request transaction and a sink device for a reply transaction.
[5]
Maximum allowable UI variation within a single transaction at connector pins of a receiving device. Equal to 30 ns maximum. The
transmitting device is a source device for a request transaction and a sink device for a reply transaction.
[6]
VAUX_DIFFp-p = 2  VAUX+  VAUX.
[7]
Common-mode voltage is equal to Vbias_TX (or Vbias_RX) voltage.
[8]
Steady-state common-mode voltage shift between transmit and receive modes of operation.
[9]
Total drive current of the transmitter when it is shorted to its ground.
[10] The AUX CH AC coupling capacitor placed both on the DisplayPort source and sink devices.
PTN3393
Product data sheet
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Rev. 4 — 10 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
20 of 30
PTN3393
NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
12.4 HPD characteristics
Table 11.
Symbol
HPD characteristics
Parameter
Conditions
Min
Typ
Max
Unit
2
-
-
V
Output characteristics
VOH
HIGH-level output voltage
IOH = 2 mA
VOL
LOW-level output voltage
IOL = 2 mA
-
-
0.8
V
IOSH
HIGH-level short-circuit output
current
drive HIGH;
cell connected to ground
-
-
129
mA
IOSL
LOW-level short-circuit output
current
drive LOW;
cell connected to VDD
-
-
126
mA
12.5 DDC characteristics
Table 12. DDC characteristics
VCC = 4.5 V to 5.5 V.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2
-
5.5
V
Input characteristics
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
0.5
-
+0.8
V
VI(hys)
hysteresis of input voltage
0.1  VDD
-
-
V
ILI
input leakage current
-
-
1
A
VI = 5.5 V
Output characteristics
IOL
LOW-level output current
VOL = 0.4 V
3.0
-
-
mA
IO(sc)
short-circuit output current
drive LOW;
cell connected to VDD
-
-
40.0
mA
Cio
input/output capacitance
VI = 3 V or 0 V; VDD = 3.3 V
-
6
7
pF
VI = 3 V or 0 V; VDD = 0 V
-
6
7
pF
[1]
VCC is the pull-up voltage for DDC.
12.6 DAC
Table 13.
DAC characteristics
Symbol
Parameter
Min
Typ
Max
Unit
Nres(DAC)
DAC resolution
Conditions
-
-
8
bit
fclk
clock frequency
-
-
240
MHz
Io(DAC)
DAC output current variation
-
-
4
%
DAC-to-DAC
INL
integral non-linearity
1
0.5
+1
LSB
DNL
differential non-linearity
1
-
+1
LSB
Vo(DAC)
DAC output voltage
0
-
1.25
V
Co(DAC)
DAC output capacitance
-
3.5
-
pF
ct(DAC)
DAC crosstalk
-
54
-
dB
PTN3393
Product data sheet
between DAC outputs
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PTN3393
NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
12.7 HSYNC, VSYNC characteristics
Table 14.
Symbol
HSYNC and VSYNC characteristics
Parameter
Conditions
Min
Typ
Max
Unit
2
-
-
V
V
Output characteristics
VOH
HIGH-level output voltage
IOH = 8 mA
VOL
LOW-level output voltage
IOL = 8 mA
-
-
0.8
IOSH
HIGH-level short-circuit output current drive HIGH; cell connected to ground
[1]
-
-
129.0 mA
IOSL
LOW-level short-circuit output current drive LOW; cell connected to VDD
[1]
-
-
126.0 mA
[1]
The parameter values specified are simulated and absolute values.
12.8 Strap pins S[3:0]
Table 15.
Symbol
Strap pins S[3:0] characteristics
Parameter
Conditions
Min
Typ
Max
Unit
0.7  VDD
-
-
V
0.3  VDD
V
Input characteristics
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
Weak pull-down characteristics
Ipd
pull-down current
VI = VDD
25.0
50.0
95.0
A
Min
Typ
Max
Unit
0.7  VDD
-
-
V
0.3  VDD
V
12.9 JTAG and RESET_N
Table 16.
Symbol
JTAG and RESET_N characteristics
Parameter
Conditions
Input characteristics
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
Output characteristics
VOH
VOL
HIGH-level output voltage
LOW-level output voltage
PTN3393
Product data sheet
RESET_N; IOH = 4 mA
2
-
-
V
JTAG; IOH = 2 mA
2
-
-
V
RESET_N; IOL = 4 mA
-
-
0.8
V
JTAG; IOL = 2 mA
-
-
0.8
V
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2-lane DisplayPort to VGA adapter IC
13. Package outline
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PTN3393
Product data sheet
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2-lane DisplayPort to VGA adapter IC
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PTN3393
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2-lane DisplayPort to VGA adapter IC
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 9) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 17 and 18
Table 17.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 18.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 9.
PTN3393
Product data sheet
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2-lane DisplayPort to VGA adapter IC
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 9.
Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 19.
PTN3393
Product data sheet
Abbreviations
Acronym
Description
AUX CH
Auxiliary Channel
BER
Bit Error Rate
bpc
bits per color
CDM
Charged-Device Model
CMOS
Complementary Metal-Oxide Semiconductor
CVT
Coordinated Video Timings
CVT RB
CVT Reduced Blanking
DAC
Digital-to-Analog Converter
DDC
Data Display Channel
DJ
Deterministic Jitter
DP
DisplayPort (VESA)
DPCD
DisplayPort Configuration Data
ECC
Error Correction Code
EDID
Extended Display Identification Data
ESD
ElectroStatic Discharge
HBM
Human Body Model
HBR
High Bit Rate
HDCP
High-bandwidth Digital Content Protection
HPD
Hot Plug Detect
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NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
Table 19.
Abbreviations …continued
Acronym
Description
I2C-bus
Inter-Integrated Circuit bus
IEC
International Electrotechnical Commission
I/O
Input/Output
LSB
Least Significant Bit
MCCS
Monitor Control Command Set (VESA)
MSB
Most Significant Bit
QXGA
Quad eXtended Graphics Array
RBR
Reduced Bit Rate
RGB
Red/Green/Blue
SSC
Spread Spectrum Clocking
SVGA
Super Video Graphics Array
SXGA
Super eXtended Graphics Array
TJ
Total Jitter
UI
Unit Interval
UXGA
Ultra eXtended Graphics Array
VESA
Video Electronics Standards Association
VGA
Video Graphics Array
VSIS
Video Signal Interface Standard
WUXGA
Wide Ultra eXtended Graphics Array
XGA
eXtended Graphics Array
16. References
[1]
VESA DisplayPort Standard — Version 1, Revision 1a; January 11, 2008
[2]
Display Data Channel Command Interface Standard — Version 1.1;
October 29, 2004
[3]
Video Signal Standard (VSIS) — Version 1, Rev. 2; December 12, 2002
17. Revision history
Table 20.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PTN3393 v.4
20140610
Product data sheet
-
PTN3393 v.3
Modifications:
•
•
Table 5 “Display resolution and pixel clock rate[1]” updated
Table 6 “Limiting values”:
– Table note [1] updated to new ESD testing standards
– Table note [2] updated to new ESD testing standards
PTN3393 v.3
20130808
Product data sheet
-
PTN3393 v.2
PTN3393 v.2
20130422
Product data sheet
-
PTN3393 v.1
PTN3393 v.1
20130404
Product data sheet
-
-
PTN3393
Product data sheet
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2-lane DisplayPort to VGA adapter IC
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PTN3393
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 10 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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2-lane DisplayPort to VGA adapter IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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29 of 30
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NXP Semiconductors
2-lane DisplayPort to VGA adapter IC
20. Contents
1
2
2.1
2.2
2.3
2.4
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.2.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
VESA-compliant DisplayPort v1.1a converter . 1
DDC channel output . . . . . . . . . . . . . . . . . . . . . 1
Analog video output . . . . . . . . . . . . . . . . . . . . . 2
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 8
DisplayPort Main Link . . . . . . . . . . . . . . . . . . . . 8
DisplayPort auxiliary channel . . . . . . . . . . . . . . 8
DPCD registers. . . . . . . . . . . . . . . . . . . . . . . . . 9
PTN3393 specific DPCD register settings . . . 10
I2C over AUX CH registers . . . . . . . . . . . . . . . 11
I2C-bus speed control register (read only,
0000Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7.3.2.2
I2C-bus speed control/status register
(read/write, 00109h) . . . . . . . . . . . . . . . . . . . . 11
7.4
Monitor detection . . . . . . . . . . . . . . . . . . . . . . 12
7.4.1
S0 = logic 0. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.4.2
S0 = logic 1. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.5
EDID handling . . . . . . . . . . . . . . . . . . . . . . . . 13
7.6
Triple 8-bit video DACs and VGA outputs . . . 14
7.6.1
DAC reference resistor . . . . . . . . . . . . . . . . . . 14
8
Power-up and reset . . . . . . . . . . . . . . . . . . . . . 14
9
Application design-in information . . . . . . . . . 15
9.1
Display resolution . . . . . . . . . . . . . . . . . . . . . . 16
9.2
Power supply filter . . . . . . . . . . . . . . . . . . . . . 17
9.3
DAC terminations . . . . . . . . . . . . . . . . . . . . . . 17
10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17
11
Recommended operating conditions. . . . . . . 18
12
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 18
12.1
Current consumption, power dissipation and
thermal characteristics . . . . . . . . . . . . . . . . . . 18
12.2
DisplayPort receiver main link . . . . . . . . . . . . 19
12.3
DisplayPort receiver AUX CH . . . . . . . . . . . . . 20
12.4
HPD characteristics . . . . . . . . . . . . . . . . . . . . 21
12.5
DDC characteristics . . . . . . . . . . . . . . . . . . . . 21
12.6
DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
12.7
HSYNC, VSYNC characteristics. . . . . . . . . . . 22
12.8
12.9
13
14
14.1
14.2
14.3
14.4
15
16
17
18
18.1
18.2
18.3
18.4
19
20
Strap pins S[3:0]. . . . . . . . . . . . . . . . . . . . . . .
JTAG and RESET_N . . . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Soldering of SMD packages . . . . . . . . . . . . . .
Introduction to soldering. . . . . . . . . . . . . . . . .
Wave and reflow soldering. . . . . . . . . . . . . . .
Wave soldering . . . . . . . . . . . . . . . . . . . . . . .
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
References. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
22
23
24
24
24
24
25
26
27
27
28
28
28
28
29
29
30
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 June 2014
Document identifier: PTN3393